MA100/150e Gen2 Mask Aligner

提高化合物半導體產量之專用光罩對準曝光機解決方案

SUSS MicroTec專為化合物半導體製程所設計的光罩對準曝光機 MA100/150e Gen2,能處理高亮度 LED (HB-LED)、功率元件、RF-MEMS 等重要的化合物半導體製程。MA100/150e Gen2 具備高度精準的對準功能,可為易碎、翹曲、透明的晶圓,進行客製化基材處理,還可輔以高達 0.7µm 的高解析度光學系統,使 MA100/150e Gen2 可解決LED製程上目前的難題,協助您進一步縮減製程成本及提高生產效率,並克服 LED 製程上的各種微影挑戰。

亮点

專為 HB-LED、供電裝置、RF-MEM 等而設計的專用光罩對準曝光機解決方案

可同時處理三片晶圓能力,可提供每小時高達 145 片晶圓的生產率(包含自動對準及曝光)

SUSS 繞射式光學元件能以近接式曝光, 解決解析度方面的挑戰(在四吋晶圓上, 薄膜光阻的曝光間距為 20µm , 可小至 3µm L/S

可提供多尺寸的配件,減少更改晶圓尺寸的時間

非接觸式預先對準能防止晶圓損壞

The 'Line Alignment' function for sapphire wafers aligns scribe lines precisely to the photo mask

SUSS MicroTec Mask Aligner MA 150 Gen2

MA100/150e Gen 2 可透過SUSS MicroTec 經生產驗證的光罩對準曝光機設計,為新的裝置設計提供卓越的製程擴充能力,並可加速上市時間,同時可提供領先於業界,每小時 145 片晶圓的高生產率,協助您縮短生產週期時間。

經過優化設計後的MA100/150e Gen2,可針對上至四英吋的小尺寸晶圓。該系統可穩定提供小至 ±0,7 µm (DirectAlign) 的對準精準度,而選配的背面對準系統 (Bottomside alignment, BSA) 則可提供小至 ±1.5 µm 的對準精準度。MA100/150e 的對準裝置是專為 LED 製程的特殊需求而量身設計,即便是透明和表面粗糙的晶圓,亦能提供卓越的對比度。

Top-Side Alignment (TSA)

Where lithographic processes require the alignment of structures on only one side of the device wafer (e.g. RDL, micro-bumping and similar techniques), top-side alignment is used to align the fiducials on the mask with those of the wafer. Depending on the substrate properties, this can be achieved either using stored position data for the wafer or through live image alignment, as with the DirectAlign® system invented by SUSS MicroTec.

Highlights

  • Mask aligner for the highest level of alignment precision
  • Clear and stable pattern recognition even under poor contrast conditions

Available for:

Automated Mask Aligner

Semi-Automated Mask Aligner

Manual Mask Aligner

Bottom-side Alignment (BSA)

Alignment of the structuring on the wafer back side with the structures on the front is required in processes in the field of MEMS, wafer-level packaging, 3D integration and imprint applications. Optical bottom-side alignment is normally used for this type of alignment. An integrated camera system detects the mask or stamp structures and the structures on the substrate back side, and aligns them with each other. The substrate position must be determined and stored prior to loading, since the substrate subsequently covers the mask target. This places specialized demands on the alignment system as a whole.

Highlights

• With its outstanding level of mechanical precision and stability, the SUSS mask aligner offers unmatched accuracy

Available for:

Automated Mask Aligner

Semi-Automated Mask Aligner

Manual Mask Aligner

Enhancing Alignment Precision

When stringent demands are made of overlay accuracy, the auto-alignment functionality of the standard system can be considerably extended. DirectAlign®, the SUSS MicroTec enhanced functionality for structure detection software, uses live images instead of patterns from an image memory system. The technology is based on the PatMax industry standard and achieves outstanding results. With the use of DirectAlign® on a SUSS mask aligner, an accuracy of 0.25 µm can be achieved.

The use of enhanced alignment is recommended for challenging alignment processes with structures that are easily confused or restricted fields of view.

Available for:

Automated Mask Aligner

Semi-Automated Mask Aligner

Infrared Alignment

Multilayer wafer stacks are used in a number of structuring processes. The alignment marks that are normally embedded between the layers can be identified and aligned via infrared (IR) illumination. This requires the use of materials that are transparent for IR light, such as undoped silicon, III-V semiconductors (e.g. GaAs) and adhesives for temporary bonding and debonding techniques.  
The SUSS equipment can be optionally equipped with powerful IR light sources and high-performance camera systems, ensuring optimal IR availability.

Highlights

  • Powerful IR light sources and high-performance camera systems.

Available for:

Automated Mask Aligner

Semi-Automated Mask Aligner

Manual Mask Aligner

A mask with a certain structure is aligned with the wafer in very close proximity (thus “proximity” lithography). During exposure, the shadow cast by the mask structure is transferred to the wafer. The resulting exposure quality depends on both the precision with which the mask and wafer are spaced apart and the optical system used for exposure.
Being fast and suited to flexible implementation, this method is regarded as the most cost-effective technique for producing microstructures down to 3 µm in size. With contact exposure, resolutions in the sub-micron range can be achieved. Typical areas of use include wafer-level chip-scale packaging, flip chip packaging, bumping, MEMS, LED and power devices. The systems are deployed in high-volume production, as well as in industrial research.
The mask aligners supplied by SUSS MicroTec are based on proximity lithography.

