EMPC 2025

From September 16 to 18, 2025, the European Microelectronics & Packaging Conference (EMPC 2025) will take place at the World Trade Center in Grenoble, France. As one of the leading international events in microelectronics and packaging technologies, EMPC brings together industry experts and researchers to showcase the latest trends and innovations in semiconductor packaging. We are pleased to announce that our partner, ElectronMec, will be exhibiting at EMPC 2025 with their own booth. ElectronMec will be your dedicated contact for all SUSS products and solutions, presenting the newest advancements from our portfolio. Take this opportunity to connect with ElectronMec on-site and discover how our cutting-edge technologies can support your business needs. We look forward to welcoming you at EMPC 2025!