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Spin Coater, Spray Coater, Developer

Meeting Your Needs with Comprehensive Coating and Developing Solutions

SUSS MicroTec spin coaters and spray coaters have become synonymous with premium performance, ease of use, flexibility and enhanced coating mastery. With a complete line of compact and user-friendly resist coating equipment from economic low-volume laboratory tools to high-end production systems up to 300 mm SUSS MicroTec spin coaters and spray coaters enable the formation of resist layers ranging from below 1 µm to over 500 µm.


Automated Coater and DEVELOPER

ACS300 Gen3 Coater & Developer

Automated Platform for Wafers of up to 300mm

ACS300 Gen2 Coater & Developer

Automated Platform for Wafers of up to 300mm

ACS200 Gen3 Coater & Developer

Automated Platform for Wafers up to 200mm


Semi-Automated Coater and DEVELOPER

RCD8 Coater & Developer

Resist Coat and Develop Platform

AD12 Developer

Flexible Solution for Aqueous Development and Cleaning

SD12 Developer & Cleaner

Flexible Solution for Solvent Development and Cleaning


Manual Coater and DEVELOPER

AS8 and AS12 Coater

Manual Spray Coater for High Topographies

LabSpin Series Spin Coater & Developer

Laboratory Spin Coat and Develop Solution for Wafers up to 150 and 200mm

HP8 Hot Plate

Hot Plate Designed for R&D, Laboratories and Small Scale Production



Spin coating is the process of evenly coating a spinning substrate with a solution. The solution, for instance a photosensitive resist, is dispensed at the center of the wafer. Subsequent acceleration as well as the rotation speed and the time allotted to the individual steps ensure that a homogeneous layer thickness remains after excess resist is spun off. Alongside the process parameters, the physical properties of the solution or photoresist determine the thickness of the applied film.

SUSS MicroTec’s patented GYRSET technology provides cutting-edge advantages. The GYRSET principle entails synchronous rotation of the process chamber during coating, in this way effectively reducing air turbulence over the rotating substrate. The atmosphere within the closed chamber becomes more quickly saturated with solvents, so that the resist dries more slowly and is thus distributed more evenly over the substrate. This results in significant savings in terms of required material.

Spin coating is limited in use to structures without high topography.

Features and Benefits

  • Spin coating: a simple and widely used technique
  • Patented GYRSET technique reduces the material required and cuts costs

Available for:

Automated Coater and Developer

Semi-Automated Coater and Developer

Spray coating involves spray application of the solution to the wafer through a nozzle. The path traveled by the nozzle over the wafer is optimized to ensure that the coating is applied evenly to the substrate. The solutions used in spray coating usually feature a very low viscosity, which guarantees that fine droplets form.

Spray coating ensures a uniform layer even with high topography substrates, making it the preferred technique for structures of this kind. Even square substrates can be easily coated using the spray technique.

Features and Benefits

  • Uniform coating even of highly structured surfaces

Available for:

Automated Coater and Developer

Semi-Automated Coater

Puddle developing involves dispensing a defined quantity of developer to the exposed substrate, gently spinning it to spread the developer. Due to the surface tension of the developing agent, a convex puddle is formed on the wafer. Once developing time is completed, the wafer is rotated quickly to spin off the developer agent. The wafer is subsequently rinsed with deionized water and dried, once again at a high rotation speed. The main advantage of the technique is that only very little developing agent is required while maintaining excellent process results.

Puddle developing is no longer feasible when the developing agent becomes saturated, for example when a large quantity of photoresist needs to be removed or a high structural topography prevents exchange of the developer. In such cases, a multi-stage puddle developing process or spray developing is used.

Features and Benefits

  • Minimal chemical consumption

Available for:

Automated Coater and Developer

Semi-Automated Coater and Developer

Spray developing involves low-speed rotation of the substrate as it is developed. The exposed areas are continuously nozzle-sprayed with fresh developing agent to prevent the developer from becoming saturated. This technique offers advantages over puddle developing in processes involving thick photoresists and large surfaces to be developed. At the end of the process, the substrate is rinsed with deionized water and then spun dried.

Features and Benefits

  • Uniform developing of the entire wafer surface even with thick resist layers

Available for:

Automated Coater and Developer

Semi-Automated Coater and Developer

Technical Publications