XBC300 Gen2 Debonder & Cleaner
Open Platform for More Flexibility
The XBC300 Gen2 debonder and cleaner platform is designed for processing wafers of 200 and 300 mm in size as well as oversized carriers. Sophisticated processing allows for handling of tape mounted device wafer as thin as 50 µm or even below. Its advanced process versatility reaches from mechanical peel-off and excimer laser-assisted debonding to cleaning capabilities for thinned wafer and carrier wafer. Hereby the XBC300 Gen2 offers a comprehensive solution for 2.5D and 3D integration applications. The SUSS XBC300 Gen2 Debonder and Cleaner platform is designed for process development as well as high volume manufacturing. It offers both, low cost of ownership and process flexibility with full automation.
Highlights
- Open platform supporting various materials and technologies
- Room temperature debonding technologies
- Tape mounted thin wafer cleaning with tape protection
- High throughput
The XBC300 Gen2 offers a range of module options specifically designed for debonding and cleaning applications. The separation of the carrier from the device wafer is carried out well controlled with minimum stress on the device wafer by either mechanical peel-off or excimer laser-assisted debonding. The peel-off debond process is compatible with the largest choice of adhesives and release layers for mechanical debonding. The laser-assisted debond process is based on UV laser technology and light-transmissive carriers such as glass or sapphire. Cleaning functionalities comprise tape mounted thin wafer cleaning with tape protection and carrier cleaning with integrated backside rinse.
The configuration flexibility of XBC300 Gen2 supports low volume process development as well as high volume manufacturing. The modular cluster design, featuring Dock and Lock™ technology, easily allows upgrading additional process modules in the field in order to extend functionality or increase throughput for moving into volume production. The XBC300 Gen2 offers both, low cost of ownership and process flexibility with full automation.
The XBC300 Gen2 is the complementary equipment to the XBS300, SUSS MicroTec’s platform for temporary wafer bonding. The equipment prepares device wafers for wafer thinning and subsequent back side processing by bonding them to a carrier.
