HMx Series

HMxSquare

HMxSquare 通过它的显影、蚀刻和清洗功能为光掩模应用,以及光电、OELD 和特殊的半导体后端 (MEMS) 产业提供高品质衬底加工。

手动 HMxSquare 可用于小批量加工或者特殊衬底的试生产。它将原 HMx 系列的稳定性和可靠性与当前对电子控制功能的需求、新清洗技术、环境和安全要求融于一身。

亮点

3 nm – 250 nm 技术

最先进的电子设备和软件

无损处理各种不同卡盘

安全储存化学品

基座外壳的占地面积  960 x 1120 mm,介质存储箱的占地面积 300 x 1070 mm

首次清洗效果

在净化室的宝贵空间中所需面积最小

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SUSS MicroTec Photomask Equipment HMX Square
  • Chrome and chrome oxide photomask up to 14”
  • Si wafers up to 300 mm
  • III/V semiconductor wafers (e.g. GaAs, InP)
  • Special substrates up to 300mm
  • Aqueous-based develop
  • Binary and/or fan spray nozzle
  • DI water rinse
  • Spin dry
  • Sulfuric acid for surface preparation
  • SPM for organic removal
  • Brush cleaning for coarse particle removal
  • 1 MHz megasonic cleaning
  • Full jet spray
  • ESD-safe cleaning
  • Hot DIW final rinse
  • Spin dry
  • Aqueous-based etch
  • Fan spray or puddle
  • DI water rinse
  • Spin dry
  • SEMI S2, S8, S13 compliant
  • CE marked
  • Conform to European harmonized standards and machine directive 2006/42/EC, EMC directive 2004/108/EC and low voltage directive 2006/95/EC
  • Ready for factory automation via SECS/GEM 200 mm standard interface
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