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XB8 Wafer Bonder

Universal High-Force Wafer Bonder

The XB8 wafer bonder is designed for a wide range of bonding processes and supports substrates with a wafer size of up to 200 mm. All process parameters can be adapted flexibly according to the requirements, which make the system perfect for use in research and development. In production, the high level of automation and the sophisticated design of the XB8 ensure a high level of process stability. This makes the XB8 wafer bonder ideal for applications from the MEMS, advanced packaging, 3D integration and LED fields.

Highlights

  • Flexibility in process development
  • Process stability
  • High yield
XB8 Wafer Bonder

High Repeatability

The XB8 wafer bonder has a closed process chamber with an automatic loading function. During loading, the chamber is flooded with nitrogen to ensure the best possible level of cleanliness. The high level of automation minimizes the influence the operator has on the process result. The thermal decoupling of the heater from the actual bonder chamber enables a process temperature that can be reproduced precisely, combined with a high repeat accuracy of the bonding force.

Homogeneous Temperature and Bond Force

The thermally decoupled ceramic heaters guarantee an even temperature distribution and also ensure an optimal bonding force homogeneity within the entire temperature range. The SUSS unique multi-zone heating system makes advanced control of the temperature distribution possible. The innovative structure of the XB8 wafer bonder enables optimal bonding force and temperature distribution across the wafer, resulting in a high yield.

In combination with the SUSS bond aligner suite, the XB8 offers a highly precise bond alignment.

The XB8 wafer bonder offers various tooling options.

Details

  • Substrates
  • Process Parameter
  • Sequential Spacer Removal
  • Automated Loading Function
  • Wafer sizes: 4, 6, 8 inch
  • Dedicated tooling for pieces

Details : Bonding Technologies

  • Adhesive
  • Anodic
  • Eutectic
  • Fusion
  • Glass Frit
  • Hybrid Bonding
  • Metal Diffusion
  • Slid

Adhesive Bonding

A variety of materials are available for adhesive wafer bonding techniques utilizing polymers and adhesives, including epoxies, dry films, BCB, polyimides, and UV curable compounds.

Highlight:

  • Comparatively low temperature for protecting sensitive components

Available for:

Automated Bonder
Semi-Automated Bonder

Bond-Head

  • Bond Head with Center Pin
  • Bond Head without Center Pin

The bond head includes a center pin, which allows establishing contact between both wafers at their center points. This helps to maintain excellent alignment even after thermal expansion of the bond partners. The center pin is used to initiate a fusion bond in the center of the wafer stack or to set a pre-bond for anodic bonding to avoid dejsutage when pulling the spacers.

Available for:

Semi-Automated Bonder

Fixtures

  • Open Fixtures
  • Closed Fixtures

The open fixture features a transport ring with minimum contact area for wafer support and maximized cut-out area for reduced thermal mass during heat up and cool down. This type of fixture allows direct contact between the wafers and the lower and the upper tooling plate, which results in optimum temperature uniformity across the wafers. In addition, this enables optimal heating and cooling rates and is therefore the best choice for high throughput applications.

Available for:

Semi-Automated Bonder

Videos