The SUSS ACS200 Gen3 platform is the successful result of a perfect mix of innovative and production proven components. With the capability of up to 4 wet process modules and a maximum of 19 plates it perfectly suits the needs of high volume manufacturing (HVM). The unmatched configuration flexibility of modules and technologies covers not only the requirements of the Advanced Packaging, MEMS and LED market it also bridges the gap between R&D and HVM.
Unmatched configuration flexibility
Serving HVM and R&D in Advanced Packaging, MEMS and LED markets
Highest process module count of any 200 mm coater / developer on the market
The versatile base frame provides multiple configuration possibilities, e.g. up to 4 wet process modules (either coater and /or developer) with up to 19 plates or 2 wet process modules and 2 spray coater modules with up to 13 plates.
With the possibility of stacking up to 3 plates over each wet process module and up to 7 plates in the 5th module, the ACS200 Gen3 allows the maximum module count in its class.
Different I/O systems match with any need. The 2x I/O serves R&D requirements, whereas the new designed auto load cassette station enables a continuous operation without stopping the system for cassette exchange.
The novel coater bowl offers state of the art open bowl coating and the patented GYRSET® closed cover coating technology. The bowl design offers the possibility to use disposable process bowls for operation without compromising in flow dynamics or exhaust flows. It simplifies operation with inconvenient or unusual materials due to easy cleaning of the bowl and reduced maintenance time. The possibility to separate the solvent and resist lines on 2 different dispense arms per coater module, the ACS200 Gen3 follows consequently the path on providing excellent yield.
For developing applications, either an aqueous or solvent developer module can be configured. A high variety of different nozzle types are available to match with any process requirement.
The direct connection to a SUSS exposure system increases yield as no operator interaction is necessary for a complete lithography process flow.
Optional filter fan units and temperature / humidity control of the tool results in process stability, reproducibility and finally in a high yield.
SUSS MicroTec 的 GYRSET 專利技術具有顯著的優勢。GYRSET的原理是，塗佈室在塗膠過程中同步旋轉，從而有效降低了旋轉基板上方的空氣湍流。在封閉的塗佈室中空氣比通常用溶劑 時更快速地飽和，使塗層乾燥緩慢，從而更均勻地分佈在基板上。這將大幅減少材料用量。
このプロセスでは、露光された基板に所定量の現像液を塗布し、適度に回転させて配分します。その際、現像液の表面張力によって、基板上に現像液が溜まった状態 (英語で「Puddle」) になります。現像時間が経過した後、現像液は高速回転によりウエハから飛ばされます。そして、脱イオン水でウエハを洗浄し、再び高速回転によって乾燥します。この手法のメリットは、現像液が少量しか必要でないこと、そして良好な現像結果が得られることです。
SUSS MicroTec's proprietary AltaSpray® coating technology is a unique resist deposition method that is capable of producing highly uniform resist films on different 3-D microstructures. The AltaSpray® technology is capable of coating 90° corners, KOH etched cavities, Through Silicon Vias (TSVs) or lenses with topographies ranging from a few micron to 600µm or more. The ability to produce conformal resist coatings on severe topography makes them the ideal choice for R&D, MEMS, 3D-Integration and Wafer Level Packaging applications like 3D image sensor packaging.
SUSS AltaSpray® topography coating modules are available for the ACS200 Gen3 and ACS300 Gen2 platforms. The AltaSpray module allows processing of wafers with diameters of 200mm and 300mm as well as squares up to 8" edge length. All AltaSpray coater modules are can be equipped with up to two separate spray dispense systems. The sophisticated resist supply system offers unmatched process stability and reproducibility. All spray and cleaning parameters can be programmed in the recipe.
SUSS MicroTec's baking equipment provide excellent uniformity and offer optional functionalities such as proximity baking and nitrogen purge. Substrates that can be processed range from small pieces to 300 mm wafers.
SUSS MicroTec’s proprietary GYRSET® technology helps to significantly improve spin coating process results by improving the conditions during coating. With the help of a rotating cover a turbulence-free atmosphere, highly saturated with solvents, can be created. This not only makes the outcome more independent from the ambient temperature and humidity. It also substantially reduces the amount of material required to coat a wafer therefore being beneficial for environmental sustainability.
The GYRSET® technology is highly suitable for processing thick resists.
一個額外的晶圓保護安全功能，特別適用於雙面結構，如微機電系統 (MEMS) 的保護。
Automated Coater and Developer
Vapor priming prepares the wafer surface to improve the surface condition for optimal resist adhesion. The SUSS vapor prime process is executed automatically and fulfills all safety requirements.