The universal XBS200 platform allows for aligned wafer bonding of wafer sizes up to 200 mm. Its versatility and modular design offer maximum process flexibility in all permanent bonding tasks. A novel aligned wafer transfer method eliminates the complexity of traditional systems and offers consistent process results with excellent system availability. The XBS200 platform offers low cost of ownership for high-volume production of MEMS, LED and 3D advanced packaging.
Submicron alignment accuracy
Integrated metrology option
Unique laser pre-bond option
High process repeatability
Low cost of ownership
The XBS200 handles single wafers as well as aligned- and bonded wafer pairs by making use of a novel aligned wafer transfer method. It offers wafer cassette stations with integrated mapping and a camera-based optical pre-aligner with optional ID readers. An optional camera system allows to monitor and record the inside of the machine. A cyclic scheduling algorithm with automated throughput optimization ensures consistent timing of all processes and continuous run capability.
The XBA bond aligner delivers consistent submicron alignment accuracy for transparent or non-transparent wafers by using our proprietary inter-substrate-alignment (ISA) technology. Built-in fixed reference, global calibration and overlay verification ensure optimum repeatability. Global calibration wafers are an integral part of the system and make automated calibration and overlay verification simple and quick.
The XBA offers the option as novel functionality to locally bond a wafer pair via laser pre-bonding after alignment and before transferring it into the bond chamber. This helps to literally freeze the achieved alignment accuracy of the bond aligner.
The XB200 bond chamber is the process module version of the stand-alone XB8 bonder. It offers a wide parameter window and is therefore ideal for any thermo-compression bonding processes. Bond force options include a 60 kN and a 100 kN version and a temperature range of up to 550 °C is available. Reproducible process results from wafer to wafer achieve a consistently high product quality.
The capacitively coupled plasma offers highest process flexibility and repeatability for plasma-based wafer surface activation. Various process gases such as Ar, O2, N2 etc. can be used and are controlled via (mass flow controllers (MFCs). The gate-valve loading PL200 allows for full CMOS compatibility and can also be used for plasma cleaning of polymer residues.
The AC200 aqueous cleaner module offers various dispense system options including megasonic. The module also allows for optional backside rinse and N2 assisted spin-drying. Diluted cleaning chemistry such as NH4OH (<2%) is available in the basic configuration. Organic removal functionality using SC1 is available on request.
Integrated in-situ metrology functionality allows for fast process feedback. The MM200 therefore is the key for increased process control and yield improvement. The module can be configured for full-field IR void inspection and/or IR overlay measurement including multi-site capability with high throughput. The module offers in-line process control and provides closed-loop feedback to optimize the alignment results. The MM200 does not occupy a process module space.