RCD8 Coater & Developer

光阻塗佈與顯影平台

RCD8塗佈與顯影平台可依客戶需求進行客製配置,例如從基本的手動旋轉塗佈機到半自動的GYRSET®式塗佈機,以及浸置與噴霧顯影工具,適用於日常研發工作至小規模生產等用途。

亮点

以最低成本發揮最大用途。

所有相關元件皆符合人體工學設計,使用操作方便。

採用相容設計,可從RCD8平台將製程輕鬆轉移至SUSS 量產工具。

SUSS MicroTec Developer RCD8

光阻塗佈與顯影平台

由於具備廣泛的配置功能,RCD8幾乎可提供不同基板材料與形狀的塗佈與顯影。此平台可裝配各種經實驗過的下料系統與幫浦配置,以處理黏度小於1 cps至55,000 cps的光阻。

若日後需改裝,此多功能機台可使用各種選項直接於現場升級,完全滿足您未來的使用操作需求。

Spin coating is the process of evenly coating a spinning substrate with a solution. The solution, for instance a photosensitive resist, is dispensed at the center of the wafer. Subsequent acceleration as well as the rotation speed and the time allotted to the individual steps ensure that a homogeneous layer thickness remains after excess resist is spun off. Alongside the process parameters, the physical properties of the solution or photoresist determine the thickness of the applied film.

SUSS MicroTec’s proprietary GYRSET technology provides cutting-edge advantages. The GYRSET principle entails synchronous rotation of the process chamber during coating, in this way effectively reducing air turbulence over the rotating substrate. The atmosphere within the closed chamber becomes more quickly saturated with solvents, so that the resist dries more slowly and is thus distributed more evenly over the substrate. This results in significant savings in terms of required material.

Spin coating is limited in use to structures without high topography.

Features and Benefits

  • Spin coating: a simple and widely used technique
  • Proprietary GYRSET technique reduces the material required and cuts costs

Available for:

Automated Coater and Developer

Semi-Automated Coater and Developer

Puddle developing involves dispensing a defined quantity of developer to the exposed substrate, gently spinning it to spread the developer. Due to the surface tension of the developing agent, a convex puddle is formed on the wafer. Once developing time is completed, the wafer is rotated quickly to spin off the developer agent. The wafer is subsequently rinsed with deionized water and dried, once again at a high rotation speed. The main advantage of the technique is that only very little developing agent is required while maintaining excellent process results.

Puddle developing is no longer feasible when the developing agent becomes saturated, for example when a large quantity of photoresist needs to be removed or a high structural topography prevents exchange of the developer. In such cases, a multi-stage puddle developing process or spray developing is used.

Features and Benefits

  • Minimal chemical consumption

Available for:

Automated Coater and Developer

Semi-Automated Coater and Developer

選配

SUSS MicroTec’s proprietary GYRSET® technology helps to significantly improve spin coating process results by improving the conditions during coating. With the help of a rotating cover a turbulence-free atmosphere, highly saturated with solvents, can be created. This not only makes the outcome more independent from the ambient temperature and humidity. It also substantially reduces the amount of material required to coat a wafer therefore being beneficial for environmental sustainability.

The GYRSET® technology is highly suitable for processing thick resists.

Highlights

  • Prevents back-side contamination
  • Little surface roughness
  • Improves surface planarity
  • Reduces chemical consumption 

Available for:

Automated Coater and Developer

Semi-Automated Coater and Developer

Downloads
RCD8 Datasheet 661kb
SUSS Product Portfolio 1000kb
Publications

Polyimide based Temporary Wafer Bonding Technology for High Temperature Compliant TSV Backside Processing and Thin Device Handling

Polyimide based Temporary Wafer Bonding Technology for High Temperature Compliant TSV Backside Processing and Thin Device Handling

Technical Publications
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