XB8 Wafer Bonder

XB8 晶圓接合機(Wafer Bonder)的設計適用多種鍵合工藝,並可用於加工晶圓尺寸在 200 mm 以下的襯底。所有的工藝參數皆可根據需求彈性調整,使得機組可完美地應用於研發上。在生產過程中 XB8 的自動化程度高且其結構設計經過廣泛考慮,可使製程具有高度的穩定性。因而 XB8 晶圓接合機最適合應用於微電機系統、先進封裝、三維集成及 LED 等領域。

Highlights

工藝開發期間不乏靈活變換的可能性

製程穩定 

產量高

 

重複精度高

XB8 晶圓接合機具備一間含自動化載入功能的閉合處理室。載入程序執行期間將處理室填充氮氣,力保維持其清潔度。高自動化程度能將機組操作人員對製程結果的影響降至最低。鍵合室本身的加熱器具有熱分離功能,如此即可精確地再現製程溫度,同時重複鍵合亦不失精度與鍵合力。

均質地分配溫度及鍵合力 

陶瓷加熱器具有熱分離功能可均勻地分配溫度,同時保障鍵合力在全溫度範圍內達到最佳的均質性。選配的多區加熱系統可進階地調控溫度的分佈。XB8 晶圓接合機的設計結構創新,能最理想地在晶圓上分配鍵合力及溫度,以取得高產量。 

將 XB8 配合 SUSS MicroTec 的 接合對準器 即可實現晶圓對準晶圓的高精度鍵合工藝。

XB8 提供各式專門的工具選項。

因應特殊製程條件的需求,XB8 提供各式專門的 工具選項

 

 

  • 鍵合力:60 或 100 kN,重複精度:< 2%
  • 溫度最高至 550 °C,同等性:<1.5%
  • 精準設定鍵合方案中的所有參數
  • 斜坡函數
  • 用以降低運行時間的快速加熱(40 K/min)與主動降溫(40 K/min)
  • Wafer sizes: 4, 6, 8 inch
  • Dedicated tooling for pieces

聚合物和黏著技術可以採用的材料相當多,包括環氧材料、乾性薄膜、BCB、聚醯亞胺及可紫外曝光化合物。

Available for:

Automated Bonder

Semi-Automated Bonder

陽極接合技術透過離子化玻璃將部件封裝在晶圓上。在玻璃/矽/玻璃的疊層接合中, 三層可以同時進行接合,可提高功能性和產量。

Available for:

Automated Bonder

Semi-Automated Bonder

晶圓的共晶接合利用了共晶金屬的特殊屬性。 像焊料一樣的合金即使在低溫下也能夠熔化。如此便能進行表面的平坦化處理。

共晶接合需要對接觸力和溫度的穩定性進行精確控制,以便控制共晶材料的回流。

Available for:

Automated Bonder

Semi-Automated Bonder

融合接合是兩種基板直接接觸後形成的自然相互黏著。拋光片在清洗後進行親水性加工,相互接觸並在高溫下降溫。 電漿活化等處理使得基板能夠在室溫下接合。

Available for:

Automated Bonder

Semi-Automated Bonder

Semi-Automated Bond Aligner

Semi-Automated Mask and Bond Aligner

此種方法通過網印將玻璃漿料塗在接合面上。熔化所產生的結構後,接觸至第二個基板。冷卻後即形成穩定的機械性連接。

Available for:

Automated Bonder

Semi-Automated Bonder

金屬擴散接合包括銅-銅、鋁-鋁、金-金和其他合金技術。另外,應用金屬擴散使兩個晶圓能夠在一個工作步驟中同時完成機械和電性兩種連接。這種技術被用在 3D 應用,如 3D 堆疊中。

Available for:

Automated Bonder

Semi-Automated Bonder

固液擴散鍵合(英文:SLID,solid-liquid inter-diffusion)的作用原理基於各種金屬的擴散及融合。鍵合後合金的融化溫度比鍵合溫度高出許多,大幅提高應用範圍。

Available for:

Automated Bonder

Semi-Automated Bonder

混合式鍵合的作用原理基於兩層金屬層受熱受壓結合並與融合鍵合整合。此過程中同時包含電子(金屬鍵合)與機械(融合鍵合)的結合。

Available for:

Automated Bonder

Semi-Automated Bonder

The bond head includes a center pin which allows to establish contact between both wafers at their center points. This helps to maintain excellent alignment even after thermal expansion of the bond partners. The center pin is used to initiate a fusion bond in the center of the wafer stack.

Available for:

Semi-Autometed Bonder

The bond head offers excellent temperature and bond force uniformity and maintains excellent post-bond alignment in combination with SUSS’ proprietary sequential spacer removal technology. This bond head and tooling design enable optimum yield due to minimal exclusion zones.

Available for:

Semi-Automated Bonder

The open fixture features a transport ring with minimum contact area for wafer support and maximized cut-out area for reduced thermal mass during heat up and cool down. This type of fixture allows direct contact between the wafers and the sandwich and pressure plates which results in optimum temperature uniformity across the wafers. In addition, this enables optimal heating and cooling rates and is therefore the best choice for high throughput applications.

Available for:

Semi-Automated Bonder

Featuring a transport ring with an integrated SiC tooling plate closed fixtures are designed for handling irregular substrate shapes as well sensitive material such as lithium tantalate. The closed fixture is ideal for fragile substrates like MEMS and optical devices as the wafers are fully supported and protected during handling.

Available for:

Semi-Automated Bonder

The multi-bond fixture is used in combination with a special loading and mechanical alignment system and supports multi-wafer bonding and multiple wafer sizes at the same time. Bonding multiple wafers in the same bond cycle allows to maximize the overall system throughput.

Available for:

Semi-Automated Bonder

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XB8 Datasheet 350kb
SUSS MicroTec Product Portfolio 990kb
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