Waferbond

At Waferbond 2025, SUSS MicroTec will present wafer bonding solutions that define the next era of semiconductor manufacturing. Our focus is on precision, process stability, and scalability – key factors for applications ranging from MEMS and power devices to advanced 3D integration.

Through expert insights, we show how our bonding platforms integrate seamlessly into both R&D and high-volume production environments.

Joining us at Waferbond 2025 means more than exploring technology. It is an invitation to exchange ideas, build trust, and shape solutions together.