SUSS MicroTec‘s LabSpin platform represents the next generation of manual spin coater and developer systems that have been developed specifically for laboratory and R&D. Designed for a variety of photolithography chemicals, LabSpin systems provide uniform, precise and repeatable spin coating results on the wafer through its advanced process chamber design.
Large process variety including spin coating and puddle developing
Edge bead removal
Dispense positioning is flexibly adjustable, from central dispensing to edge coating
The LabSpin is available in two versions, as a table-top unit and as a built-in unit. Built-in platforms are designed for integration into a wet bench, a glove box or are used in the SUSS LabCluster. LabSpin6 is suitable for round substrates up to 150 mm diameter or square substrates up to 100x100mm. LabSpin8 is suitable for round substrates up to 200 mm diameter or square substrates up to 150x150mm. With a wide range of substrate holders, even fragments and special shapes can be processed without any problems. The LabSpin platform is characterized by a compact and space-saving design and requires little clean room space.
The large variety of LabSpin options allows a very wide range of applications. Coatings can be applied manually with syringes, semi-automatically with cartridges or with up to two fully automatic dispensing systems. In addition to edge coating, edge bead removal and puddle development, further options are available.
Spin-Coaten is an established and proven coating method for excellent results. Spin coating is the process of evenly coating a spinning substrate with a solution. The solution, for instance a photosensitive resist, is dispensed at the center of the wafer. Subsequent acceleration as well as the rotation speed and the time allotted to the individual steps ensure that a homogeneous layer thickness remains after excess resist is spun off. Alongside the process parameters, the physical properties of the solution or photoresist determine the thickness of the applied film.
Puddle developing involves dispensing a defined quantity of developer to the exposed substrate, gently spinning it to spread the developer. Due to the surface tension of the developing agent, a convex puddle is formed on the wafer. Once developing time is completed, the wafer is rotated quickly to spin off the developer agent. The wafer is subsequently rinsed with deionized water and dried, once again at a high rotation speed. The main advantage of the technique is that only very little developing agent is required while maintaining excellent process results.
Puddle developing is no longer feasible when the developing agent becomes saturated, for example when a large quantity of photoresist needs to be removed or a high structural topography prevents exchange of the developer. In such cases, a multi-stage puddle developing process or spray developing is used.
Features and Benefits
Beside some overall requirements all labs have different needs which arise from their specialized topics. This is why SUSS MicroTecs LabSpin tools are well designed and rock solid built basic coaters but can be equipped with various carefully selected options.
This configurator will guide you in a few easy steps to your perfect new lab tool.