RCD8 Coater & Developer

Resist Coat and Develop Platform

The RCD8 semi-automated coater and developer platform is an outstanding tool for R&D and small-scale production and can be custom configured for each application.

The design of the RCD8 semi-automated coater and developer platform draws on SUSS MicroTec's expertise in large-scale production. It is built using the same high-quality components as SUSS MicroTec's full production assemblies. As such, the RCD8 coater and developer platform delivers top application quality with maximum reliability and repeat accuracy. Application-specific substrate chucks allow for the processing of various substrate materials and shapes. These range from square substrates measuring up to 150 x 150 mm and standard wafers up to 200 mm to special shapes up to a maximum size of 200 mm. 

Highlights

Maximum flexibility for applications

Customizable configuration

Safe and ergonomic use

High availability and process stability

SUSS MicroTec Developer RCD8

A fully equipped RCD8 works with SUSS MicroTec's GYRSET® technology and up to four dispenser systems. When equipped with a simple coater, the RCD8 can also manually process substrates in an open bowl variant. In its developer setup, the RCD8 can be configured as a puddle or spray developer.

Precision process management for optimal results

The RCD8 can be equipped with various tried-and-tested dispensing systems capable of handling photoresists with a viscosity from <1 cP to 55000 cP. Alongside cartridge-based and automated dispensing systems, the RCD8 also offers edge bead removal, back-side rinse and automated cleaning of nozzles and the process chamber. Up to four dispenser systems can be collated onto one programmable dispenser arm for exact positioning over the substrate and following the specific recipe.

The chuck is rated for maximum rotational speeds of up to 10,000 rpm (up to 12,000 rpm by request) with acceleration of 7,000 rpm/sec. Coating is performed automatically using a pressurized cartridge or a mechanical pump. Optional dosing system for functions such as back-side rinse and edge bead removal expand the potential range of applications. A motorized cartridge dispenser system enables significant material savings during tests or small-scale production, without sacrificing on the top-quality results.

The coater and developer also include a manual centering system for simple handling of substrates. By request, the substrate handling can also be enhanced with supplemental lift-pins in the substrate chuck. A large touchscreen and the battle-tested MMC software from the large scale production assembles ensure that the operator has full control at all times and can directly monitor the ongoing processes. A simple-to-use recipe editor allows for recipes to be composed and managed flexibly. This also means for example uncomplicated programming of recipe loops as needed. Recipes developed in the RCD8 can also be transferred to the fully automated coater and developer systems of the ACS200 platform.

A focus on the operator: protection and easy use

The industry's strong safety standards are reflected in the RCD8. Various modern sensor technologies as well as lockable hoods ensure that the operator is optimally protected. When the safety hood is open, fluids can be added manually during the process.

If changes or adjustments are required, the flexible platform can be upgraded with a variety of supplemented functions to optimally meet the future needs of the customer.

The RCD8 can also be integrated into the SUSS MicroTec LabCluster to incorporate additional functions such as baking and vapor priming as well as a series of configuration options.

Spin coating is the process of evenly coating a spinning substrate with a solution. The solution, for instance a photosensitive resist, is dispensed at the center of the wafer. Subsequent acceleration as well as the rotation speed and the time allotted to the individual steps ensure that a homogeneous layer thickness remains after excess resist is spun off. Alongside the process parameters, the physical properties of the solution or photoresist determine the thickness of the applied film.

SUSS MicroTec’s proprietary GYRSET technology provides cutting-edge advantages. The GYRSET principle entails synchronous rotation of the process chamber during coating, in this way effectively reducing air turbulence over the rotating substrate. The atmosphere within the closed chamber becomes more quickly saturated with solvents, so that the resist dries more slowly and is thus distributed more evenly over the substrate. This results in significant savings in terms of required material.

Spin coating is limited in use to structures without high topography.

Features and Benefits

  • Spin coating: a simple and widely used technique
  • Proprietary GYRSET technique reduces the material required and cuts costs

Available for:

Automated Coater and Developer

Semi-Automated Coater and Developer

Puddle developing involves dispensing a defined quantity of developer to the exposed substrate, gently spinning it to spread the developer. Due to the surface tension of the developing agent, a convex puddle is formed on the wafer. Once developing time is completed, the wafer is rotated quickly to spin off the developer agent. The wafer is subsequently rinsed with deionized water and dried, once again at a high rotation speed. The main advantage of the technique is that only very little developing agent is required while maintaining excellent process results.

Puddle developing is no longer feasible when the developing agent becomes saturated, for example when a large quantity of photoresist needs to be removed or a high structural topography prevents exchange of the developer. In such cases, a multi-stage puddle developing process or spray developing is used.

Features and Benefits

  • Minimal chemical consumption

Available for:

Automated Coater and Developer

Semi-Automated Coater and Developer

Options

SUSS MicroTec’s proprietary GYRSET® technology helps to significantly improve spin coating process results by improving the conditions during coating. With the help of a rotating cover a turbulence-free atmosphere, highly saturated with solvents, can be created. This not only makes the outcome more independent from the ambient temperature and humidity. It also substantially reduces the amount of material required to coat a wafer therefore being beneficial for environmental sustainability.

The GYRSET® technology is highly suitable for processing thick resists.

Highlights

  • Prevents back-side contamination
  • Little surface roughness
  • Improves surface planarity
  • Reduces chemical consumption 

Available for:

Automated Coater and Developer

Semi-Automated Coater and Developer

Downloads
RCD8 Datasheet 661kb
SUSS Product Portfolio 2243kb
Publications

Polyimide based Temporary Wafer Bonding Technology for High Temperature Compliant TSV Backside Processing and Thin Device Handling

Polyimide based Temporary Wafer Bonding Technology for High Temperature Compliant TSV Backside Processing and Thin Device Handling

Technical Publications
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