High Performance Projection Scanner for 300 mm Wafers
SUSS MicroTec 公司的光罩對準組合，以其高對準精度和精密的曝光技術，輔以獨創的投影光刻解決方案：DSC 光刻儀平台結合了全場光刻與投影光刻成像性能的所有優點，從而提供一個極具成本效益的替代方案，以取代步進投影。配備全視域光罩和寬帶投影鏡頭，以單一連續掃描模式投影至載具。
Projection exposure entails aligning the mask with the wafer. The mask pattern is subsequently projected onto the wafer by means of an optical system between the mask and the wafer. With this process, usually only a portion of the wafer is exposed. By repeating the process incrementally ("step and repeat") or through a continuous process ("scanning"), the wafer is completely exposed. The type and the characteristics of the projection optics are decisive factors for resolution and depth of focus and thus for the effectiveness of the exposure.
The projection scanner technology offered by SUSS MicroTec utilizes the combined advantages of full-field exposure and conventional projection lithography, and serves as an alternative to mask aligners and conventional projection steppers. Projection scanning involves aligning a full-field mask with the substrate and then projecting the mask pattern onto the substrate by means of scanning. Scanning technology achieves greater throughput than stepper processes, while at the same time reducing system costs and achieving resolutions down to 3 µm.
Projection scanning offers the greatest advantage in processes requiring high resolutions or where high topography and thick resist coatings are involved.
Features & Benefits