The modular system of ACS300 Gen3 is specifically designed for demanding high-volume production environments. It provides sophisticated coating, developing and baking functionalities that can be easily adapted to various processes. Maximum process control effectively supports the wide field of use. This, together with the smallest footprint on the market for a system with eight spinner modules, all qualities positively affecting cost-of-ownership, make the tool indispensable for any challenging advanced packaging application such as wafer-level chip-scale packaging, fan-out wafer-level packaging, copper pillar flip-chip packaging and 3D packaging.
Efficient chemical handling
Flexible process configuration
High throughput capabilities
Stable process results
One tool for all advanced packaging applications
By offering multiple process technologies such as photo resist, polyimide and PBO coating within one system, the ACS300 Gen3 delivers high efficiency. It also provides capabilities for up to five resist or four develop chemistries per module for optimal process flexibility. Moreover, the universal hotplate design eliminates the need for specific hotplates for different resist or PI types. The ACS300 Gen3 allows for simultaneous 200 and 300 mm wafer processing without mechanical changeover.
Attractive cost of ownership
The ACS300 Gen3 allows for efficient module stacking, thus saving costly space in the cleanroom. Up to twelve modules can be conveniently arranged on top of one another in a three-level modular system while the tool’s multiple chemical-saving features achieve further savings. Whether SUSS MicroTec’s proprietary GYRSET technology, a novel dispense technique or a chemical recirculation system - the tool uses chemicals economically and works in line with even the most rigid sustainability standards.
Excelling at throughput
When using the optional second robot system the ACS300 Gen3 reaches throughput rates up to 240 wph in a three-step process. An advanced process control system optimizes processing time: scheduling algorithms can be selectively swapped to ensure that time slots of bottleneck steps are fully utilized. Furthermore, features such as developer chemicals at elevated temperatures and flow modes reduce process times.
Consistent process monitoring leading to high yield
What makes the ACS300 Gen3 stand out is its high degree of process control. It is possible to continuously log process data for all relevant parameters such as temperature, flow, pressure, volume, purge rates, etc.. Data logging allows for precisely tuned process parameters, repeatable results and quick identification of potential weak points. Processes become more stable and repeatable, and yield can be significantly increased.
在旋涂法中旋转衬底被均匀地涂以溶液。 溶液，如光致抗蚀剂，通常分注在晶圆中心。 .然后加速度、最终转速和各步骤的持续时间使得涂料的一部分经离心分离形成厚度均匀的膜。 除了工艺参数外，溶液或光致抗蚀剂的物理性质决定了膜的厚度。
SUSS MicroTec 的 GYRSET 专利技术具有显著的优势。 GYRSET的原理是，工作室在涂胶过程中同步旋转，从而有效降低了旋转衬底上方的空气湍流。 在封闭的腔室中空气比通常用溶剂时更快速地饱和，使涂层缓慢干燥，从而更均匀地分布在衬底上。 这大大减少了材料的用量。
在此工艺中，一定量的显影剂被滴在曝光后的衬底上，并通过适度的旋转分散开。 显影液因其表面张力在晶圆上形成凸状的液面（“Puddle”）。 当显影时间结束后，通过提高旋转速度甩干晶圆上的显影液。 然后，用去离子水冲洗晶圆并同样提高转速甩干。 这种方法的优点是，只需使用少量显影液，就能提供优异的显影结果。
浸置式显影法不得用于显影液达到饱和时，例如当必须除去大量显影后的光刻胶时或者凹凸图形阻碍了更换显影液时。 在这些情况下，需多步使用浸置式显影或者使用喷涂式显影 。