Organization

The SUSS MicroTec Group is a leading supplier of equipment and process solutions for microstructuring applications with seventy years of engineering experience. 

Our portfolio covers a comprehensive range of products and solutions for backend lithography, wafer bonding and photomask processing, complemented by micro-optical components.

The production of memory chips, cameras for mobile phones or tire pressure sensors – the equipment solutions of SUSS MicroTec are applied within a wide variety of manufacturing processes for applications of daily or industrial use. Customers in the semiconductor industry and related markets like Advanced Packaging, MEMS and LED appreciate our comprehensive experience in wafer processing. This makes us a valuable partner for high-volume production as well as for research and development.

 

product portfolio

Our portfolio covers a comprehensive range of products and solutions for backend lithography, wafer bonding and photomask processing, complemented by micro-optical components. 

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Management

Managing Board

Dr. Franz Richter

Chief Executive Officer (CEO)*

Upon completion of his mechanical engineering studies at the University of Applied Sciences at Münster as well as Physics at the University Bielefeld and the University of Applied Science Darmstadt, Dr. Franz Richter (date of birth July 22, 1955, nationality: German) started out on his professional career at the research and development department at Carl Zeiss. In 1988, he moved on to the research and development of the Fraunhofer Institute. Following his professional activities as a scientist at the Carl Zeiss Group and the Fraunhofer Institute, he spent 14 years working for SUSS MicroTec, the last six of them as its CEO until 2004. During this time, the IPO took place and revenue grew beyond 200 million Euro. After serving as President of Semiconductor Equipment Division at Unaxis (now OC Oerlikon) in Pfäffikon, Switzerland, he set up Thin Materials AG and became its CEO in 2007. The company is engaged in the process development for the 3D chip integration and was successfully sold to Nissan Chemical Industries, Ltd., Tokyo, in 2013.

Today Dr. Richter serves as president of the administrative board of Meyer Burger Technology AG, Gwatt, Switzerland.

* As of September 7, 2016, appointed until August 31, 2022

Oliver Albrecht

Chief Financial Officer (CFO)

Oliver Albrecht is CFO of SUSS MicroTec SE since November 18, 2019. He studied business administration at the University of Mannheim and at the Institut Commercial de Nancy after an apprenticeship as a banker. 1992 to 2003, he worked in the finance and banking sector as Director of Investment Banking and Corporate Finance. Between 2003 and 2019, he held various commercial positions at executive level: Head of Finance at Peri GmbH in Weißenhorn, Chief Financial Officer at centrotherm photovoltaics AG in Blaubeuren, Chief Financial Officer at SHW AG in Aalen, Managing Director of Vetter Pharma-Fertigung GmbH & Co KG in Ravensburg.

 

Supervisory Board

Dr. David Dean

Chairman of the Supervisory Board*

For more than 30 years, Dr. Dean has successfully worked at the executive level with global technology companies on their strategy and business development. After Masters and Doctoral degrees in physics and theoretical nuclear physics he started his career in academia before moving to the Boston Consulting Group in 1985. Between 1994 and 2013, Dr. Dean was a partner (from 2002 as Senior Partner) in the Technology & Telecoms practice of The Boston Consulting Group and held worldwide responsibility for this business between 2000 and 2006. Today, he shares his experience as an independent consultant and as a member of supervisory or advisory board of companies:

Senior Advisor to the Boston Consulting Group, Munich, Germany
Kaiteki Institute of Mitsubishi Chemical Holding Corp, Tokyo, Japan
PT XL Axiata Tbk, Jakarta, Indonesia
Axiata Group Berhad, Kuala Lumpur, Malaysia
Ncell Pvt Ltd, Kathmandu, Nepal

* Chairman of Supervisory Board since May 20, 2020. Elected until 2022.

 

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Dr. Myriam Jahn

Vice Chairman of Supervisory Board*

Dr. Jahn started her professional career as consultant at the Boston Consulting Group in Duesseldorf. Later on she joined the Deutsche Gesellschaft für Mittelstandsberatung (DGM), where she specialized in strategy consulting. After her dissertation and PhD at the University of Duisburg-Essen in 2003, she moved on to the ifm-group in Essen. There, she held various responsible positions in sales and administration. From 2016 to 2018, Ms. Dr. Jahn has been a member of the Management Board of TiSC AG, a subsidiary of the ifm-group, there she was responsible for sales. Since September 2019, she is member of the executive board of QSC AG. In the supervisory board of SUSS MicroTec, Dr. Jahn is responsible for the competence areas of digitalization as well as industry 4.0 (smart factory). With her long-standing experience in these areas, she complements the existing core competences of the supervisory board with two important, up-to-date topics.