Highlights

  • Superior resolution as a result of diffraction-reducing optics
  • Process stability through the use of microlens optical systems

Available for:

Automated Mask Aligner

Semi-Automated Mask Aligner

Manual Mask Aligner

The lower the exposure gap from mask to wafer, the higher the resolution. In soft contact mode, the wafer is brought into contact with the mask and is fixed onto the chuck with vacuum.

Available for:

Automated Mask Aligner

Semi-Automated Mask Aligner

Manual Mask Aligner

In hard contact mode, the wafer is brought into direct contact with the mask, while positive nitrogen pressure is used to press the substrate against the mask. A resolution in the 1 micron range is possible in hard contact mode.

Available for:

Automated Mask Aligner

Semi-Automated Mask Aligner

Manual Mask Aligner

In this mode, a vacuum is drawn between mask and substrate during exposure. This results in a high resolution of < 0.8 µm.

Available for:

Automated Mask Aligner

Semi-Automated Mask Aligner

Manual Mask Aligner

The large gap optics (LGO) optics is optimized for thick resist processes with large exposure gaps and 3D lithography, offering a resolution down to 5μm. The high resolution optics (HR) is apt for contact and close proximity lithography with structures down to 3μm at 20μm exposure gap. For processes with high dose requirements on 150 mm wafers the exceptionally high intensity of the W150 HR optics facilitates high throughput.

Available for:

Automated Mask Aligner

Semi-Automated Mask Aligner

Manual Mask Aligner

Diffraction-reducing exposure optics are designed to compensate for diffraction effects in both contact and proximity lithography. Instead of using a plane wave as in other proximity lithography tools, it provides an angular spectrum of planar light waves to reduce diffraction effects. The selection of a proper angular spectrum improves structure resolution in the resist.

Available for:

Automated Mask Aligner

Semi-Automated Mask Aligner

Manual Mask Aligner

MO Exposure Optics® is a unique illumination optics system specifically designed for SUSS mask aligners. It is based on microlens plates instead of macroscopic lens assemblies. A simple plug and play changeover allows a quick and easy changeover between different angular settings, including the functionality of both classical SUSS HR (High Resolution) and LGO (Large-Gap Optics) illumination optics.
The telecentric illumination provided by MO Exposure Optics improves light uniformity and leads to a larger process window. Yield enhancements are produced as a result. MO Exposure Optics also decouples the exposure light from the lamp source, so small misalignments of the lamp do not affect light uniformity. A decoupled light source saves setup and maintenance time and guarantees uniform illumination conditions during the entire lifetime of the lamp.

Highlights

  • Excellent light uniformity over full exposure field
  • Stable light source
  • Customizable illumination by means of illumination filter plate exchange
  • “Deep-UV-ready” process capabilities with fused silica micro-optics
  • Special “downsizing kits” for light compression to smaller wafer sizes

Available for:

Automated Mask Aligner

Semi-Automated Mask Aligner

Manual Mask Aligner

Innovative light source
The new lamp house concept from SUSS MicroTec convinces with efficiency — UV-LED light sources reach many times the service life of conventional mercury vapor lamps. Moreover, they no longer need to warm up and cool down — the LED is only switched on during exposure. These factors significantly contribute to comparatively low energy consumption. In contrast with mercury vapor lamps, no cumbersome disposal of hazardous waste is required.
The SUSS UV-LED lamp house features the latest in technology and therefore meets the growing demand for environmental sustainability and energy efficiency.

Cost-effectiveness
The use of an LED lamp house significantly affects the operating costs of a mask aligner. The service life of an LED exceeds that of conventional lamps many times over, thereby lowering costs generated by changing lamps. Downtimes, the acquisition of new lamps, adjustments and the disposal of old material have all become a thing of the past.

Guaranteed process flexibility
Compared to conventional mercury vapor lamps, LED light sources not only work more efficiently but are also much more flexible to use. The UV-LED lamp house generally covers the same spectral region as mercury vapor lamps. The difference is that the UV-LED can switch specific wavelengths on and off. This eliminates the need to optically filter the light outside of the lamp house. Wavelengths are regulated via a programmed recipe which fulfills specific process requirements without filter change or recalibration.
When interacting with SUSS MicroTec's special MO Exposure Optics, the LED lamp house provides for maximum flexibility in process design.

Safety
Working with the LED lamp house is both safe and environmentally sound, and is a major step forward in health and occupational safety, as well as environmental protection.

Highlights

  • Lower energy consumption
  • Longer service life
  • No downtime or readjusting when changing lamps
  • No disposal of hazardous waste
  • Low maintenance thanks to reduced complexity

Available for:

Automated Mask Aligner

Semi-Automated Mask Aligner

SUSS mask aligners are equipped with an enhanced WEC head system providing additional functionality. By direct and instant gap measurement during the stacking process, the parallelism between substrate and substrate, mask or stamp is reached with micrometric precision. This enables significant improvements in resolution compared to mechanical gap measurement.

