Wafer Bonder

SUSS MicroTec’s wafer bonding platforms combine over seventy years of microstructuring experience with solid product quality and a broad range of productivity features. Partnering with research, academia and material suppliers we develop intelligent bond solutions which offer leading-edge technology for our customers. Our wafer bonding platforms cover many different applications in 2.5D and 3D integration, MEMS, LED and power devices as well as other areas of research and development.


Technologies

  • Adhesive
  • Anodic
  • Eutectic
  • Glass Frit
  • Hybrid
  • Metal Diffusion
  • Slid
  • General Information