BA Gen4 Series Bond Aligner

Precise alignment for all bond processes

The bond aligner BA Gen4 is designed for manual alignment and subsequent bonding of substrates up to 200 mm in size. Further functionality becomes available after the optional addition of mask aligner tooling. The BA Gen4 series is utilized in advanced packaging, MEMS production and whenever sub-micron precise alignment and high precision repeatability are required.

Highlights

Excellent alignment accuracy

Low cost of ownership

Easy system expansion

The alignment process from wafer to wafer on the BA Gen4 Series is based on the same high-performance technology which has proven itself in the SUSS MicroTec mask aligners for aligning masks to wafers. With fusion bonding of silicon substrates the BA Gen4 series offers additional functionality. Available for further bonding operations: the SUSS MicroTec manual bonder SB6/8 Gen2. A special BA Gen4 fixture system ensures reliable transport of the wafer package.

The manual operation of the BA Gen4 series and the easy switch between options allows the operator to be highly flexible for applications in the most wide-ranging research and development processes. The choice of possible alignment operations allows a wide range of process requirements to be covered. The operator is supported by automated features such as on-screen structure visualizations and automatic wedge error compensation.

Details: Alignment Technology

Where lithographic processes require the alignment of structures on only one side of the device wafer (e.g. RDL, microbumping and similar techniques), top-side alignment is used to align the fiducials on the mask with those of the wafer. Depending on substrate properties, this can be achieved either using stored position data for the wafer or through live image alignment, as in the DirectAligntm system invented at SUSS MicroTec. 

Highlights

  • Mask aligner for the highest level of alignment precision
  • Clear and stable pattern recognition even under poor constrast conditions

Available for:

Automated Mask Aligner

Semi-Automated Mask Aligner

Manual Mask Aligner

Bottom-side Alignment (BSA)

Alignment of the structuring on the wafer back side with the structures on the front is required in processes involving applications such as MEMS, wafer-level packaging and 3D integration, where used for example to create vertical through silicon vias (TSVs) on interposers. Optical bottom side alignment is normally used for this type of alignment. An integrated camera system detects the mask structures and the structures on the wafer back side and aligns them with each other. The wafer position has to be determined and stored prior to loading, since the wafer afterwards conceals the mask target. This places specialized demands on the alignment system as a whole.

Features and Benefits

  • With its outstanding level of mechanical precision and stability, the SUSS mask aligner offers unmatched accuracy.

Available for:

Automated Mask Aligner

Semi-Automated Mask Aligner

Manual Mask Aligner

Infrared Alignment

Multilayer wafer stacks are used in a number of structuring processes. By means of infrared (IR) illumination, the alignment marks that in the typical case are embedded between the layers can be identified and aligned.

Alignment can also be done using IR light based on such embedded marks. These require the use of materials that are transparent for IR light, such as undoped silicon, III-V semiconductors (e.g. GaAs) and adhesives for temporary bonding and debonding techniques.  Specific cases should be tested to verify process feasibility.

In order to ensure availability of IR alignment to the greatest possible extent, the SUSS equipment can be optionally equipped with powerful IR light sources and high performance camera systems.

Highlights

  • Powerful IR light sources and high performance camera systems.

Available for:

Automated Mask Aligner

Semi-Automated Mask Aligner

Manual Mask Aligner

Details

Fusion Bonding

Fusion bonding refers to spontaneous adhesion of two planar substrates with a dielectric material (typically silicon oxide) as the bonding layer. The process usually involves a proper surface activation that renders the substrates to be largely hydrophilic. Subsequently the substrates are aligned, brought into contact and finally tempered at elevated temperature.

Available for:

Automated Bonder

Semi-Automated Bonder

Semi-Automated Bond Aligner

Semi-Automated Mask and Bond Aligner

  • Software for pattern recognition
  • Assisted and auto alignment
  • Automatic wedge error compensation
  • Ergonomic and straight-forward operation thanks to an intuitive, Windows-based interface
OPTIONS

Infrared Alignment

Multilayer wafer stacks are used in a number of structuring processes. By means of infrared (IR) illumination, the alignment marks that in the typical case are embedded between the layers can be identified and aligned.

Alignment can also be done using IR light based on such embedded marks. These require the use of materials that are transparent for IR light, such as undoped silicon, III-V semiconductors (e.g. GaAs) and adhesives for temporary bonding and debonding techniques.  Specific cases should be tested to verify process feasibility.

In order to ensure availability of IR alignment to the greatest possible extent, the SUSS equipment can be optionally equipped with powerful IR light sources and high performance camera systems.

Highlights

  • Powerful IR light sources and high performance camera systems.

Available for:

Automated Mask Aligner

Semi-Automated Mask Aligner

Manual Mask Aligner

Downloads
SUSS Product Portfolio 2434kb
Technical Publications
Service