Available for:

Automated Mask Aligner

Semi-Automated Mask Aligner

Manual Mask Aligner

Auto-alignment is based on a motorized alignment stage. The COGNEX® based pattern recognition software automatically recognizes wafer target locations and controls the movement of the alignment stage. Coupled with SUSS MicroTec‘s DirectAlign®, accuracy to 0.25 μm (0.5 µm for production tools) can be achieved. Auto-alignment enables highest repeatability of process results coupled with optimized throughput and minimum operator intervention.

Available for:

Automated Mask Aligner

Semi-Automated Aligner

Overlay accuracy regularly suffers considerable degradation due to the thermal run-out between photomask and the wafer. The SUSS MicroTec compensation system ThermAlign® ensures a constant temperature on the wafer chuck and additionally provides a stabilizing influence on the mask temperature. ThermAlign® compensates for run-out effects by adapting the temperature to the process conditions.

Available for:

Automated Mask Aligner

Implementation with Dark Field Masks

Large clearfield alignment is used in dark field mask applications. These contain very small clearfields, which means the targets on the wafer are difficult to localize. The large clearfield method allows the mask to be moved out of the visual field and so the target on the wafer is localized without being obscured by the mask itself.

Available for:

Automated Mask Aligner

Error rate reduction

For the alignment of specific challenging process requirements SUSS MicroTec offers the enhanced alignment function package which significantly reduces the error rate based on redundancy.

For situations where the alignment marks are damaged the system offers the option of defining replacement positions. Furthermore, it enables a two-stage final alignment process to be carried out which consists of an initial coarse alignment using guide marks followed by a fine alignment carried out using the same marks.

The use of enhanced alignment is recommended for complex processes with easily confused structures, such as with advanced packaging, for example, or with restricted fields of view, such as with dark-field masks.

Available for:

Automated Mask Aligner

Simulation of lithographic processes

A simulation of lithographic processes makes the selection of optimal settings for process parameters possible without long-winded trial and error sessions. The multi-functional simulation software of lithographic processes “Lab”, which SUSS MicroTec distributes together with the supplier, GenISys, first and foremost allows the operator better process control. It offers all the required simulation functionality for an integrated design and process development, as well as verification and optimization. At the same time it covers all the process steps from illumination shaping and mask layout optimization up to photo resist processing. Additionally, modern 3D simulation functions improve the model visualizations.

The combination of MO Exposure Optics and the for SUSS optics custom-developed optical models in Lab facilitates customer-specific design optimization of the exposure filter plates, which in turn leads to an improvement in pattern fidelity.

Highlights

  • Complete simulation of the mask aligner lithographic process
  • Adjustable illumination parameters (collimation, spectral composition), custom-developed for all SUSS optics
  • Fast and flexible visualization and quantitative predictions in 1, 2 and 3D

Available for:

Automated Mask Aligner

Semi-Automated Mask Aligner

Manual Mask Aligner

Customer Specific Illumination Shaping and Mask Layouts

Combining optimization of mask layouts and the light source (source mask optimization), a procedure from projection lithography, makes it possible to reduce pattern inaccuracies due to illumination errors, processing artifacts and diffraction. A combined selection to match the exposure filter plates with the mask patterns (OPC = optical proximity correction) to customer specific requirements allows considerable expansion of the lithographic process functionality.

A simulation platform permits modeling of process parameters such as mask patterns and illumination parameters. This facilitates the exposure and mask patterns to be set for specific production situations with a reduced experimental effort, and reduces illumination and process errors.

Source mask optimization, together with SUSS MicroTecs customizable MO Exposure Optics® form an important contribution to improvement of process stability in mask aligner lithography.

Highlights

  • Stabilization of the light source utilizing MO Exposure Optics®
  • Optimization of the light source with exchangeable exposure filter plates
  • Mask optimization with optical proximity correction (OPC)

Available for:

Automated Mask Aligner

Semi-Automated Mask Aligner

選配 : Others

Handling Fragile and Bent Substrates

Handling wafers is the major challenge when automating production processes. In a production environment with high process change rates and therefore a large number of different substrates, for example in foundry production, the handling systems have to meet rapidly changing requirements. The reliability of the automatic handling has a direct effect on through-put and yield. SUSS mask aligners have a choice of flexibly interchangeable special tooling for handling the widest range of fragile, bent or warped substrates, and the tooling can be customized even further for particularly arduous production processes according to customer specifications.

Handling of Thinned Wafers
A special vacuum chuck supports ultra-thin wafers with thicknesses of less than 120 µm and down to 50 µm.

Handling of Warped Wafers
Bent and warped wafers are carefully pulled flat before alignment and exposure. Due to the variety of the parameters that affect it, an optimal tooling implementation requires adaptation for the specific substrate.

Edge Handling
A special carrier system protects the wafer, especially suitable for the protection of double-sided structures as for MEMS applications. 

Available for:

Automated Mask Aligner

Downloads
MA100/150e Gen2 Datasheet 315kb
SUSS Product Portfolio 3179kb
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