XBC300 Gen2 Debonder & Cleaner

Open Platform for More Flexibility

The XBC300 Gen2 debonder and cleaner platform is designed for processing wafers of 200 and 300 mm in size as well as oversized carriers. Sophisticated processing allows for handling of tape mounted device wafer as thin as 50 µm or even below. Its advanced process versatility reaches from mechanical peel-off and excimer laser-assisted debonding to cleaning capabilities for thinned wafer and carrier wafer. Hereby the XBC300 Gen2 offers a comprehensive solution for 2.5D and 3D integration applications. The SUSS XBC300 Gen2 Debonder and Cleaner platform is designed for process development as well as high volume manufacturing. It offers both, low cost of ownership and process flexibility with full automation.

Highlights

Open platform supporting various materials and technologies

Room temperature debonding technologies

Tape mounted thin wafer cleaning with tape protection

High throughput

SUSS MicroTec Wafer Bonder XBC300 Gen2

The XBC300 Gen2 offers a range of module options specifically designed for debonding and cleaning applications. The separation of the carrier from the device wafer is carried out well controlled with minimum stress on the device wafer by either mechanical peel-off or excimer laser-assisted debonding. The peel-off debond process is compatible with the largest choice of adhesives and release layers for mechanical debonding. The laser-assisted debond process is based on UV laser technology and light-transmissive carriers such as glass or sapphire. Cleaning functionalities comprise tape mounted thin wafer cleaning with tape protection and carrier cleaning with integrated backside rinse.

The configuration flexibility of XBC300 Gen2 supports low volume process development as well as high volume manufacturing. The modular cluster design, featuring Dock and Lock™ technology, easily allows upgrading additional process modules in the field in order to extend functionality or increase throughput for moving into volume production. The XBC300 Gen2 offers both, low cost of ownership and process flexibility with full automation.

The XBC300 Gen2 is the complementary equipment to the XBS300, SUSS MicroTec’s platform for temporary wafer bonding. The equipment prepares device wafers for wafer thinning and subsequent back side processing by bonding them to a carrier.

 

Details
  • 200 and 300 mm tape mounted wafers and carrier wafers
  • Tape mounted device wafer as thin as 50 µm or even below
  • Oversized carriers with 201 or 301 mm in diameter
  • Various carrier materials
  • Excimer laser-assisted debonding
  • Mechanical peel-off
  • Cleaning of tape mounted thin wafers with tape protection
  • Puddle, spray or high-pressure dispense technologies
  • Cleaning of carrier wafer with integrated backside rinse
  • Puddle, spray or high-pressure dispense technologies
  • Media temperature control
Options: Modules

Mechanical peel-off debonding

The DB300T module is compatible with the largest choice of adhesives and release layers for mechanical debonding and different carrier materials, including glass and silicon. The propagation of the debond front is well controlled throughout the entire debond process so that the mechanical stress on the device wafer is kept to a minimum.

Available for:

Automated Debonder

Excimer laser-assisted debonding

The LD12 module uses Excimer laser technology to separate a glass carrier from the device wafer. A pulsed, high energy laser breaks the chemical bonds of a UV light-absorbing adhesive or release layer close to the carrier interface so that the carrier can be lifted-off with close to zero mechanical separation force.

Available for:

Automated Debonder

Thin wafer cleaning

The AR300TF cleaner module allows wet-chemical removal of adhesive or release layer residues from a thinned wafer that is mounted on tape. The module offers separate dispense arms for cleaning and rinse chemistry and offers a number of dispense options such as puddle, spray or high-pressure as well as N2 drying. A protective ring covers the tape and frame throughout the entire cleaning process.

Available for:

Automated Debonder

Carrier cleaning

The AR300 module allows puddle, spray or high-pressure cleaning of full thickness wafers as well as support carriers and offers separate dispense arms for cleaning and rinse chemistry. For cleaning of the backside of the carrier it features an integrated backside rinse.

Available for:

Automated Debonder

Downloads
SUSS Product Portfolio 2421kb
Publications

Excimer Laser Debonder for 2.5 and 3D Integration 

Excimer Laser Debonder for 2.5 and 3D Integration 

Temporary Bonding and Debonding - An Overview of Today‘s Materials and Methods

Temporary Bonding and Debonding - An Overview of Today‘s Materials and Methods

Technical Publications
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