MaskTrack Pro Series

光掩模的完整性对高标准光刻工艺的成功起主要作用。MaskTrack Pro 光掩膜自动处理系统满足下一代光刻路线在光掩模清洗、烘烤和显影工艺方面的所有标准。它是应对 193i 1x half-pitch DPT、极紫外光刻 (EUVL) 和纳米压印光刻 (NIL)高要求的创新解决方案。以创新技术最大限度地提高光掩模性能。

MaskTrack Pro 允许用第三方的产品扩展工具集群,并提供一个全面的方法,在全控、高洁环境中存储、处理和加工光掩模。模块化设计确保其具有高度的灵活性并能高度适应客户的要求。MaskTrack Pro 在第一次运行就能提供最佳的清洁效果,被视为行业的首选平台。

亮点

缩短上市时间

延长光掩模的寿命

提高扫描仪的运行时间

降低运行成本

产量最大化

SUSS MicroTec Photomask Equipment MaskTrack Pro
Configuration: 193i / EUVL Photomask Cleaning System

MaskTrack Pro offers a unique combination of physical and chemical cleaning technologies and methods for surface preparation and passivation that enable customers to effectively remove particles, organic and inorganic contamination while preserving mask integrity down to 1x nm hp technology node. MaskTrack Pro is backward compatible to 90 nm hp.

Physical-based Cleaning

Offering multiple physical force technologies for wet cleaning the system consists of up to three pre-clean and final-clean chambers for segregation of strip, pre-clean and final clean processes.

  • Unique in-situ UV surface preparation and cleaning technology
  • High frequency dual megasonic cleaning up to 4MHz
  • Precision nano binary spray
  • Focus Spot Cleaning

 

Chemical-based Cleaning

  • DIW-H20 degassing for cavitation control during megasonic process
  • Ultra-clean hot and cold CO2-DI water
  • Ozonated DI water and electrolyzed H2 incl. pH stabilization
  • Ultra-diluted SC1
  • New alkaline-based media for further pattern damage reduction
  • 15 nm process media filtration

Sophisticated Preparation, Preservation and Restoration

  • High temperature dehydration and ion removal for 193i photomasks
  • Soft RTP dehydration and surface restoration specifically for EUVL
  • 172nm UV exposure
  • Environmentally controlled mask storage

Intelligent Solutions

  • Wet substrate transfer between pre-clean and final clean process
  • Dry flip functionality
  • Low contact dual substrate transfer handling
  • Multiple input/output and substrate buffer stations
  • Online process monitoring via webcam

In Line with the Industry

  • SEMI S2, S8, S13 compliant
  • CE marked
  • Conform to European harmonized standards and machine directive 2006/42/EC, EMC directive 2004/108/EC and low voltage directive 2006/95/EC
  • DIN ISO 14.644 class 2 controlled environment
  • Ready for factory automation via SECS/GEM 200/300 mm standard interface
Configuration: Single Chamber Photomask Backside Cleaning System

MaskTrack Pro is configurable as an automated sulphate-free photomask cleaning system specifically designed for cleaning of pellicallized masks for advanced technology nodes.

Physical-based Cleaning

  • Single substrate final clean process chamber
  • Special backside cleaning chuck enabling fully mask
    frontside and pellicle protection from process chemicals
  • Megasonic cleaning
  • Nano Binary Spray
  • Spin dry

 

Chemical-based Cleaning

  • DIW-H20 degassing for cavitation control during megasonic process
  • Ultra-clean hot and cold CO2-DI water
  • Ozonated DI water and electrolyzed H2 incl. pH stabilization
  • Ultra-diluted SC1
  • New alkaline-based media for further pattern damage reduction
  • 15 nm process media filtration

Intelligent Solutions

  • Pellicle-compliant substrate handling
  • Input/output and substrate buffer station
  • Online process monitoring via webcam

In Line with the Industry

  • SEMI S2/S8 compliance
  • Ready for factory automation via SECS/GEM 200/300mm standard interface
  • ISO class 2 (Fed Std 209E class 1) environmental control
Configuration: InSync EUVL Photomask Management System

The MaskTrack Pro InSync system offers a specific solution for a holistic mask management in an EUVL environment. As an interface between the MaskTrack Pro cleaning tool and the EUV scanner, it enables automation of the EUV dual pod system. Providing an extremely high intrinsic cleanliness on environment and handling, it ensures a safe and contamination free transfer of the EUV mask the compatibility to the high sensitive vacuum environment of the EUV scanner. The innovative design allows inner pod stocking and backside particle detection with a third-party systems clustering.

