Permanent bonding solutions

XBC300 Gen2 SP Surface Preparation Cluster

The XBC300 Gen2 SP is a dedicated surface preparation platform specifically engineered for Wafer-to-Wafer (W2W) as well as sequential and collective Die-to-Wafer (D2W) hybrid bonding applications, delivering exceptional process stability and cleanliness levels compliant with front-end-of-line (FEOL) standards.

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State-of-the-art surface preparation for the most demanding bonding processes

the XBC300 Gen2 SP provides a flexible and scalable approach for both high-volume manufacturing and R&D environments, enabling customers to integrate best-in-class surface preparation into their existing hybrid bonding ecosystems.

Compact footprint

With its compact and low footprint, the XBC300 Gen2 SP needs up less space than comparable system, unlocking cleanroom capacity with in less space neeeded. In that small footprint SUSS offers production-level automation: up to 2 fully automatic FOUP load ports with cassette adapter options, 2 tape-frame cassette stations, and a 6-axis robot to cut manual handling and stabilize throughput. Special handlers (e.g., for warped wafers) are available on request to protect yield on demanding substrates.

Best-in-class cleaning modules

Our aqueous cleaner modules for full wafers and tape-frames offer various dispense system options including megasonic. The modules also allow for optional backside rinse and N₂-assisted spindrying. Diluted cleaning chemistry such as NH₄OH or citric acid is possible in the basic configuration. Organic removal functionality using e.g. SC1 oder TMAH is available on request.

Unmatched surface activation

The plasma module is designed for reliable surface preparation in fusion bonding. Its vacuum plasma chamber activates wafer surfaces effectively to build high surface energy and support high bond-strength fusion bonds.

Integrated In-Situ Metrology

Equipped with a high-precision, throughput-optimized metrology station, the XBC300 Gen2 SP enables in-line verification of alignment accuracy for wafer-to-wafer and die-to-wafer bonds throughout all process steps. The metrology module supports full-field IR overlay measurement and IR void inspection, with a void detection resolution above 500 µm.

Surface preparation for global production and R&D

Key Features of XBC300 Gen2 SP

Designed as a pure surface preparation solution without an integrated bonding module, the system enables seamless compatibility with a wide range of stand-alone D2W bonders. Leveraging SUSS’s expertise in wet processing technologies, the XBC300 Gen2 SP provides a flexible and scalable approach for both high-volume manufacturing and R&D environments, enabling customers to integrate best-in-class surface preparation into their existing hybrid bonding ecosystems.

In-line IR void detection

XBC300 Gen2 SP is purpose-built for surface preparation in hybrid bonding: it performs in-line IR void detection (infrared inspection) to make bonding-interface defects visible before they propagate into bond, anneal, and downstream value-add steps. With automatic classification of voids >500 µm, our customers set clear pass, rework and hold decisions at the point of control, strengthen SPC, and accelerate root-cause isolation to scale yield and bond reliability across W2W and D2W flows.

High-performance aqueous cleaner

XBC300 Gen2 SP combines a controlled back-side rinse with N₂-assisted spin-dry to remove residues efficiently and deliver a consistently dry surface. The module supports SC1 chemistry compatibility and citric acid capability for targeted contaminent residue management.

Plasma activation

The XBC300 Gen2 SP offers highest process flexibility and repeatability for plasma based wafer surface activation. Various process gases such as Ar, O₂, N₂ etc. can be used and are controlled via mass flow controllers (MFCs). It allows for full CMOS compatibility and can also be used for plasma cleaning of polymer residues. The vacuum plasma chamber is designed for both target wafer and tape-frame processing.