MA/BA Gen4-Serie Mask- und Bond-Aligner

Compact Aligner Platform for Research and Low-Volume Production

The MA/BA Gen4 series represents the latest generation of SUSS MicroTec’s semi-automated mask and bond aligner and introduces a new platform system. The two platform types differ in configuration, and consist of the MA/BA Gen4 for standard processes and the MA/BA Gen4 Pro series dedicated to advanced and high-end processes.

The MA/BA Gen4 series is the entry-level model, available as MA/BA6 Gen4 and MA/BA8 Gen4. With its enhanced ergonomic and user-friendly design, cost efficiency and reduced footprint, it is the perfect tool for use in research and low-volume production.

SUSS MicroTec’s MA/BA Gen4 series is setting a new benchmark in full-field lithography for academia, MEMS & NEMS, 3D integration and compound semiconductor markets. It is also prepared to handle processes like bond alignment, fusion bonding and SMILE imprinting.

Processes developed on the MA/BA Gen4 series can be quickly transferred onto SUSS MicroTec‘s automated mask alignment platforms for high-volume production.

Highlights

  • Outstanding process results
  • High user friendliness
  • Low cost of ownership
  • Enhanced ergonomics
  • Small footprint
  • Face-to-face microscopes
MA/BA Gen4-Serie Mask- und Bond-Aligner

Ideal process results through precision

The MA/BA Gen4 series’ high degree of automation enables outstanding process results. Functions such as constant dose mode, an automated control unit for exposure time as well as auto alignment all help optimize process parameters. Additionally equipped with the high-grade MO Exposure Optics system, the MA/BA Gen4 series provides ideal exposure conditions and thus achieves top results. Sophisticated mechanical workings ensure high adjustment precision: a special design of the top- and bottom-side microscope unit (TSA and BSA) eliminates the long travel of the TSA microscope and the disturbing vibrations.

High operating comfort

Functions such as a highly ergonomic recipe editor and the sophisticated data logging or the ability to assign user rights simplify the operator’s work and simultaneously minimize sources of errors. The MA/BA Gen4 platform also makes use of high-grade digital microscopes and cameras, which significantly simplify the adjustment process thanks to enhanced image quality and an enlarged field of view on the monitor.

Work safety and environmental protection

The MA/BA Gen4 series can optionally be equipped with an energy-efficient LED light source, which not only reduces operating and maintenance costs, but improves work safety and environmental protection as well. This eliminates expensive hazardous waste disposal for mercury lamps. The machine offers further security features, such as UV radiation protection, safety interlocks and trap protection, thus fulfilling strict safety requirements.

Cost effectiveness

A major factor for the attractive cost of ownership of the MA/BA Gen4 series is that it has a small footprint and still offers a wide variety of processes. This includes operating and maintenance expenses, which can be reduced by such means as using an optional energy-efficient LED light source. The highly robust design, easy accessibility of operating elements and replaceable parts as well as the use of the LED light source and SUSS MicroTec’s MO Exposure Optics reduce maintenance expenses for the MA/BA Gen4 platform. Remote-controlled access to the machine can also be used to detect and rectify sources of errors in a cost-effective manner.

Additional functions such as wafer-to-wafer adjustment, fusion bonding and imprint lithography can be added as optional upgrades.

Details : Alignment

  • Top-side alignment (TSA)
  • Bottom-side alignment (BSA)
  • Infrared alignment (IR)
  • DirectAlign®

Details : Exposure

  • Proximity Lithography
  • Soft Contact Exposure
  • Hard Contact Exposure
  • Vacuum Contact Exposure
  • UV-LED light source

Details : Exposure Optics

  • MO Exposure Optics®
  • Diffraction-Reducing Optics

Details : Automation

  • Auto Alignment
  • Wedge Error Compensation (WEC)

Details

    Exposure

    • Lab Simulation Software
    • Source Mask Optimization

    Nanoimprint Lithography

    • Imprint Lithography
    • SMILE
    • Stamp Fabrication

    Bonding

    • UV Bonding
    • Bond Alignment
    • Fusion