ACS300 Gen2 Coater & Developer

Production Spin Coat / Develop Cluster for Wafer Level Packaging

The ACS300 Gen2 is a modular cluster system designed to meet manufacturers' needs for clean, reliable, high throughput, and modular photolithography processing for 200 and 300mm wafers. Both wafer sizes can be processed parallel or sequential without any mechanical changeover. SUSS MicroTec ACS300 Gen2 systems can be equipped with process modules for HMDS vapor priming, spin coating, spray coating, aqueous or solvent based developing, baking and cooling. It masters thin and thick resist applications as well as photosensitive polymers like polyimide, PBO and Cyclotene (BCB).

SUSS MicroTec ACS300 Gen2 addresses all requirements for sophisticated resist processing and the 3D-Integration and Wafer Level Packaging technology in particular.

Highlights

Concurrent 200 and 300mm wafer processing without mechanical changeover

High-speed, high precision six-axis robot and optical centering

Excellent thick resist capabilities and best-in-class EBR performance

SUSS MicroTec Developer ACS300 Gen2

ACS300 Gen2 allows flexible production planning from R&D/pilot production to the volume production stage. A small footprint configuration comes with 2 load port modules directly attached to the basic frame which guarantees for optimum cost-of-ownership. With a separate EFEM the machine can be equipped with 4 load port modules. It is equipped a high-precision 6-axis robot and camera based centering. With the GYRSET feature highly uniform resist layers with thicknesses from below 1µm to over 100µm can be produced in the process bowl.

The ACS300 Gen2 can be interfaced with the MA300 Gen2 proximity mask aligner to form the integrated LithoPack300 cluster.

旋轉式塗佈是在旋轉基板均勻地塗以溶液。溶液,如感光塗層,通常分注在晶圓中心。隨後的加速度、最終轉速和各步驟的持續時間,使得塗料的一部分經離心分離形成厚度均勻的膜。除了處理參數外,溶液或感光塗層的物理性質決定了膜的厚度。

SUSS MicroTec 的 GYRSET 專利技術具有顯著的優勢。GYRSET的原理是,塗佈室在塗膠過程中同步旋轉,從而有效降低了旋轉基板上方的空氣湍流。在封閉的塗佈室中空氣比通常用溶劑 時更快速地飽和,使塗層乾燥緩慢,從而更均勻地分佈在基板上。這將大幅減少材料用量。

旋轉式塗佈不適用於有凹凸圖形的結構。

特色與優點

  • 旋轉式塗佈為操作簡單且廣泛應用的方法
  • 通過 GYRSET 專利塗膠技術減少材料消耗並降低成本

Available for:

Automated Coater and Developer

Semi-Automated Coater and Developer

使用噴霧式塗佈時,噴嘴會將欲塗抹的溶液噴在晶圓上。優化後的晶圓上方噴嘴移動路徑確保基板上塗層的均勻。 噴霧所用的液體通常粘度極低,能確保形成細小的液滴。
噴霧式塗佈即使在凹凸圖形上也能形成均勻的塗層,因此為該結構的第一選擇。噴霧式塗佈亦能噴塗方形基板。

特色與優點

  • 即使在崎嶇結構的表面上亦能形成均勻的表面塗層

Available for:

Automated Coater and Developer

Semi-Automated Coater

このプロセスでは、露光された基板に所定量の現像液を塗布し、適度に回転させて配分します。その際、現像液の表面張力によって、基板上に現像液が溜まった状態 (英語で「Puddle」) になります。現像時間が経過した後、現像液は高速回転によりウエハから飛ばされます。そして、脱イオン水でウエハを洗浄し、再び高速回転によって乾燥します。この手法のメリットは、現像液が少量しか必要でないこと、そして良好な現像結果が得られることです。

パドル現像方式は、大量の現像済みフォトレジストを取り除く場合や、起伏が高いパターンによって現像液の入れ替えが妨げられる場合など、現像液の飽和時には適していません。このような場合には、多段式パドル現像方式またはスプレー現像方式が使用されます。

特色與優點

  • M化学品用量低

Available for:

Automated Coater and Developer

Semi-Automated Coater and Developer

在噴霧式顯影期間曝光的基板會以低速旋轉。曝光區域會不斷覆蓋以剛噴灑上的顯影劑以免飽和。相對於浸置式顯影,噴霧式顯影具有可用於厚膜光阻以及進行大範圍顯影的優點。之後使用去離子水沖洗並持續乾燥旋轉便完成整個顯影過程。

特色與優點

  • 即使於厚膜光阻下亦能對整個晶圓均勻顯影。

Available for:

Automated Coater and Developer

Semi-Automated Coater and Developer

SUSS MicroTec’s proprietary GYRSET® technology helps to significantly improve spin coating process results by improving the conditions during coating. With the help of a rotating cover a turbulence-free atmosphere, highly saturated with solvents, can be created. This not only makes the outcome more independent from the ambient temperature and humidity. It also substantially reduces the amount of material required to coat a wafer therefore being beneficial for environmental sustainability.

The GYRSET® technology is highly suitable for processing thick resists.

Highlights

  • Prevents back-side contamination
  • Little surface roughness
  • Improves surface planarity
  • Reduces chemical consumption 

Available for:

Automated Coater and Developer

Semi-Automated Coater and Developer

Optimal and complete use of chemicals.

Available for:

Automated Coater and Developer

Intelligent scheduling algorithms: Improve yield by avoiding bottlenecks.

Available for:

Automated Coater and Developer

SUSS MicroTec's proprietary AltaSpray® coating technology is a unique resist deposition method that is capable of producing highly uniform resist films on different 3-D microstructures. The AltaSpray® technology is capable of coating 90° corners, KOH etched cavities, Through Silicon Vias (TSVs) or lenses with topographies ranging from a few micron to 600µm or more. The ability to produce conformal resist coatings on severe topography makes them the ideal choice for R&D, MEMS, 3D-Integration and Wafer Level Packaging applications like 3D image sensor packaging.

SUSS AltaSpray® topography coating modules are available for the ACS200 Gen3 and ACS300 Gen2 platforms. The AltaSpray module allows processing of wafers with diameters of 200mm and 300mm as well as squares up to 8" edge length. All AltaSpray coater modules are can be equipped with up to two separate spray dispense systems. The sophisticated resist supply system offers unmatched process stability and reproducibility. All spray and cleaning parameters can be programmed in the recipe.

Highlights

  • Enabling technology for patterning across severe topography
  • Conformal coating with top edge coverage while avoiding resists accumulation in trenches
  • Proprietary spray design for optimal process stability and reproducibility
  • Up to two separate spray dispense systems
  • All process parameters are programmable in the recipe

Available for:

Automated Coater and Developer

Zubehör für 330 mm Wafer.

Available for:

Automated Coater

將弧形和拱形晶圓於對準並在曝光前輕輕拉平。由於許多參數會對此產生影響,因此需要針對個別的載具使用最適合的特殊工具。

Available for:

Automated Coater and Developer

Downloads
ACS300 Gen2 Brochure 924kb
SUSS Product Portfolio 990kb
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