ACS300 Gen3 Coater & Developer

Powerful Solution for Advanced Packaging Applications

The modular system of ACS300 Gen3 is specifically designed for demanding high-volume production environments. It provides sophisticated coating, developing and baking functionalities that can be easily adapted to various processes. Maximum process control effectively supports the wide field of use. This, together with the smallest footprint on the market for a system with eight spinner modules, all qualities positively affecting cost-of-ownership, make the tool indispensable for any challenging advanced packaging application such as wafer-level chip-scale packaging, fan-out wafer-level packaging, copper pillar flip-chip packaging and 3D packaging.

Highlights

Small footprint

Efficient chemical handling

Flexible process configuration

High throughput capabilities

Stable process results

SUSS MicroTec Coater ACS300 Gen3

One tool for all advanced packaging applications

By offering multiple process technologies such as photo resist, polyimide and PBO coating within one system, the ACS300 Gen3 delivers high efficiency. It also provides capabilities for up to five resist or four develop chemistries per module for optimal process flexibility. Moreover, the universal hotplate design eliminates the need for specific hotplates for different resist or PI types. The ACS300 Gen3 allows for simultaneous 200 and 300 mm wafer processing without mechanical changeover.

Attractive cost of ownership

The ACS300 Gen3 allows for efficient module stacking, thus saving costly space in the cleanroom. Up to twelve modules can be conveniently arranged on top of one another in a three-level modular system while the tool’s multiple chemical-saving features achieve further savings. Whether SUSS MicroTec’s proprietary GYRSET technology, a novel dispense technique or a chemical recirculation system - the tool uses chemicals economically and works in line with even the most rigid sustainability standards.

Excelling at throughput

When using the optional second robot system the ACS300 Gen3 reaches throughput rates up to 240 wph in a three-step process. An advanced process control system optimizes processing time: scheduling algorithms can be selectively swapped to ensure that time slots of bottleneck steps are fully utilized. Furthermore, features such as developer chemicals at elevated temperatures and flow modes reduce process times.

Consistent process monitoring leading to high yield

What makes the ACS300 Gen3 stand out is its high degree of process control. It is possible to continuously log process data for all relevant parameters such as temperature, flow, pressure, volume, purge rates, etc.. Data logging allows for precisely tuned process parameters, repeatable results and quick identification of potential weak points. Processes become more stable and repeatable, and yield can be significantly increased.

Details: Coating

スピンコートでは、回転させた基板上に、レジストを用いて均等に薄膜を構成します。レジスト (感光性レジストなど) は多くの場合、ウエハの中心に供給されます。その後の加速、最終回転数、各工程の継続時間に応じて、遠心力でレジストの一部が除去され、膜厚が均質になり ます。形成される薄膜の厚さは、プロセスの各種パラメータだけでなく、レジストまたはフォトレジストの物理的特性によっても左右されます。

SUSS MicroTecの特許取得済みGYRSETメソッドには大きなメリットがあります。GYRSETメソッドでは、コーティング中にプロセスチャンバーも同 時回転することで、回転する基板上の気流の乱れを効率良く抑えます。密閉されたチャンバーの中で、空気はレジストによって通常よりも早い段階で飽和状態と なるため、レジストはより長い時間をかけて乾燥され、基板上に均等に分配されます。それによって、材料の消費量を大幅に削減することができます。

ただし、スピンコートは高い起伏のパターンには適していません。

Available for:

Automated Coater and Developer

Semi-Automated Coater and Developer

このプロセスでは、露光された基板に所定量の現像液を塗布し、適度に回転させて配分します。その際、現像液の表面張力によって、基板上に現像液が溜まった状態 (英語で「Puddle」) になります。現像時間が経過した後、現像液は高速回転によりウエハから飛ばされます。そして、脱イオン水でウエハを洗浄し、再び高速回転によって乾燥します。この手法のメリットは、現像液が少量しか必要でないこと、そして良好な現像結果が得られることです。
パドル現像方式は、大量の現像済みフォトレジストを取り除く場合や、起伏が高いパターンによって現像液の入れ替えが妨げられる場合など、現像液の飽和時には適していません。このような場合には、多段式パドル現像方式またはスプレー現像方式が使用されます。
 

特色與優點

  • M化学品用量低

Available for:

Automated Coater and Developer

Semi-Automated Coater and Developer

在噴霧式顯影期間曝光的基板會以低速旋轉。曝光區域會不斷覆蓋以剛噴灑上的顯影劑以免飽和。相對於浸置式顯影,噴霧式顯影具有可用於厚膜光阻以及進行大範圍顯影的優點。之後使用去離子水沖洗並持續乾燥旋轉便完成整個顯影過程。

特色與優點

  • 即使於厚膜光阻下亦能對整個晶圓均勻顯影。

Available for:

Automated Coater and Developer

Semi-Automated Coater and Developer

SUSS MicroTec’s proprietary GYRSET® technology helps to significantly improve spin coating process results by improving the conditions during coating. With the help of a rotating cover a turbulence-free atmosphere, highly saturated with solvents, can be created. This not only makes the outcome more independent from the ambient temperature and humidity. It also substantially reduces the amount of material required to coat a wafer therefore being beneficial for environmental sustainability.

The GYRSET® technology is highly suitable for processing thick resists.

Highlights

  • Prevents back-side contamination
  • Little surface roughness
  • Improves surface planarity
  • Reduces chemical consumption 

Available for:

Automated Coater and Developer

Semi-Automated Coater and Developer

Smart control of dispense systems.

Available for:

Automated Coater and Developer

Optimal and complete use of chemicals.

Available for:

Automated Coater and Developer

Intelligent scheduling algorithms: Improve yield by avoiding bottlenecks.

Available for:

Automated Coater and Developer

湾曲したウエハや反ったウエハは、アライメントと露光を行う前に、損傷しないように平らに伸ばされます。このツーリングには多くのパラメータが関わってくるため、最適なツーリングを得るには、それぞれの基板に応じたカスタマイズが必要になります。

Available for:

Automated Coater and Developer

Technical Publications
Service