XBS200 Wafer Bonder

• Wafer sizes: up to 200 mm

The XBA bond aligner delivers consistent submicron alignment accuracy for transparent or non-transparent wafers by using our proprietary inter-substrate-alignment (ISA) technology. Built-in fixed reference, global calibration and overlay verification ensure optimum repeatability. Global calibration wafers are an integral part of the system and make automated calibration and overlay verification simple and quick.

The XBA offers the option as novel functionality to locally bond a wafer pair via laser pre-bonding after alignment and before transferring it into the bond chamber. This helps to literally freeze the achieved alignment accuracy of the bond aligner.

The XB200 bond chamber is the process module version of the stand-alone XB8 bonder. It offers a wide parameter window and is therefore ideal for any thermo-compression bonding processes. Bond force options include a 60 kN and a 100 kN version and a temperature range of up to 550 °C is available. Reproducible process results from wafer to wafer achieve a consistently high product quality.

The capacitively coupled plasma offers highest process flexibility and repeatability for plasma-based wafer surface activation. Various process gases such as Ar, O₂, N₂ etc. can be used and are controlled via (mass flow controllers (MFCs). The gate-valve loading PL200 allows for full CMOS compatibility and can also be used for plasma cleaning of polymer residues.

The AC200 aqueous cleaner module offers various dispense system options including megasonic. The module also allows for optional backside rinse and N₂ assisted spin-drying. Diluted cleaning chemistry such as NH₄OH (<2%) is available in the basic configuration. Organic removal functionality using SC1 is available on request.

Integrated in-situ metrology functionality allows for fast process feedback. The MM200 therefore is the key for increased process control and yield improvement. The module can be configured for full-field IR void inspection and/or IR overlay measurement including multi-site capability with high throughput. The module offers in-line process control and provides closed-loop feedback to optimize the alignment results. The MM200 does not occupy a process module space.