DSC500 Projection Scanner

半自動投影リソグラフィ用プラットフォームであるSÜSS MicroTecのDSC500は、最大450mmx450mmまでの基板サイズに対応しています。

このスキャナにはフルフィールドマスクとブロードバンドの投影光学系が装備されており、ウエハと基板の露光を1回の連続露光ステップで行います (スキャン)。マスクレイアウトの設計段階ですでに基板エッジ露光などのさまざまな機能を組み込むことができ、これはメッキ処理などの後工程にとって重要な要求です。

 

Highlights

等倍のブロードバンド投影光学系 (Wynne Dyson)

最大ウエハ/基板サイズ: 450mm x 500mm

可変NA:0.07~0.14

解像度: 3µm以下位置合わせ精度: 1µm

Alignment precision < 1 µm

基板の手動搬送

SUSS MicroTec Projection Scanner DSC500

Projection exposure entails aligning the mask with the wafer. The mask pattern is subsequently projected onto the wafer by means of an optical system between the mask and the wafer. With this process, usually only a portion of the wafer is exposed. By repeating the process incrementally ("step and repeat") or through a continuous process ("scanning"), the wafer is completely exposed. The type and the characteristics of the projection optics are decisive factors for resolution and depth of focus and thus for the effectiveness of the exposure.

The projection scanner technology offered by SUSS MicroTec utilizes the combined advantages of full-field exposure and conventional projection lithography, and serves as an alternative to mask aligners and conventional projection steppers. Projection scanning involves aligning a full-field mask with the substrate and then projecting the mask pattern onto the substrate by means of scanning. Scanning technology achieves greater throughput than stepper processes, while at the same time reducing system costs and achieving resolutions down to 3 µm.

Projection scanning offers the greatest advantage in processes requiring high resolutions or where high topography and thick resist coatings are involved. 

Features & Benefits

  • Cost-effective projection solution offering superior resolution down to 3 µm
  • Steep resist sidewalls in thick resist processes

Available for:

Automated Projection Scanner

Semiautomated Projection Scanner

Downloads
DSC500 Datasheet 518kb
SUSS Product Portfolio 990kb
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