XBC300 Gen2 D2W
With the XBC300 Gen2 D2W platform, SUSS presents a fully automated solution for precise die-to-wafer hybrid bonding on 200mm and 300mm substrates. The platform was engineered in close partnership with SET Corporation SA and meets the most demanding inter-die spacing requirements. An industry-leading footprint and post-bond accuracy of less than 200nm specifically address the requirements of advanced 3D IC architecture, especially for high-bandwidth memory applications. The XBC300 Gen2 D2W platform not only enables lower yield loss, as well as an increased purity, but also improves process control in manufacturing.
Developed in close collaboration with our cooperation partner SET.
Explore our new solution by clicking on the green dots
Highlights
- D2W transfer with very low inter-die spacing at maximum yield
- Integrated state-of-the-art flip-chip die bonder from SET Corporation SA
- Closed-loop feedback between integrated metrology and bond aligner
The XBC300 Gen2 D2W is tailored to meet the precise needs of R&D lines or RTOs (research and technology organizations) that want to focus on sequential hybrid bonding. The new platform features an state-of-the-art NEO HB die bonder from technology partner SET Corporation SA, offering +/-100nm alignment accuracy. A high-precision and throughput-optimized metrology station enables in-line verification of the alignment accuracy of D2W bonds across all processes. Based on the XBC300 Gen2, an industry-renowned platform used by well-known major IDM customers in the field of temporary bonding, the XBC300Gen2 D2W allows for handling extremely thin microchips on tape frame carriers.