* since May 2017. Elected until 2022.

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Dr. Dietmar Meister

Member of the Supervisory Board*

Dietmar Meister started his professional career at Daimler-Benz AG, where he held various positions. In 1997 he joined Jungheinrich AG where he was Vice President Group Controlling until 2000. He then became Member of the Board / CFO of the Refrigeration Division in the Linde Group. From 2006 to 2009, he managed finances of the Brose group as its CFO. As CFO of the Vaillant Group, he was responsible for finances and services from 2009 to 2017. Since 2019, he has been working as an independent board advisory and consultant.
Dr. Dietmar Meister holds a PhD in Economics and is a member of the Regional Advisory Committee West at Commerzbank.  

* since June, 2019. Elected until 2022.

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Jan Smits

Member of the Supervisory Board*

Jan Smits has held various management positions in established technology companies in the semi-conductor industry, most recently at ASML Holding in the Netherlands where he worked for a total of around 22 years. From 2016 until 2019 he was Executive Vice President of Strategic Sourcing & Procurement. Until 2019, Mr. Smits held the positions of Director of ASML Netherlands and Member of the Executive Committee of ASML Holding in addition to heading the Strategic Purchasing Divi-sion. Prior to that, Mr. Smits was Head of the Lithography Business Unit "Deep UV" at ASML. From 1983 – 1997 Jan Smits worked at Philips Electronics responsible for planning and construction of various development and production sites, most recently as Program Director Equipment and Infra-structure MOS4 of Philips Semiconductor Inc.  Jan Smits holds a master degree as mechanical engineer at the Technical Univerisity Einhoeven, Netherlands.

* Member of Supervisory Board since May, 20, 2020. Elected until 2022.

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Financial Figures

  in € million 2019 2018 2017 2016 2015 
 Business Development            
  Order entry 219.3 191.0 200.3 161.1 188.6  
  Order backlog as of December 31 93.2 84.7 133.4 101.5 117.6  
  Total Sales 213.8 203.9 166.5 177.6 148.5  
  Gross profit 49.7 67.3 59.5 58.6 49.4
  Gross margin 23.2 % 33.0 % 35.7% 33.0% 33.3%
  Gross profit – adjusted for extraordinary effects 63.9 67.3      
  Gross margin – adjusted for extraordinary effects 29.9 % 33.0 %      
  Cost of sales 164.1 136.7 107.0 119.0 99.2  
  Cost of sales – adjusted for extraordinary effects 149.9 136.7 9.7 %    
  Research and Development costs 20.2 18.3 15.2 14.1 12.8
  Impairment on assets in the scanner and laser
  product lines
14.3 0.0      
  EBITDA -5.2 15.7 18.0 15.3 9.2  
  EBITDA margin -2.4 % 7.7 % 10.8% 8.6% 6.2%  
  EBIT -13.8 10.9 13.9 11.1 5.0  
  EBIT margin -6.5 % 5.3 % 8.3% 6.3% 3.4%  
  EBIT – adjusted for extraordinary effects 0.5 10.9      
  EBIT margin – adjusted for extraordinary effects 0.2 % 5.3 %      
  Earnings after tax -16.3 4.8 6.7 5.0 0.2  
  Earnings per share, basic (in €) -0.85 0.25 0.35 0.26 0.01  
 Balance Sheet and cash flow            
  Equity 125.4 140.4 127.0 124.4 118.7  
  Equity ratio 62.7 % 70.3 % 62.9% 69.2% 67.0%  
  Return on equity -13.0 % 3.4 % 5.3% 4.0% 0.2%
  Balance sheet total 199.9 199.6 202.0 179.6 177.2  
  Net cash -18.0 28.2 33.0 31.1 40.0  
  Free cash flow -36.9 -5.0 2.9 -9.1 1.3  
 Further key figures            
  Investments 6.1 6.9 6.5 3.6 3.4  
  Investment ratio 2.9 % 3.4 % 3.9% 2.0% 2.3%  
  Depreciation 8.6 4.8 4.1 4.2 4.2  
  Employees as of December 31 937 881 779 711 698  


1 Before consideration of purchase or sale of availabe for sale securities

 

Locations

SUSS MicroTec SE and its subsidiaries form an international corporation which manufactures and sells products in the field of microsystems technology and microelectronics. Production is concentrated at facilities in Garching and Sternenfels in Germany and in Neuchâtel in Switzerland.

