The ACS300 Gen2 is a modular cluster system designed to meet manufacturers' needs for clean, reliable, high throughput, and modular photolithography processing for 200 and 300mm wafers. Both wafer sizes can be processed parallel or sequential without any mechanical changeover. SUSS MicroTec ACS300 Gen2 systems can be equipped with process modules for HMDS vapor priming, spin coating, spray coating, aqueous or solvent based developing, baking and cooling. It masters thin and thick resist applications as well as photosensitive polymers like polyimide, PBO and Cyclotene (BCB).
SUSS MicroTec ACS300 Gen2 addresses all requirements for sophisticated resist processing and the 3D-Integration and Wafer Level Packaging technology in particular.
Concurrent 200 and 300mm wafer processing without mechanical changeover
High-speed, high precision six-axis robot and optical centering
Excellent thick resist capabilities and best-in-class EBR performance
ACS300 Gen2 allows flexible production planning from R&D/pilot production to the volume production stage. A small footprint configuration comes with 2 load port modules directly attached to the basic frame which guarantees for optimum cost-of-ownership. With a separate EFEM the machine can be equipped with 4 load port modules. It is equipped a high-precision 6-axis robot and camera based centering. With the GYRSET feature highly uniform resist layers with thicknesses from below 1µm to over 100µm can be produced in the process bowl.
The ACS300 Gen2 can be interfaced with the MA300 Gen2 proximity mask aligner to form the integrated LithoPack300 cluster.
SUSS MicroTec 的 GYRSET 專利技術具有顯著的優勢。GYRSET的原理是，塗佈室在塗膠過程中同步旋轉，從而有效降低了旋轉基板上方的空氣湍流。在封閉的塗佈室中空氣比通常用溶劑 時更快速地飽和，使塗層乾燥緩慢，從而更均勻地分佈在基板上。這將大幅減少材料用量。
このプロセスでは、露光された基板に所定量の現像液を塗布し、適度に回転させて配分します。その際、現像液の表面張力によって、基板上に現像液が溜まった状態 (英語で「Puddle」) になります。現像時間が経過した後、現像液は高速回転によりウエハから飛ばされます。そして、脱イオン水でウエハを洗浄し、再び高速回転によって乾燥します。この手法のメリットは、現像液が少量しか必要でないこと、そして良好な現像結果が得られることです。
SUSS MicroTec's proprietary AltaSpray® coating technology is a unique resist deposition method that is capable of producing highly uniform resist films on different 3-D microstructures. The AltaSpray® technology is capable of coating 90° corners, KOH etched cavities, Through Silicon Vias (TSVs) or lenses with topographies ranging from a few micron to 600µm or more. The ability to produce conformal resist coatings on severe topography makes them the ideal choice for R&D, MEMS, 3D-Integration and Wafer Level Packaging applications like 3D image sensor packaging.
SUSS AltaSpray® topography coating modules are available for the ACS200 Gen3 and ACS300 Gen2 platforms. The AltaSpray module allows processing of wafers with diameters of 200mm and 300mm as well as squares up to 8" edge length. All AltaSpray coater modules are can be equipped with up to two separate spray dispense systems. The sophisticated resist supply system offers unmatched process stability and reproducibility. All spray and cleaning parameters can be programmed in the recipe.
SUSS MicroTec's baking equipment provide excellent uniformity and offer optional functionalities such as proximity baking and nitrogen purge. Substrates that can be processed range from small pieces to 300 mm wafers.
SUSS MicroTec’s proprietary GYRSET® technology helps to significantly improve spin coating process results by improving the conditions during coating. With the help of a rotating cover a turbulence-free atmosphere, highly saturated with solvents, can be created. This not only makes the outcome more independent from the ambient temperature and humidity. It also substantially reduces the amount of material required to coat a wafer therefore being beneficial for environmental sustainability.
The GYRSET® technology is highly suitable for processing thick resists.
Vapor priming prepares the wafer surface to improve the surface condition for optimal resist adhesion. The SUSS vapor prime process is executed automatically and fulfills all safety requierements.