MA200 Gen3 Mask Aligner
Alignment and Exposure for a Multitude of Applications
Especially designed for high volume production the MA200 Gen3 mask aligner is suited for automated processing of square substrates and wafers up to 200 mm. It combines leading-edge 1x lithography technology with a variety of innovative features making it the system of choice for thick resist MEMS applications, 3D patterning over topography and advanced packaging applications such as 3D packaging, fan-out, bumping as well as compound semiconductor and image sensors.
- Leading process stability
- Unmatched throughput for thick materials
- Process flexibility for a multitude of applications
The MA200 Gen3 offers intelligent solutions for a large range of process requirements. Its various alignment options, flexible optics, and special add-ons make it an all-purpose tool for multiple handling and processing needs.
A high level of automation, e.g. with an optional automatic filter exchange unit, shortens valuable process times and significantly reduces the cost of ownership.
Ease of use has played a major role in the design of the MA200 Gen3. Features such as an adjustable monitor and an ergonomic I/O interface, a continuous-run load port, and a direct view on the exposure stage make it comfortable to work with the MA200 Gen3 even under a high workload.
With its wide range of add-ons, the MA200 Gen3 is easily adaptable for specific applications. The optional angular exposure system is designed for processing vertical sidewalls in thick resists. Special wafer handling tooling allows for the treatment of sensitive substrates.
Check further options of the MA200 Gen3 for special processing needs.