BA Gen4 Series Bond Aligner

在键合过程中精确对准

键合对准器 BA Gen4 Series 是专为手动对准并键合两个 200 毫米以下晶圆而设计的。选配掩模对准器工具后还可使用各种功能。BA Gen4 Series 用于先进封装、MEMS 生产以及需要亚微米级精确对准和高重复性的应用中。

Highlights

卓越的对准精度

低成本

低成本转换为其他应用

键合对准器 BA Gen4 Series 的晶圆对准晶圆功能建立在 SUSS MicroTec 掩模对准器中同样强大的掩模对准晶圆技术上。因此,BA Gen4 Series 不仅能高精度对准,还提供两衬底熔融键合的附加功能。SUSS MicroTecs 手动键合机 SB6/8 2代 还支持其他键合工艺。BA Gen4 Series 的专用固定系统确保对准后的晶圆堆叠能够可靠传输。

BA Gen4 Series 的手动操作性和简单改装性让用户能够在各种研发过程灵活使用。可供选用的对准方法覆盖大部分工艺。通过自动化功能,例如在屏幕上显示结构和自动楔形误差补偿,支持用户。

Top-Side Alignment (TSA)

Where lithographic processes require the alignment of structures on only one side of the device wafer (e.g. RDL, micro-bumping and similar techniques), top-side alignment is used to align the fiducials on the mask with those of the wafer. Depending on the substrate properties, this can be achieved either using stored position data for the wafer or through live image alignment, as with the DirectAlign® system invented by SUSS MicroTec.

Highlights

  • Mask aligner for the highest level of alignment precision
  • Clear and stable pattern recognition even under poor contrast conditions

Available for:

Automated Mask Aligner

Semi-Automated Mask Aligner

Manual Mask Aligner

Bottom-side Alignment (BSA)

Alignment of the structuring on the wafer back side with the structures on the front is required in processes in the field of MEMS, wafer-level packaging, 3D integration and imprint applications. Optical bottom-side alignment is normally used for this type of alignment. An integrated camera system detects the mask or stamp structures and the structures on the substrate back side, and aligns them with each other. The substrate position must be determined and stored prior to loading, since the substrate subsequently covers the mask target. This places specialized demands on the alignment system as a whole.

Highlights

• With its outstanding level of mechanical precision and stability, the SUSS mask aligner offers unmatched accuracy

Available for:

Automated Mask Aligner

Semi-Automated Mask Aligner

Manual Mask Aligner

Infrared Alignment

Multilayer wafer stacks are used in a number of structuring processes. The alignment marks that are normally embedded between the layers can be identified and aligned via infrared (IR) illumination. This requires the use of materials that are transparent for IR light, such as undoped silicon, III-V semiconductors (e.g. GaAs) and adhesives for temporary bonding and debonding techniques.  
The SUSS equipment can be optionally equipped with powerful IR light sources and high-performance camera systems, ensuring optimal IR availability.

Highlights

  • Powerful IR light sources and high-performance camera systems.

Available for:

Automated Mask Aligner

Semi-Automated Mask Aligner

Manual Mask Aligner

融熔接合是指兩個平面基片的自發黏著。 流程包括沖洗拋光碟片,並讓它們具有大量的親水性,然後讓它們接觸並以高溫硬化。 電漿預處理讓基片可在室溫下接合。

Available for:

Automated Bonder

Semi-Automated Bonder

Semi-Automated Bond Aligner

Semi-Automated Mask and Bond Aligner

  • Software for pattern recognition
  • Assisted and auto alignment
  • Automatic wedge error compensation
  • Ergonomic and straight-forward operation thanks to an intuitive, Windows-based interface

Infrared Alignment

Multilayer wafer stacks are used in a number of structuring processes. The alignment marks that are normally embedded between the layers can be identified and aligned via infrared (IR) illumination. This requires the use of materials that are transparent for IR light, such as undoped silicon, III-V semiconductors (e.g. GaAs) and adhesives for temporary bonding and debonding techniques.  
The SUSS equipment can be optionally equipped with powerful IR light sources and high-performance camera systems, ensuring optimal IR availability.

Highlights

  • Powerful IR light sources and high-performance camera systems.

Available for:

Automated Mask Aligner

Semi-Automated Mask Aligner

Manual Mask Aligner

Downloads
SUSS Product Portfolio 3179kb
Technical Publications
Service