The XBC300 Gen2 debonder and cleaner platform is designed for processing wafers of 200 and 300 mm in size as well as oversized carriers. Sophisticated processing allows for handling of tape mounted device wafer as thin as 50 µm or even below. Its advanced process versatility reaches from mechanical peel-off and excimer laser-assisted debonding to cleaning capabilities for thinned wafer and carrier wafer. Hereby the XBC300 Gen2 offers a comprehensive solution for 2.5D and 3D integration applications. The SUSS XBC300 Gen2 Debonder and Cleaner platform is designed for process development as well as high volume manufacturing. It offers both, low cost of ownership and process flexibility with full automation.
Open platform supporting various materials and technologies
Room temperature debonding technologies
Tape mounted thin wafer cleaning with tape protection
The XBC300 Gen2 offers a range of module options specifically designed for debonding and cleaning applications. The separation of the carrier from the device wafer is carried out well controlled with minimum stress on the device wafer by either mechanical peel-off or excimer laser-assisted debonding. The peel-off debond process is compatible with the largest choice of adhesives and release layers for mechanical debonding. The laser-assisted debond process is based on UV laser technology and light-transmissive carriers such as glass or sapphire. Cleaning functionalities comprise tape mounted thin wafer cleaning with tape protection and carrier cleaning with integrated backside rinse.
The configuration flexibility of XBC300 Gen2 supports low volume process development as well as high volume manufacturing. The modular cluster design, featuring Dock and Lock™ technology, easily allows upgrading additional process modules in the field in order to extend functionality or increase throughput for moving into volume production. The XBC300 Gen2 offers both, low cost of ownership and process flexibility with full automation.
The XBC300 Gen2 is the complementary equipment to the XBS300, SUSS MicroTec’s platform for temporary wafer bonding. The equipment prepares device wafers for wafer thinning and subsequent back side processing by bonding them to a carrier.
Mechanical peel-off debonding
The DB300T module is compatible with the largest choice of adhesives and release layers for mechanical debonding and different carrier materials, including glass and silicon. The propagation of the debond front is well controlled throughout the entire debond process so that the mechanical stress on the device wafer is kept to a minimum.
Excimer laser-assisted debonding
The LD12 module uses Excimer laser technology to separate a glass carrier from the device wafer. A pulsed, high energy laser breaks the chemical bonds of a UV light-absorbing adhesive or release layer close to the carrier interface so that the carrier can be lifted-off with close to zero mechanical separation force.
Thin wafer cleaning
The AR300TF cleaner module allows wet-chemical removal of adhesive or release layer residues from a thinned wafer that is mounted on tape. The module offers separate dispense arms for cleaning and rinse chemistry and offers a number of dispense options such as puddle, spray or high-pressure as well as N2 drying. A protective ring covers the tape and frame throughout the entire cleaning process.
The AR300 module allows puddle, spray or high-pressure cleaning of full thickness wafers as well as support carriers and offers separate dispense arms for cleaning and rinse chemistry. For cleaning of the backside of the carrier it features an integrated backside rinse.