BA8 Gen4 Pro Bond Aligner

高精度晶圓接合對準

BA8第四代專業級半自動式晶圓接合對準機是針對高精度晶圓對準需求,並且可支援 200 mm (含)以下的晶圓和基板尺寸所設計。高度自動化使第 4 代專業級 BA8 不僅適用於研究和開發,還可用於試生產或小批量生產。其能夠滿足微機電元件製造和先進封裝製程領域以及如 3D 整合製程等成長市場所需的嚴苛工藝。 

亮點

高對準精度

自動對準功能大大降低人為操作影響

自動對準功能大大降低人為操作影響

簡易的系統擴充

可選配搭載”區域選擇性”或是 “全區域性”電漿模組

SUSS MicroTec Wafer Bonder BA8 Gen4

晶圓接合對準機所配備的晶圓對準功能是建立在 SUSS MicroTec 光罩對準曝光機中同樣功能強大的光罩與晶圓對準技術上。BA 8 Gen4 Pro第 4 代專業級晶圓接合對準機 除了能提供高精度晶圓對準功能外,還提供了熔融接合(fusion bond)功能,在晶圓接合對準機中將兩個矽晶圓直接對準並接合。SUSS MicroTecs 第二代手動晶圓接合機 SB6/8Gen2 提供更多晶圓接合技術所需的接合製程,透過專用的晶圓固定系統將對準後的兩片晶圓從晶圓對準機安全的手動傳送到晶圓接合機。

用以支援低溫熔融接合(fusion bond) 的”區域選擇性”或是 “全區域性”電漿活化功能進一步完善了晶圓接合對準機的廣泛應用性。

根據工藝要求,可將BA8 Gen4 Pro第 4 代專業級 配置為手動或半自動系統。作為半自動系統設備,BA8 Gen4 Pro 第 4 代專業級 憑藉自動對準功能、容易操作的製程配方編輯器和自動軸向定位等功能可達到高度的製程再現性,因此也適合用於對產量有嚴格要求的生產製程。而手動操作性使機台設備透過操作者能夠靈活運用於各種製程中。供選用的對準技術可滿足大部分製程工藝的要求。 

Where lithographic processes require the alignment of structures on only one side of the device wafer (e.g. RDL, microbumping and similar techniques), top-side alignment is used to align the fiducials on the mask with those of the wafer. Depending on substrate properties, this can be achieved either using stored position data for the wafer or through live image alignment, as in the DirectAligntm system invented at SUSS MicroTec. 

Highlights

  • Mask aligner for the highest level of alignment precision
  • Clear and stable pattern recognition even under poor constrast conditions

Available for:

Automated Mask Aligner

Semi-Automated Mask Aligner

Manual Mask Aligner

Bottom-side Alignment (BSA)

Alignment of the structuring on the wafer back side with the structures on the front is required in processes involving applications such as MEMS, wafer-level packaging and 3D integration, where used for example to create vertical through silicon vias (TSVs) on interposers. Optical bottom side alignment is normally used for this type of alignment. An integrated camera system detects the mask structures and the structures on the wafer back side and aligns them with each other. The wafer position has to be determined and stored prior to loading, since the wafer afterwards conceals the mask target. This places specialized demands on the alignment system as a whole.

Features and Benefits

  • With its outstanding level of mechanical precision and stability, the SUSS mask aligner offers unmatched accuracy.

Available for:

Automated Mask Aligner

Semi-Automated Mask Aligner

Manual Mask Aligner

Infrared Alignment

Multilayer wafer stacks are used in a number of structuring processes. By means of infrared (IR) illumination, the alignment marks that in the typical case are embedded between the layers can be identified and aligned.

Alignment can also be done using IR light based on such embedded marks. These require the use of materials that are transparent for IR light, such as undoped silicon, III-V semiconductors (e.g. GaAs) and adhesives for temporary bonding and debonding techniques.  Specific cases should be tested to verify process feasibility.

In order to ensure availability of IR alignment to the greatest possible extent, the SUSS mask aligner can be optionally equipped with powerful IR light sources and high performance camera systems.

Highlights

  • Powerful IR light sources and high performance camera systems.

Available for:

Automated Mask Aligner

Semi-Automated Mask Aligner

Manual Mask Aligner

Fusion Bonding

Fusion bonding refers to spontaneous adhesion of two planar substrates. The process involves rinsing the polished discs and rendering them largely hydrophilic, then placing them in contact and tempering them at high temperatures. Plasma pretreatment allows the substrates to be bonded at room temperature.

Available for:

Automated Bonder

Semi-Automated Bonder

Semi-Automated Bond Aligner

Semi-Automated Mask and Bond Aligner

 

  • Software for pattern recognition
  • Assisted and auto alignment
  • Automatic wedge error compensation
  • Ergonomic and straight-forward operation thanks to an intuitive, Windows-based interface

Infrared Alignment

Multilayer wafer stacks are used in a number of structuring processes. By means of infrared (IR) illumination, the alignment marks that in the typical case are embedded between the layers can be identified and aligned.

Alignment can also be done using IR light based on such embedded marks. These require the use of materials that are transparent for IR light, such as undoped silicon, III-V semiconductors (e.g. GaAs) and adhesives for temporary bonding and debonding techniques.  Specific cases should be tested to verify process feasibility.

In order to ensure availability of IR alignment to the greatest possible extent, the SUSS mask aligner can be optionally equipped with powerful IR light sources and high performance camera systems.

Highlights

  • Powerful IR light sources and high performance camera systems.

Available for:

Automated Mask Aligner

Semi-Automated Mask Aligner

Manual Mask Aligner

Wafer preparation for fusion bonding processes is a frequent plasma treatment application using the SELECT plasma tool from SUSS MicroTec. Pre-treatment ensures superior bond quality and at the same a high bond yield.

In wet chemical and/or plasma processes, organic and particle contamination is removed, while the bonding surface is also rendered reactive, thus allowing stronger bonds to be achieved. Following these pre-treatment steps, post-bonding annealing can take place at temperatures far below 450 °C, This ensures the CMOS compatibility of the bonding process.

Highlights

  • Minimal thermal stress on wafers and components
  • Superior bonding forces
  • Reduced temperatures provide greater flexibility in the choice of materials

Available for:

Semi-Automated Mask Aligner

Semi-Automated Bond Aligner

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In a joint development project, SUSS MicroTec and Fraunhofer IST have developed a technology for local plasma treatment that allows the selective activation of micrometer-size wafer areas where functional layers can be deposited. The technique opens up new options for designing and manufacturing components, in particular for MEMS applications such as microfluidic channels, biochip manufacturing and component encapsulation.

Highlights

  • Protection of sensitive components
  • Cost-effective selective activation in the place of additional masking steps

Available for:

Semi-Automated Mask Aligner

Semi-Automated Bond Aligner

Download:

Downloads
BA8 Gen4 Pro Datasheet 243kb
SUSS Product Portfolio 1000kb
SELECT Brochure 368kb
Publications

SUSS Smile Technology – Large Area Imprint.
A Solution for Patterning of Micro and Nano Features

SUSS Smile Technology – Large Area Imprint.
A Solution for Patterning of Micro and Nano Features

Technical Publications
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