- マニュアル 手動機
- 全自動搬送 プロダクション装置
SUSS MicroTec’s Manual Coating System (MSC8) offers the latest generation of coating and aqueous developing techniques in a unique cluster configuration. It is designed and assembled to provide the greatest variety of functionalities on the smallest cleanroom footprint. Technologies which have proven themselves in SUSS MicroTec high-volume production tools are thus accessible to laboratories, start-ups and for small-scale production through the MCS8.
Smallest cleanroom footprint
Wide range of options down to module level
Flexible configuration with over 500 possibilities
One supply and one waste management system
Proven technology in SUSS HVM tools
The MCS8 consists of customizable frames for two individual modules. Customers select these two modules according to their individual requirements from the wide range of SUSS MicroTec’s manual and semi-automated coater and aqueous developer tools. These options include SUSS LabSpin8, SUSS Hot Plate, SUSS Vapor Primer or the actively chilled SUSS Cool Plate. The two individual modules are placed one behind the other. This allows optimal use of cleanroom space. For best operator ergonomics, the rear module is raised in height.
All modules can be equipped with optional functions such as automatic dispense systems for LabSpins or proximity-pins for Hot Plates. The MCS8 LabCluster is available as an array of up to six of these customizable frames including two modules each. This enables the combination up to twelve modules in total, thus offering a complete process solution. By adding advanced coating and developing technology to the cluster through up to two tools such as RCD8 or AS8, the MCS8 allows for a broad spectrum of applications for MEMS, III-V, electron beam lithography, temporary bonding, nano imprinting, microfluidics and micro-optics. Customers can equip the MCS8 platform in a wide range of configurations based on SUSS MicroTec’s experiences for maximum benefit.
The Vapor Primer prepares the wafer surface to improve the surface condition for optimal resist adhesion.
The actively chilled, recipe-based Cool Plate offers a closed cooling chamber preventing contamination on the wafer.