SÜSS MicroTec 的半自動化投影式掃描曝光機 DSC500 可支援尺寸 450mmx450mm 以內的基板。
1:1-寬光譜投影鏡面 (Wynn Dyson)
可使用晶圓 / 基板尺寸最大至 450mm x 500mm
可變數位孔隙 (NA) 0.07 至 0.14
Projection exposure entails aligning the mask with the wafer. The mask pattern is subsequently projected onto the wafer by means of an optical system between the mask and the wafer. With this process, usually only a portion of the wafer is exposed. By repeating the process incrementally ("step and repeat") or through a continuous process ("scanning"), the wafer is completely exposed. The type and the characteristics of the projection optics are decisive factors for resolution and depth of focus and thus for the effectiveness of the exposure.
The projection scanner technology offered by SUSS MicroTec utilizes the combined advantages of full-field exposure and conventional projection lithography, and serves as an alternative to mask aligners and conventional projection steppers. Projection scanning involves aligning a full-field mask with the substrate and then projecting the mask pattern onto the substrate by means of scanning. Scanning technology achieves greater throughput than stepper processes, while at the same time reducing system costs and achieving resolutions down to 3 µm.
Projection scanning offers the greatest advantage in processes requiring high resolutions or where high topography and thick resist coatings are involved.
Features & Benefits