ACS300 Gen2 Coater & Developer

Production Spin Coat / Develop Cluster for Wafer Level Packaging

The ACS300 Gen2 is a modular cluster system designed to meet manufacturers' needs for clean, reliable, high throughput, and modular photolithography processing for 200 and 300mm wafers. Both wafer sizes can be processed parallel or sequential without any mechanical changeover. SUSS MicroTec ACS300 Gen2 systems can be equipped with process modules for HMDS vapor priming, spin coating, spray coating, aqueous or solvent based developing, baking and cooling. It masters thin and thick resist applications as well as photosensitive polymers like polyimide, PBO and Cyclotene (BCB).

SUSS MicroTec ACS300 Gen2 addresses all requirements for sophisticated resist processing and the 3D-Integration and Wafer Level Packaging technology in particular.

Highlights

Concurrent 200 and 300mm wafer processing without mechanical changeover

High-speed, high precision six-axis robot and optical centering

Excellent thick resist capabilities and best-in-class EBR performance

SUSS MicroTec Developer ACS300 Gen2

ACS300 Gen2 allows flexible production planning from R&D/pilot production to the volume production stage. A small footprint configuration comes with 2 load port modules directly attached to the basic frame which guarantees for optimum cost-of-ownership. With a separate EFEM the machine can be equipped with 4 load port modules. It is equipped a high-precision 6-axis robot and camera based centering. With the GYRSET feature highly uniform resist layers with thicknesses from below 1µm to over 100µm can be produced in the process bowl.

The ACS300 Gen2 can be interfaced with the MA300 Gen2 proximity mask aligner to form the integrated LithoPack300 cluster.

スピンコートでは、回転させた基板上に、レジストを用いて均等に薄膜を構成します。レジスト (感光性レジストなど) は多くの場合、ウエハの中心に供給されます。その後の加速、最終回転数、各工程の継続時間に応じて、遠心力でレジストの一部が除去され、膜厚が均質になり ます。形成される薄膜の厚さは、プロセスの各種パラメータだけでなく、レジストまたはフォトレジストの物理的特性によっても左右されます。

SUSS MicroTecの特許取得済みGYRSETメソッドには大きなメリットがあります。GYRSETメソッドでは、コーティング中にプロセスチャンバーも同 時回転することで、回転する基板上の気流の乱れを効率良く抑えます。密閉されたチャンバーの中で、空気はレジストによって通常よりも早い段階で飽和状態と なるため、レジストはより長い時間をかけて乾燥され、基板上に均等に分配されます。それによって、材料の消費量を大幅に削減することができます。

ただし、スピンコートは高い起伏のパターンには適していません。

Available for:

Automated Coater and Developer

Semi-Automated Coater and Developer

Spray coating involves spray application of the solution to the wafer through a nozzle. The path traveled by the nozzle over the wafer is optimized to ensure that the coating is applied evenly to the substrate. The solutions used in spray coating usually feature a very low viscosity, which guarantees that fine droplets form.

Spray coating ensures a uniform layer even with high topography substrates, making it the preferred technique for structures of this kind. Even square substrates can be easily coated using the spray technique.

Features and Benefits

  • Uniform coating even of highly structured surfaces

Available for:

Automated Coater and Developer

Semi-Automated Coater

このプロセスでは、露光された基板に所定量の現像液を塗布し、適度に回転させて配分します。その際、現像液の表面張力によって、基板上に現像液が溜まった状態 (英語で「Puddle」) になります。現像時間が経過した後、現像液は高速回転によりウエハから飛ばされます。そして、脱イオン水でウエハを洗浄し、再び高速回転によって乾燥します。この手法のメリットは、現像液が少量しか必要でないこと、そして良好な現像結果が得られることです。
パドル現像方式は、大量の現像済みフォトレジストを取り除く場合や、起伏が高いパターンによって現像液の入れ替えが妨げられる場合など、現像液の飽和時には適していません。このような場合には、多段式パドル現像方式またはスプレー現像方式が使用されます。
 

特色與優點

  • M化学品用量低

Available for:

Automated Coater and Developer

Semi-Automated Coater and Developer

在噴霧式顯影期間曝光的基板會以低速旋轉。曝光區域會不斷覆蓋以剛噴灑上的顯影劑以免飽和。相對於浸置式顯影,噴霧式顯影具有可用於厚膜光阻以及進行大範圍顯影的優點。之後使用去離子水沖洗並持續乾燥旋轉便完成整個顯影過程。

特色與優點

  • 即使於厚膜光阻下亦能對整個晶圓均勻顯影。

Available for:

Automated Coater and Developer

Semi-Automated Coater and Developer

SUSS MicroTec’s proprietary GYRSET® technology helps to significantly improve spin coating process results by improving the conditions during coating. With the help of a rotating cover a turbulence-free atmosphere, highly saturated with solvents, can be created. This not only makes the outcome more independent from the ambient temperature and humidity. It also substantially reduces the amount of material required to coat a wafer therefore being beneficial for environmental sustainability.

The GYRSET® technology is highly suitable for processing thick resists.

Highlights

  • Prevents back-side contamination
  • Little surface roughness
  • Improves surface planarity
  • Reduces chemical consumption 

Available for:

Automated Coater and Developer

Semi-Automated Coater and Developer

Optimal and complete use of chemicals.

Available for:

Automated Coater and Developer

Intelligent scheduling algorithms: Improve yield by avoiding bottlenecks.

Available for:

Automated Coater and Developer

SUSS MicroTec's proprietary AltaSpray® coating technology is a unique resist deposition method that is capable of producing highly uniform resist films on different 3-D microstructures. The AltaSpray® technology is capable of coating 90° corners, KOH etched cavities, Through Silicon Vias (TSVs) or lenses with topographies ranging from a few micron to 600µm or more. The ability to produce conformal resist coatings on severe topography makes them the ideal choice for R&D, MEMS, 3D-Integration and Wafer Level Packaging applications like 3D image sensor packaging.

SUSS AltaSpray® topography coating modules are available for the ACS200 Gen3 and ACS300 Gen2 platforms. The AltaSpray module allows processing of wafers with diameters of 200mm and 300mm as well as squares up to 8" edge length. All AltaSpray coater modules are can be equipped with up to two separate spray dispense systems. The sophisticated resist supply system offers unmatched process stability and reproducibility. All spray and cleaning parameters can be programmed in the recipe.

Highlights

  • Enabling technology for patterning across severe topography
  • Conformal coating with top edge coverage while avoiding resists accumulation in trenches
  • Proprietary spray design for optimal process stability and reproducibility
  • Up to two separate spray dispense systems
  • All process parameters are programmable in the recipe

Available for:

Automated Coater and Developer

Zubehör für 330 mm Wafer.

Available for:

Automated Coater

湾曲したウエハや反ったウエハは、アライメントと露光を行う前に、損傷しないように平らに伸ばされます。このツーリングには多くのパラメータが関わってくるため、最適なツーリングを得るには、それぞれの基板に応じたカスタマイズが必要になります。

Available for:

Automated Coater and Developer

Downloads
ACS300 Gen2 Brochure 924kb
SUSS Product Portfolio 990kb
Technical Publications
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