Transparency is important to us. In our News section you´ll find all recent news and publications around SUSS MicroTec. Our aim is to keep you informed.
Polyimide based Temporary Wafer Bonding Technology for High Temperature Compliant TSV Backside Processing and Thin Device Handling
Temporary Bonding and Debonding - An Overview of Today‘s Materials and Methods
LED Wafer Level Packaging – Motivation, Challenges and Solutions to Meet Future Cost Targets