Reliable mask alignment under all conditions

Mask Alignment

SUSS Mask Aligners combine superior alignment accuracy with advanced exposure optics to meet the toughest lithography challenges. Designed for substrates up to 300 mm, they deliver stable overlay, high yield, and reliable results across diverse applications for any scale – from R&D to high-volume manufacturing.

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Precise alignment for every substrate

Mask-to-wafer and wafer-to-wafer alignment with precision optics and automation ensures stable processes and high yield.

Top products

Discover our top products

MA300 Gen3

The new generation of automated mask aligner platforms for 300 mm and 200 mm wafers designed to address the requirements of modern high-end fabs in a high-volume manufacturing environment.

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Automated

MA200 Gen3

Specially designed for high-volume production, the MA200 Gen3 mask aligner is suited for the automated processing of wafers up to 200 mm.

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Automated

MA12 Gen3

The semi-automated system for mask alignment of wafers up to 300 mm for advanced packaging, MEMS, and imprint lithography applications.

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Semi-automated

MJB4

Easy to use and compact in size: SUSS´ MJB4 represents the perfect system for laboratories and small volume production of substrates and pieces up to 100 mm.

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Automated

UV-SFT Series

Compact stamp fabrication tool for fast, precise production of high-quality working stamps for micro- and nanoimprint lithography.

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Automated

MA/BA Gen4 Series

The new platform system of SUSS’s semi-automated mask and bond aligner: the two system types MA/BA Gen4 and MA/BA Gen4 Pro differ in configuration and are engineered for standard processes or advanced and high-end processes.

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Semi-automated

SUSS Mask Alignment Systems

Key benefits

Unmatched overlay accuracy

Micron-level precision: SUSS Mask Aligners guarantee superior overlay accuracy across diverse substrates, minimizing defects and ensuring pattern fidelity. From thin to thick resists, they deliver reproducible results, setting the benchmark for advanced packaging, MEMS, optics, and more.

Rapid processing

Higher throughput, faster results: with optimized optics and smart automation, the Mask Alignment systems cut cycle times and streamline workflows, enabling fast, reliable processing even of complex substrates.

Scalable flexibility

Adapt quickly to evolving demands, new materials, applications, or production volumes: with modular configurations, optional functionalities and seamless transfer due to your production needs, our Mask Alignment systems ensure consistent performance and future-ready lithography solutions.

Integrated metrology for precise pre-alignment

The integrated metrology ensures reliable wafer prealignment and notch detection under all conditions. With advanced image processing and adaptable illumination, the module secures accuracy, stability, and consistent process results.