Advanced wafer cleaning technology for eco-friendly production

GreenTec Solutions

GreenTec Solutions combine sustainable, eco-friendly cleaning methods, modular flexibility, and in-situ UV technology to support demanding wafer-cleaning and surface-activation processes. With application-tailored green fluids, the CrustBuster in-situ UV module, and a hybrid process approach, GreenTec Solutions help reduce fab complexity while supporting reliable, KPI-driven production.

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Sustainable wafer cleaning for mid- to backend applications

One platform. Hybrid approaches. SUSS GreenTec Solutions combine single-wafer and batch process capabilities with in-tool surface activation, enabling a broad range of process flows within one system.

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GT200

The GT200 is a dedicated low-volume manufacturing solution for sustainable semiconductor cleaning and stripping processes. Discover now ➤

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Semi-automated

Hybrid process approach

The combination of cleaning technologies and process modules supports different residue profiles and surface requirements within one platform. This enables broader application coverage without relying on multiple standalone tools.

One configurable platform

Single-wafer processing, batch cleaning, and surface activation can be combined within one configurable system. This reduces transfers, interfaces, and recipe fragmentation while supporting a more streamlined fab setup.

Designed for serviceability

Accessible system architecture, modular units, and clearly defined maintenance procedures support efficient servicing. A structured service strategy alongside our solutions helps reduce maintenance effort and minimize unplanned downtime.

Application-tailored Green Fluids

Green Fluids are selected and developed with the application in mind. Together with customers, we align fluid concepts with process requirements, material compatibility, and defined performance criteria.

Application coverage

GreenTec uses patented in-situ UV technology for the removal of organic residues and the activation of wafer surfaces directly inside the tool. This supports chemical-lean process concepts and can improve process integration for subsequent cleaning, coating, or bonding steps.

High Quality Final Clean

The platforms support high-quality final cleaning with strong particle removal, feature preservation, and controlled material interaction. Process validation can be aligned with customer-specific particle metrology and structure-integrity criteria.

Photoresist Removal

GreenTec Solutions supports photoresist removal across a broad range of resist types. Stable stripping performance, controlled media usage, and KPI-based process evaluation help make cycle time and process quality more predictable.