ASx Series

SUSS MicroTecs ASx 系列为加工光掩模和 250 nm 至 90 nm 技术节点提供了先进的烘烤、显影和清洁方法。其可靠性、稳定性和高性能使平台能够满足无损加工光掩模的要求，用于 248 nm 和 193 nm 光刻工艺。

亮点

最佳的第一遍清洗效果，从而延长光掩模的使用寿命

占地面积小（1200 x 1200 mm），低总体拥有成本

高可靠性和可用性

More than 250 ASx Sold

State of the Art Advanced Bake - Qualified down to 14 nm Node and beyond

Advanced Single Substrate Cleaner ASC 5500

The ASX ensures 100% soft defect removal, careful PSM cleaning and minimal residual ions during critical cleaning stages:

  • Resist strip and pre-clean
  • Final clean
  • Pellicle adhesive cleaning
  • Backside cleaning of pellicallized masks

Multiple Technologies

  • Dual megasonic cleaning
  • High pressure Fulljet cleaning
  • Brush cleaning
  • In-situ SC1, in-Situ SPM, 172nm UV dry cleaning, ultra-clean hot DI rinse
  • Backside rinse nozzles
  • Re-ionization of DI water by CO2 or NH4OH
  • ESD-safe cleaning
  • Binary and phase shift masks
  • Photomasks and other square substrates up to 9”
  • Round substrates (wafers or imprint masks) up to 300mm

Product Highlights

  • Minimal phase and transmission change
  • Low residual ion concentrations avoiding haze
  • Monitoring PoU media parameters
  • Fully automated, including SMIF load / unload

In Line with the Industry

  • SEMI S2, S8, S13 compliant
  • CE marked
  • Conform to European harmonized standards and machine directive 2006/42/EC, EMC directive 2004/108/EC and low voltage directive 2006/95/EC
  • DIN ISO 14.644 class 3 controlled environment
  • Ready for factory automation via SECS/GEM 200 mm standard interface
Post-Exposure Bake System APB9500

Superior Performance

State-of-the-art fully automated mask bake and chill system, valuable to different applications like

  • Post-exposure bake
  • Post-coat bake of phase shift masks and mask blanks
  • Chilling
     
  • Precision uniform bake by 25 independently controlled zones in one hot plate
  • Measurement of uniformity by sensor array mask with 25 sensors
  • Bake temperature up to 220° C (typical 90 to 130° C)
  • Precision cool plate for chilling
  • Combined hot plate - cool plate stack
  • Up to 2 hot plates and cool plates stacks in one APB9500 for highest process flexibility and throughput requirements
  • SEMI S2, S8, S13 compliant
  • CE marked
  • Conform to European harmonized standards and machinery directive 2006/42/EC, EMC directive 2014/30/EC and low voltage directive 2014/35/EC
  • DIN ISO 14.644 class 3 controlled environment
  • Ready for factory automation via SECS/GEM 200 und 300 mm standard interface
  • Bake self-optimization SW procedure
  • CD uniformity optimization by profile bake
  • Mirror bake functionality
  • Storage for temperature sensor masks in each stack
  • Can be clustered to E-beam writers or Developer (ASP) very easily
  • Small footprint
Develop System ASP5500
  • Lowest impact developing by A+ Nozzle with continuous media distribution over the whole mask
  • Active degassing of the developer prevents micro-bubbles for low defect counts
  • Clustered equipment with APB for PEB
  • Efficient chemical filtration (amines/acids) and precise temperature and humidity control
  • Fully automated including SMIF load / unload
  • Enhanced process control and monitoring features
  • To be combined with Post-Exposure-Bake-System APB9500 for optimum results
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