Innovative Design

  • EUV Dual Pod compatibility
  • Inner Pod (EIP) automation (opening/closing, storage)
  • Interface to MaskTrack Pro cleaning system
  • Backside inspection metrology capability including advanced defect data analysis
    software with close loop feedback control to address mask re-cleaning
  • Functional as a stand-alone unit or clustering to MaskTrack Pro cleaning system
  • Accepts standard SMIF boxes for transfer to/from SMIF to EUV dual pod
  • Reading functionality of the EUV mask’s 2D QR code

In Line with the Industry

  • SEMI S2, S8, S13 compliant
  • CE marked
  • Conform to European harmonized standards and machine directive 2006/42/EC, EMC directive 2004/108/EC and low voltage directive 2006/95/EC
  • DIN ISO 14.644 class 2 controlled environment
  • Ready for factory automation via SECS/GEM 200/300 mm standard interface
Configuration: Photomask Bake and Develop System

The MaskTrack Pro Bake/Develop system is part of SUSS MicroTec's holistic mask product series for next-generation lithography. Designed for challenges of sub-32nm lithography the system enables most complex photomask manufacturing.

State-of-the-Art Technologies

  • A+nozzle low impact dispense technology for fast and uniform surface wetting and media exchange (→ defect performance and CD uniformity control)
  • ASONIC-Technology® using acoustic streaming for efficient developer utilization compensating pattern loading non-uniformity (→ CD uniformity control)

Superior Performance

  • 25-zone hotplate system for precision temperature uniformity control on the photomask surface, during mean temperature ramp-up and at target temperature (→ CD uniformity control)
  • Automated process optimization algorithm and routine for any target temperature value between 90°C to 130°C on the photomask surface (→ CDmean to target control)
  • CD uniformity improvement by an automated CD data feedback loop (→ CD uniformity control)
  • Mirror Bake functionality compensating influences of the measurement device during the process optimization (→ CD uniformity control)

Intelligent Solutions

  • Low contact dual substrate transfer handling
  • Multiple input/output and substrate buffer stations
  • Online process monitoring via webcam

In Line with the Industry

  • SEMI S2, S8, S13 compliant
  • CE marked
  • Conform to European harmonized standards and machine directive 2006/42/EC, EMC directive 2004/108/EC and low voltage directive 2006/95/EC
  • DIN ISO 14.644 class 2 controlled environment
  • Ready for factory automation via SECS/GEM 200/300mm standard interface
Configuration: TeraPure Imprint Template Cleaning System

TeraPure, MaskTrack Pro’s specific system for imprint templates, is proven cleaning technology and SUSS’ industry-recognized highest first-pass cleaning yield.  The modular design offers customers the flexibility needed for dynamic and developing technologies, such as nanoimprint lithography (NIL).

Physical-based Cleaning

The system consists of two separate cleaning chambers for segregation of strip/ pre-clean and final clean processes, alternatively assignment of one chamber for master template cleaning and the other for replica cleaning. The wet process is conveniently monitored via online webcam.

  • Unique in-situ UV surface preparation and cleaning technology
  • High frequency dual megasonic cleaning up to 4MHz
  • Precision nano binary spray

 

Chemical-based Cleaning

  • DIW-H20 degassing for cavitation control during megasonic process
  • Ultra-clean hot and cold CO2-DI water
  • Ozonated DI water and electrolyzed H2 incl. pH stabilization
  • Ultra-diluted SC1
  • New alkaline-based media for further pattern damage reduction
  • 15 nm process media filtration

Sophisticated Preparation, Preservation and Restoration

  • High temperature dehydration and ion removal for 193i photomasks
  • 172nm UV exposure

Intelligent Solutions

  • Dual handling for different substrate size (e.g. 65mm master templates and 6” replica)
  • Individual buffer for each substrate size
  • Wet substrate transfer between pre clean and final clean chamber
  • Dry flip functionality
  • Low contact linear substrate transfer handling
  • Multiple input/output and substrate buffer stations

In Line with the Industry

  • SEMI S2, S8, S13 compliant
  • CE marked
  • Conform to European harmonized standards and machine directive 2006/42/EC, EMC directive 2004/108/EC and low voltage directive 2006/95/EC
  • DIN ISO 14.644 class 2 controlled environment
  • Ready for factory automation via SECS/GEM 200/300 mm standard interface
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