XB8 晶圓接合機（Wafer Bonder）的設計適用多種鍵合工藝，並可用於加工晶圓尺寸在 200 mm 以下的襯底。所有的工藝參數皆可根據需求彈性調整，使得機組可完美地應用於研發上。在生產過程中 XB8 的自動化程度高且其結構設計經過廣泛考慮，可使製程具有高度的穩定性。因而 XB8 晶圓接合機最適合應用於微電機系統、先進封裝、三維集成及 LED 等領域。
將 XB8 配合 SUSS MicroTec 的 接合對準器 即可實現晶圓對準晶圓的高精度鍵合工藝。
因應特殊製程條件的需求，XB8 提供各式專門的 工具選項。
The force-free spacer removal ensures best post-bond-alignment, when spacers are required for the bond process. The sequential spacer removal option gives the operator maximum flexibility to control the removal of spacers.
The design allows an individual removal of each of the three spacer controlled by the bond recipe. During the removal sequence, the clamp at the respective position is lifted from the wafer stack, the spacer is removed and afterwards the clamp is set again to secure the alignment.
Anodic wafer bonding involves encapsulating components on the wafer by means of ionic glass. In triple-stack bonding, three layers (i.e. glass-silicon-glass) are simultaneously bonded, enhancing both functionality and yield.
Eutectic wafer bonding takes advantage of the special properties of eutectic metals. Similar to soldering alloys, such metals melt already at low temperatures. This property allows planar surfaces to be achieved.
In order to control reflow of the eutectic material, eutectic bonding requires precise dosing of the bonding force and even temperature distribution.
Fusion bonding refers to spontaneous adhesion of two planar substrates. The process involves rinsing the polished discs and rendering them largely hydrophilic, then placing them in contact and tempering them at high temperatures. Plasma pretreatment allows the substrates to be bonded at room temperature.
Glass Frit Bonding
A glass frit bonding process involves screen-printing glass frits onto the bonding surfaces. This results in structures that are subsequently heated and fused when the two substrate surfaces are placed in contact. On cooling, a mechanically stable bond results.
Metal Diffusion Bonding
Metal diffusion bonding is based on Cu-Cu, Al-Al, Au-Au and other metallic bonds. In addition, the use of metal diffusion allows two wafers to be bonded both mechanically and electrically in a single step. The technique is required for bonding in 3D applications such as 3D stacking.
SLID bonding (solid-liquid inter-diffusion) is based on diffusion and the mixture of different metals. The melting temperature of the alloy after bonding is very much higher than the bonding temperature, which clearly widens the range of possible applications.
The bond head includes a center pin which allows to establish contact between both wafers at their center points. This helps to maintain excellent alignment even after thermal expansion of the bond partners. The center pin is used to initiate a fusion bond in the center of the wafer stack.
The bond head offers excellent temperature and bond force uniformity and maintains excellent post-bond alignment in combination with SUSS’ proprietary sequential spacer removal technology. This bond head and tooling design enable optimum yield due to minimal exclusion zones.
The open fixture features a transport ring with minimum contact area for wafer support and maximized cut-out area for reduced thermal mass during heat up and cool down. This type of fixture allows direct contact between the wafers and the sandwich and pressure plates which results in optimum temperature uniformity across the wafers. In addition, this enables optimal heating and cooling rates and is therefore the best choice for high throughput applications.
Featuring a transport ring with an integrated SiC tooling plate closed fixtures are designed for handling irregular substrate shapes as well sensitive material such as lithium tantalate. The closed fixture is ideal for fragile substrates like MEMS and optical devices as the wafers are fully supported and protected during handling.
The multi-bond fixture is used in combination with a special loading and mechanical alignment system and supports multi-wafer bonding and multiple wafer sizes at the same time. Bonding multiple wafers in the same bond cycle allows to maximize the overall system throughput.