RCD8 Coater & Developer

Resist Coat and Develop Platform

The RCD8 semi-automated coater and developer platform is an outstanding tool for R&D and small-scale production and can be custom configured for each application.

The design of the RCD8 semi-automated coater and developer platform draws on SUSS MicroTec's expertise in large-scale production. It is built using the same high-quality components as SUSS MicroTec's full production assemblies. As such, the RCD8 coater and developer platform delivers top application quality with maximum reliability and repeat accuracy. Application-specific substrate chucks allow for the processing of various substrate materials and shapes. These range from square substrates measuring up to 150 x 150 mm and standard wafers up to 200 mm to special shapes up to a maximum size of 200 mm. 

Highlights

Maximum flexibility for applications

Customizable configuration

Safe and ergonomic use

High availability and process stability

SUSS MicroTec Developer RCD8

A fully equipped RCD8 works with SUSS MicroTec's GYRSET® technology and up to four dispenser systems. When equipped with a simple coater, the RCD8 can also manually process substrates in an open bowl variant. In its developer setup, the RCD8 can be configured as a puddle or spray developer.

Precision process management for optimal results

The RCD8 can be equipped with various tried-and-tested dispensing systems capable of handling photoresists with a viscosity from <1 cP to 55000 cP. Alongside cartridge-based and automated dispensing systems, the RCD8 also offers edge bead removal, back-side rinse and automated cleaning of nozzles and the process chamber. Up to four dispenser systems can be collated onto one programmable dispenser arm for exact positioning over the substrate and following the specific recipe.

The chuck is rated for maximum rotational speeds of up to 10,000 rpm (up to 12,000 rpm by request) with acceleration of 7,000 rpm/sec. Coating is performed automatically using a pressurized cartridge or a mechanical pump. Optional dosing system for functions such as back-side rinse and edge bead removal expand the potential range of applications. A motorized cartridge dispenser system enables significant material savings during tests or small-scale production, without sacrificing on the top-quality results.

The coater and developer also include a manual centering system for simple handling of substrates. By request, the substrate handling can also be enhanced with supplemental lift-pins in the substrate chuck. A large touchscreen and the battle-tested MMC software from the large scale production assembles ensure that the operator has full control at all times and can directly monitor the ongoing processes. A simple-to-use recipe editor allows for recipes to be composed and managed flexibly. This also means for example uncomplicated programming of recipe loops as needed. Recipes developed in the RCD8 can also be transferred to the fully automated coater and developer systems of the ACS200 platform.

A focus on the operator: protection and easy use

The industry's strong safety standards are reflected in the RCD8. Various modern sensor technologies as well as lockable hoods ensure that the operator is optimally protected. When the safety hood is open, fluids can be added manually during the process.

If changes or adjustments are required, the flexible platform can be upgraded with a variety of supplemented functions to optimally meet the future needs of the customer.

The RCD8 can also be integrated into the SUSS MicroTec LabCluster to incorporate additional functions such as baking and vapor priming as well as a series of configuration options.

スピンコートでは、回転させた基板上に、レジストを用いて均等に薄膜を構成します。レジスト (感光性レジストなど) は多くの場合、ウエハの中心に供給されます。その後の加速、最終回転数、各工程の継続時間に応じて、遠心力でレジストの一部が除去され、膜厚が均質になり ます。形成される薄膜の厚さは、プロセスの各種パラメータだけでなく、レジストまたはフォトレジストの物理的特性によっても左右されます。

SUSS MicroTecの特許取得済みGYRSETメソッドには大きなメリットがあります。GYRSETメソッドでは、コーティング中にプロセスチャンバーも同 時回転することで、回転する基板上の気流の乱れを効率良く抑えます。密閉されたチャンバーの中で、空気はレジストによって通常よりも早い段階で飽和状態と なるため、レジストはより長い時間をかけて乾燥され、基板上に均等に分配されます。それによって、材料の消費量を大幅に削減することができます。

ただし、スピンコートは高い起伏のパターンには適していません。

Available for:

Automated Coater and Developer

Semi-Automated Coater and Developer

このプロセスでは、露光された基板に所定量の現像液を塗布し、適度に回転させて配分します。その際、現像液の表面張力によって、基板上に現像液が溜まった状態 (英語で「Puddle」) になります。現像時間が経過した後、現像液は高速回転によりウエハから飛ばされます。そして、脱イオン水でウエハを洗浄し、再び高速回転によって乾燥します。この手法のメリットは、現像液が少量しか必要でないこと、そして良好な現像結果が得られることです。
パドル現像方式は、大量の現像済みフォトレジストを取り除く場合や、起伏が高いパターンによって現像液の入れ替えが妨げられる場合など、現像液の飽和時には適していません。このような場合には、多段式パドル現像方式またはスプレー現像方式が使用されます。
 

特色與優點

  • M化学品用量低

Available for:

Automated Coater and Developer

Semi-Automated Coater and Developer

Options

SUSS MicroTec’s proprietary GYRSET® technology helps to significantly improve spin coating process results by improving the conditions during coating. With the help of a rotating cover a turbulence-free atmosphere, highly saturated with solvents, can be created. This not only makes the outcome more independent from the ambient temperature and humidity. It also substantially reduces the amount of material required to coat a wafer therefore being beneficial for environmental sustainability.

The GYRSET® technology is highly suitable for processing thick resists.

Highlights

  • Prevents back-side contamination
  • Little surface roughness
  • Improves surface planarity
  • Reduces chemical consumption 

Available for:

Automated Coater and Developer

Semi-Automated Coater and Developer

Downloads
RCD8 Datasheet 661kb
SUSS Product Portfolio 2243kb
Publications

Polyimide based Temporary Wafer Bonding Technology for High Temperature Compliant TSV Backside Processing and Thin Device Handling

Polyimide based Temporary Wafer Bonding Technology for High Temperature Compliant TSV Backside Processing and Thin Device Handling

Technical Publications
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