BA8 Gen4 Pro Bond Aligner

Highest precision bond alignment

The fourth generation of the semi-automated bond aligner platform BA8 is designed for high-precision alignment and subsequent reliable bonding of wafers and substrates up to 200 mm. Thanks to its high level of automation, the BA8 Gen4 Pro is well suited not only for research and development environments, but also for pilot or small series production. It supports demanding processes in the field of MEMS, advanced packaging as well as growth markets such as 3D integration.

亮点

High alignment accuracy

Mostly operator independent with auto alignment

High process repeatability

Easy system expansion

Selective or full-field plasma optional

SUSS MicroTec Wafer Bonder BA8 Gen4

The alignment of two wafers in the bond aligner is based on the same high-performance technology which has proven itself in the SUSS MicroTec mask aligners for aligning masks to wafers. The functionality of the BA8 Gen4 Pro is extended by fusion bond technology with silicon substrates being bonded in the aligner. The SUSS MicroTec manual wafer bonder SB6/8 Gen2 offers a selection of further bond processes. A special fixture system ensures the safe transfer of the wafer package from one platform to the next.

Specialized tooling for selective or full-field plasma activation additionally supports fusion bonding at low temperatures.

The process requirements determine whether the BA8 Gen4 Pro is configured as a manual or semi-automated system. Equipped as semi-automated tool with auto alignment, the user-friendly recipe editor and automatic axial positioning, the BA8 Gen4 Pro achieves high process repeatability and is therefore also suited for throughput-critical production processes. Manual operation permits the operator to utilize the device flexibly in a wide range of processes. A broad spectrum of process requirements can be met with a selection of alignment technologies. 

Details: Alignment Technology

在光刻工艺中,只需对准器件晶圆同侧的结构(例如再布线层、微凸点 等),用顶部对准功能将掩模位置标记对准晶圆位置标记。  根据衬底的特性,这可以用存储的晶圆位置数据或者用两个现场照片 、SUSS MicroTec 开发的DirectAlign™ 直接对准技术实现。 

我们的客户可以从中得到以下好处

  • 掩模对准器极高的对准精度
  • 清晰、强大的图像识别功能,即使在对比度不理想的情况下

应用微电子机械系统(MEMS)、圆晶级封装和三维集成的工艺,例如在接板上制造垂直通孔 (TSV),需要与正面结构对准的晶圆背面结构。 此时常使用光学背面对准。 集成摄像机系统采集掩模结构和晶片背面结构并将它们相互对准。 由于晶圆在装载掩模靶后被覆盖,必须预先确定并存储其位置。 这对整个对准系统提出了特殊的要求。

我们的客户可以从中得到以下好处

  • SUSS 掩模对准器凭借其极高的机械精度和稳定性带来无与伦比的准确性

多层晶圆堆叠被应用在许多构造工艺中。 用红外照射可以识别并对准通常埋在层之间的对准标记。

红外光还可以根据这些埋入的标记进行对准。  这需要使用能透过红外线的材料,例如硅、III-V族半导体(如砷化镓)以及临时键合和键合分离工艺中所使用的粘着剂  通过个例研究检查可行性。

为了尽可能扩大红外对准的使用范围,SUSS 掩模对准器可以选配强大的红外光源和高性能摄像系统。

我们的客户可以从中得到以下好处

  • 强大的红外光源和高性能摄像系统

热键合是指两个平面基板自发粘合。 该工艺包括冲洗抛光盘,使其具备高度亲水性,然后使其相互接触并在高温下回火。 等离子体预处理工艺可使基板在室温条件下键合。

Available for:

Automated Bonder

Semi-Automated Bonder

Semi-Automated Bond Aligner

Semi-Automated Mask and Bond Aligner

  • Software for pattern recognition
  • Assisted and auto alignment
  • Automatic wedge error compensation
  • Ergonomic and straight-forward operation thanks to an intuitive, Windows-based interface

多层晶圆堆叠被应用在许多构造工艺中。 用红外照射可以识别并对准通常埋在层之间的对准标记。

红外光还可以根据这些埋入的标记进行对准。  这需要使用能透过红外线的材料,例如硅、III-V族半导体(如砷化镓)以及临时键合和键合分离工艺中所使用的粘着剂  通过个例研究检查可行性。

为了尽可能扩大红外对准的使用范围,SUSS 掩模对准器可以选配强大的红外光源和高性能摄像系统。

我们的客户可以从中得到以下好处

  • 强大的红外光源和高性能摄像系统
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BA8 Gen4 Pro Datasheet 243kb
SUSS Product Portfolio 2421kb
Publications

SUSS Smile Technology – Large Area Imprint.
A Solution for Patterning of Micro and Nano Features

SUSS Smile Technology – Large Area Imprint.
A Solution for Patterning of Micro and Nano Features

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