ASx Series

SUSS MicroTec の ASx シリーズは、250 nm ～ 90 nm のテクノロジーノードとフォトマスク加工に最新のベーク、現像、洗浄のメソッドを提供します。信頼性、安定性、そして高性能によって、本プラットフォームは、248 nm- 193 nm領域のリソグラフィープロセスでの欠陥のないフォトマスクの加工における要件に応えます。

Highlights

フォトマスクの耐用年数に効果をもたらす最高の洗浄結果を1回目で得ることができます。

小さな設置面  (1200 x 1200 mm）と低いCOO

高い信頼性と稼働率

More than 250 ASx Sold

State of the Art Advanced Bake - Qualified down to 14 nm Node and beyond

Advanced Single Substrate Cleaner ASC 5500

The ASX ensures 100% soft defect removal, careful PSM cleaning and minimal residual ions during critical cleaning stages:

  • Resist strip and pre-clean
  • Final clean
  • Pellicle adhesive cleaning
  • Backside cleaning of pellicallized masks

Multiple Technologies

  • Dual megasonic cleaning
  • High pressure Fulljet cleaning
  • Brush cleaning
  • In-situ SC1, in-Situ SPM, 172nm UV dry cleaning, ultra-clean hot DI rinse
  • Backside rinse nozzles
  • Re-ionization of DI water by CO2 or NH4OH
  • ESD-safe cleaning
  • Binary and phase shift masks
  • Photomasks and other square substrates up to 9”
  • Round substrates (wafers or imprint masks) up to 300mm

Product Highlights

  • Minimal phase and transmission change
  • Low residual ion concentrations avoiding haze
  • Monitoring PoU media parameters
  • Fully automated, including SMIF load / unload

In Line with the Industry

  • SEMI S2, S8, S13 compliant
  • CE marked
  • Conform to European harmonized standards and machine directive 2006/42/EC, EMC directive 2004/108/EC and low voltage directive 2006/95/EC
  • DIN ISO 14.644 class 3 controlled environment
  • Ready for factory automation via SECS/GEM 200 mm standard interface
Post-Exposure Bake System APB9500

Superior Performance

State-of-the-art fully automated mask bake and chill system, valuable to different applications like

  • Post-exposure bake
  • Post-coat bake of phase shift masks and mask blanks
  • Chilling
     
  • Precision uniform bake by 25 independently controlled zones in one hot plate
  • Measurement of uniformity by sensor array mask with 25 sensors
  • Bake temperature up to 220° C (typical 90 to 130° C)
  • Precision cool plate for chilling
  • Combined hot plate - cool plate stack
  • Up to 2 hot plates and cool plates stacks in one APB9500 for highest process flexibility and throughput requirements
  • SEMI S2, S8, S13 compliant
  • CE marked
  • Conform to European harmonized standards and machinery directive 2006/42/EC, EMC directive 2014/30/EC and low voltage directive 2014/35/EC
  • DIN ISO 14.644 class 3 controlled environment
  • Ready for factory automation via SECS/GEM 200 und 300 mm standard interface
  • Bake self-optimization SW procedure
  • CD uniformity optimization by profile bake
  • Mirror bake functionality
  • Storage for temperature sensor masks in each stack
  • Can be clustered to E-beam writers or Developer (ASP) very easily
  • Small footprint
Develop System ASP5500
  • Lowest impact developing by A+ Nozzle with continuous media distribution over the whole mask
  • Active degassing of the developer prevents micro-bubbles for low defect counts
  • Clustered equipment with APB for PEB
  • Efficient chemical filtration (amines/acids) and precise temperature and humidity control
  • Fully automated including SMIF load / unload
  • Enhanced process control and monitoring features
  • To be combined with Post-Exposure-Bake-System APB9500 for optimum results
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