Meet SUSS MicroTec at ASPS 2025 in Suwon, South Korea!

We are pleased to announce that SUSS will be present at the Advanced Semiconductor Packaging & Chiplet Show (ASPS) 2025, taking place from August 27–29, 2025, at the Suwon Convention Center, South Korea.

ASPS 2025 is a leading international exhibition focused on the latest innovations in semiconductor packaging, including chiplet integration, hybrid bonding, and advanced materials and equipment. The event brings together key players from across the semiconductor ecosystem—IDMs, OSATs, AI & ICT companies, and automotive and electronics manufacturers—for three days of networking, knowledge sharing, and technology exploration.

Our team will be on-site and available for meetings. We look forward to engaging with industry professionals, discussing your challenges, and exploring how our advanced lithography and packaging solutions can support your next-generation applications.

Interested in connecting with us during the show?

Feel free to reach out to schedule a meeting—we’d love to hear from you!