XB8 Wafer Bonder
Universal High-Force Wafer Bonder
The XB8 wafer bonder is designed for a wide range of bonding processes and supports substrates with a wafer size of up to 200 mm. All process parameters can be adapted flexibly according to the requirements, which make the system perfect for use in research and development. In production, the high level of automation and the sophisticated design of the XB8 ensure a high level of process stability. This makes the XB8 wafer bonder ideal for applications from the MEMS, advanced packaging, 3D integration and LED fields.
- Flexibility in process development
- Process stability
- High yield
The XB8 wafer bonder has a closed process chamber with an automatic loading function. During loading, the chamber is flooded with nitrogen to ensure the best possible level of cleanliness. The high level of automation minimizes the influence the operator has on the process result. The thermal decoupling of the heater from the actual bonder chamber enables a process temperature that can be reproduced precisely, combined with a high repeat accuracy of the bonding force.
Homogeneous Temperature and Bond Force
The thermally decoupled ceramic heaters guarantee an even temperature distribution and also ensure an optimal bonding force homogeneity within the entire temperature range. The SUSS MicroTec unique multi-zone heating system makes advanced control of the temperature distribution possible. The innovative structure of the XB8 wafer bonder enables optimal bonding force and temperature distribution across the wafer, resulting in a high yield.
In combination with the SUSS bond aligner suite, the XB8 offers a highly precise bond alignment.
The XB8 wafer bonder offers various tooling options.