ACS300 Gen3 Coater & Developer

Powerful Solution for Advanced Packaging Applications

The modular system of ACS300 Gen3 is specifically designed for demanding high-volume production environments. It provides sophisticated coating, developing and baking functionalities that can be easily adapted to various processes. Maximum process control effectively supports the wide field of use. This, together with the smallest footprint on the market for a system with eight spinner modules, all qualities positively affecting cost-of-ownership, make the tool indispensable for any challenging advanced packaging application such as wafer-level chip-scale packaging, fan-out wafer-level packaging, copper pillar flip-chip packaging and 3D packaging.

Highlights

Small footprint

Efficient chemical handling

Flexible process configuration

High throughput capabilities

Stable process results

SUSS MicroTec Coater ACS300 Gen3

One tool for all advanced packaging applications

By offering multiple process technologies such as photo resist, polyimide and PBO coating within one system, the ACS300 Gen3 delivers high efficiency. It also provides capabilities for up to five resist or four develop chemistries per module for optimal process flexibility. Moreover, the universal hotplate design eliminates the need for specific hotplates for different resist or PI types. The ACS300 Gen3 allows for simultaneous 200 and 300 mm wafer processing without mechanical changeover.

Attractive cost of ownership

The ACS300 Gen3 allows for efficient module stacking, thus saving costly space in the cleanroom. Up to twelve modules can be conveniently arranged on top of one another in a three-level modular system while the tool’s multiple chemical-saving features achieve further savings. Whether SUSS MicroTec’s proprietary GYRSET technology, a novel dispense technique or a chemical recirculation system - the tool uses chemicals economically and works in line with even the most rigid sustainability standards.

Excelling at throughput

When using the optional second robot system the ACS300 Gen3 reaches throughput rates up to 240 wph in a three-step process. An advanced process control system optimizes processing time: scheduling algorithms can be selectively swapped to ensure that time slots of bottleneck steps are fully utilized. Furthermore, features such as developer chemicals at elevated temperatures and flow modes reduce process times.

Consistent process monitoring leading to high yield

What makes the ACS300 Gen3 stand out is its high degree of process control. It is possible to continuously log process data for all relevant parameters such as temperature, flow, pressure, volume, purge rates, etc.. Data logging allows for precisely tuned process parameters, repeatable results and quick identification of potential weak points. Processes become more stable and repeatable, and yield can be significantly increased.

Details: Coating

在旋涂法中旋转衬底被均匀地涂以溶液。 溶液,如光致抗蚀剂,通常分注在晶圆中心。 .然后加速度、最终转速和各步骤的持续时间使得涂料的一部分经离心分离形成厚度均匀的膜。 除了工艺参数外,溶液或光致抗蚀剂的物理性质决定了膜的厚度。

SUSS MicroTec 的 GYRSET 专利技术具有显著的优势。 GYRSET的原理是,工作室在涂胶过程中同步旋转,从而有效降低了旋转衬底上方的空气湍流。 在封闭的腔室中空气比通常用溶剂时更快速地饱和,使涂层缓慢干燥,从而更均匀地分布在衬底上。 这大大减少了材料的用量。

旋涂法不适用于有凹凸图形的结构。

我们的客户可以从中得到以下好处

  • 旋涂法是一种简单而应用广泛的方法
  • 通过 GYRSET 专利涂胶技术减少材料消耗并降低成本

选项:

全自动

半自动及手动

在此工艺中,一定量的显影剂被滴在曝光后的衬底上,并通过适度的旋转分散开。 显影液因其表面张力在晶圆上形成凸状的液面(“Puddle”)。 当显影时间结束后,通过提高旋转速度甩干晶圆上的显影液。 然后,用去离子水冲洗晶圆并同样提高转速甩干。 这种方法的优点是,只需使用少量显影液,就能提供优异的显影结果。

浸置式显影法不得用于显影液达到饱和时,例如当必须除去大量显影后的光刻胶时或者凹凸图形阻碍了更换显影液时。 在这些情况下,需多步使用浸置式显影或者使用喷涂式显影 。

我们的客户可以从中得到以下好处

  • 化学品用量降低

选项:

全自动

半自动及手动

在喷涂式显影中以较低的速度旋转待显影的衬底。 一个喷嘴不断向曝光区域喷洒新鲜的显影液,以防止显影剂饱和。 与浸置式显影相比这种方法的优势是,可用于较厚的光刻胶以及大面积显影。 用去离子水冲洗,随后甩干,完成整个显影过程。

我们的客户可以从中得到以下好处

  • 对整个晶圆均匀显影,即使在光刻胶较厚的情况下。

选项:

全自动

半自动及手动

光刻胶旋涂过程中,GYRSET旋转盖板原理能够在衬底上方实现独特的无湍流饱和溶剂的环境,因此可显著减少环境温度和湿度对工艺结果的影响。由于材料保持湿润状态的时间延长了,该材料表面能保持较高的浸润性,使涂覆晶圆材料的用量大大减少。

GYRSET旋转盖板技术是基于:

  • 开盖滴胶
  • 闭盖涂胶

选项:

全自动

半自动

 

Smart control of dispense systems.

选项:

全自动

Optimal and complete use of chemicals.

选项:

全自动

Intelligent scheduling algorithms: Improve yield by avoiding bottlenecks.

选项:

全自动

对准和曝光前小心拉平弯曲或起拱晶圆。由于有众多影响参数,经过优化设计的工具能够适应各种衬底。

选项:

全自动

技术文件

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