The RCD8 coat and develop platform can be custom tailored anywhere from e.g. a basic manual spin coater to a GYRSET® enhanced coater and puddle developer tool. It can handle small pieces as well as standard wafers up to 200 mm and serves therefore ideally for daily R&D work up to small scale production.
Optional coating and developing in the same tool reduces footprint and capital investment
Maximized application variety for lowest cost of ownership
Ergonomic placement of all relevant elements for ease of use
Easy transfer of processes from the RCD8 platform to a SUSS production tool due to compatible design
All options are field upgradable
The RCD8 is the first tool that offers the option to convert from a spin coater with the patented GYRSET® closed cover coating technology to a developer within a few minutes.
With its large variety of available chucks and configurations, literally all kind of substrate materials and shapes can be coated and developed on the RCD8. The platform can be equipped with various well proven dispense line and pump configurations for handling resists with viscosities from <1 cps up to 55 000 cps.
Whenever changes are required over time, this versatile tool can be field upgraded with various options to perfectly match your future needs.
Spin coating is the process of evenly coating a spinning substrate with a solution. The solution, for instance a photosensitive resist, is dispensed at the center of the wafer. Subsequent acceleration as well as the rotation speed and the time allotted to the individual steps ensure that a homogeneous layer thickness remains after excess resist is spun off. Alongside the process parameters, the physical properties of the solution or photoresist determine the thickness of the applied film.
SUSS MicroTec’s patented GYRSET technology provides cutting-edge advantages. The GYRSET principle entails synchronous rotation of the process chamber during coating, in this way effectively reducing air turbulence over the rotating substrate. The atmosphere within the closed chamber becomes more quickly saturated with solvents, so that the resist dries more slowly and is thus distributed more evenly over the substrate. This results in significant savings in terms of required material.
Spin coating is limited in use to structures without high topography.
Features and Benefits
Puddle developing involves dispensing a defined quantity of developer to the exposed substrate, gently spinning it to spread the developer. Due to the surface tension of the developing agent, a convex puddle is formed on the wafer. Once developing time is completed, the wafer is rotated quickly to spin off the developer agent. The wafer is subsequently rinsed with deionized water and dried, once again at a high rotation speed. The main advantage of the technique is that only very little developing agent is required while maintaining excellent process results.
Puddle developing is no longer feasible when the developing agent becomes saturated, for example when a large quantity of photoresist needs to be removed or a high structural topography prevents exchange of the developer. In such cases, a multi-stage puddle developing process or spray developing is used.
Features and Benefits
Spray developing involves low-speed rotation of the substrate as it is developed. The exposed areas are continuously nozzle-sprayed with fresh developing agent to prevent the developer from becoming saturated. This technique offers advantages over puddle developing in processes involving thick photoresists and large surfaces to be developed. At the end of the process, the substrate is rinsed with deionized water and then spun dried.
Features and Benefits
SUSS MicroTec’s proprietary GYRSET® technology helps to significantly improve spin coating process results by improving the conditions during coating. With the help of a rotating cover a turbulence-free atmosphere, highly saturated with solvents, can be created. This not only makes the outcome more independent from the ambient temperature and humidity. It also substantially reduces the amount of material required to coat a wafer therefore being beneficial for environmental sustainability.
The GYRSET® technology is highly suitable for processing thick resists.