Glossary

  • 3D Integration
  • Advanced Packaging
  • Backend
  • Bonding
  • Bump
  • Chip
  • Coater
  • Compound semiconductor
  • Die
  • Flip chip bonding
  • Foundry
  • Frontend
  • IC
  • LED
  • Lithography
  • Mask
  • Mask Aligner
  • MEMS
  • Microsystems Technologies
  • Photoresist
  • Semiconductor
  • Sensor
  • Silicon
  • Spin/ Spray Coaters
  • Substrate Bonder
  • Through-silicon vias (TSVs)
  • Wafers
  • Wire bonding