Wafer Bonder

SUSS MicroTec’s wafer bonding platforms combine over seventy years of microstructuring experience with solid product quality and a broad range of productivity features. Partnering with research, academia, and material suppliers we develop intelligent bond solutions which offer leading-edge technology for our customers. Our wafer bonding platforms cover many different applications in 2.5D and 3D integration, MEMS, LED, and power devices as well as other areas of research and development.


  • Adhesive
  • Anodic
  • Eutectic
  • Glass Frit
  • Hybrid Bonding
  • Metal Diffusion
  • Slid
  • Fusion Bonding
  • Mechanical Debonding
  • General Information