Sustainable wafer cleaning with hybrid approach

GT200

The GT200 is an eco-friendly manufacturing solution dedicated to wafer cleaning and stripping processes. From photoresist removal and surface activation to high-quality final cleaning, GreenTec Solutions brings complementary process capabilities together in one configurable platform. By consolidating these capabilities, the GT200 helps reduce tool fragmentation, simplify process flows, and establish a more consistent foundation for efficient and reliable production.

Talk to an expert

Dedicated wafer cleaning platform built on proven photomask processing expertise

Eliminate the need for hazardous substances by combining greener process media with SUSS hybrid stripping approaches.

Lower your EHS Exposure

GT200 reduces the use of hazardous substances by enabling greener process media and alternative stripping approaches. This helps lower EHS exposure, simplifies waste handling, and supports internal sustainability targets while maintaining reliable cleaning performance

Reduced process complexity

By consolidating several cleaning and stripping steps into one flexible tool concept, the GT200 reduces wafer transfers and toolset complexity. This supports more stable process flows, fewer interfaces, and improved operational efficiency across the line.

Faster learning cycles

Designed for low-volume manufacturing, the GT200 enables controlled experimentation, process tuning, and recipe development. Together with SUSS process expertise, customers can shorten adoption time and move faster from evaluation to stable production.

Lower cost of ownership

SUSS GT200 supports TCO reduction by lowering chemistry consumption, reducing hazardous waste, and simplifying safety and abatement requirements. Efficient media use and modular process integration help fabs manage resources more effectively.

Scalable process transfer

A modular platform concept and joint evaluation approach support the transfer of process know-how from pilot lines and qualification into high-volume manufacturing. This enables customers to build confidence early and scale with a consistent process strategy.

Benchmark for sustainable cleaning performance

Key Features of the GT200

Advanced green cleaning and stripping technologies designed to reduce chemical impact, improve process control, and support reliable manufacturing.

TurbulenStrip technology

TurbulenStrip uses a dynamic single-wafer wet process with a strip in soak bath and exclusive green fluids. The locally turbulent flow creates high forces at the substrate surface, supporting efficient resist, polymer, descum, and post-etch cleaning while reducing cross-contamination, all while safing half consumption and dispol compared to DMSO.

CrustBuster UV residue removal

CrustBuster applies SUSS patented insitu-UV technology to break down organic materials directly at the substrate surface. This hybrid approach enables stripping with significantly reduced chemical use and supports gentle processing for sensitive structures and sustainable manufacturing goals.

Spinse-Rinse-Dry for efficient final cleaning performance

The GT200 supports up to 200 mm wafers with up to 45 wafers per hour and a particle removal efficiency of 99 % for particles >100 nm. Its compact footprint and modular configuration make it suitable for controlled learning, qualification, and low-volume production.