The products are distributed through the production sites as well as through independent distributors in the USA, The Netherlands, France, United Kingdom, Japan, Singapore, Taiwan, China and Korea.

In countries in which SUSS MicroTec has no subsidiaries, our international presence is supported by a network of SUSS representatives.


Production Sites

Garching | Germany

The headquarters of SUSS MicroTec is located in Garching, a university city in the northern part of the district of Munich. SUSS MicroTec benefits from ideal infrastructure with an international airport close by, as well as direct access to the A9 motorway and excellent rail connections. In addition to the company headquarters, the development and production facilities of SUSS Mask Aligners, alignment and exposure equipment for lithographic applications, are also located in Garching.
 

Sternenfels | Germany

SUSS MicroTec’s largest production facility in Sternenfels accommodates three product lines, Coater/Developer, Wafer Bonder and Photomask Equipment under one roof. The Sternenfels premises, in the prosperous and scenic region between Karlsruhe and Stuttgart, meets the latest demands for development, production and management structures.
 

 

Neuchâtel | Switzerland

In Hauterive (Neuchatel) subsidiary SUSS MicroOptics is manufacturing SUSS MicroTec’s special optics and other optical elements. Its proximity to the renowned watch and microtechnology industry as well as Swiss research institutes offers a significant advantage of location.

 

History

In 1949 Karl Süss founds a sales representation for microscopes, cameras and laboratory equipment of Ernst Leitz Wetzlar in Munich. A garage is the first headquarter for the new business in post-war Germany. Soon the Karl Süss GmbH also provides service and maintenance for the optical devices thus quickly gaining reputation within the research community.

When Munich-based Siemens approaches Süss in 1962 and asks the company to produce a thermo-compression bonding machine for transistors this marks a tipping point in its history: The company moves from sales and maintenance to contract manufacturing. The first order comprises small measuring tables with stereo microscopes that are bonded together. One year later a second order follows and in 1963 Süss develops the prototype for the first mask aligner, the MJB3, for Siemens.

Karl Süss and his two sons Ekkehard and Winfried successfully expand the flourishing manufacturing business. The company soon needs to move its premises outside of Munich to Garching, where headquarters are still situated today.

While the semiconductor industry grows various other business opportunities are appearing. Süss starts producing test systems and diamond scribers.

The first double-side mask aligner allowing for dual-side exposure gets invented in 1974.  Having proven itself an acknowledged expert in photolithography for its partners in research and development Süss now tackles manufacturing customers. In 1975 it introduces with the MJB55 a first mask aligner for volume production.

The eighties are marked for Süss by a worldwide expansion. Süss launches its oversea business first with a site in the US, Waterbury, Vermont. Next, an Asian subsidiary is founded in Thailand in 1983, with more sales offices in Japan, China and Taiwan to follow. 

Süss gets ready for the production of bonders, additionally undertaking a side step into the very specialized field of xray stepper lithography. In Dresden, Germany, Süss opens a production site for probers.

Süss meets the growing demands for microsystems by releasing its first substrate bonder in 1989. Substrate bonders are used in microsystem technology to join heterogenous materials with patterned surfaces. In 1993 Süss adds device bonders to its product portfolio.

In 1994 Karl Süss and his eldest son Ekkehard Süss desease shortly one after the other. This sets off a reorganisation. The company is going public in 1999.  The Süss family remains represented in the advisory board by Karl Süss' son Dr. Winfried Süss. Two years later a name change for all legal Süss entitites into SÜSS MicroTec follows the new organisational form.

By the acquisition of Fairchild Technologies the company gains access to high-end markets with production coaters in 2000. In the year 2001 the microoptics business of the newly founded SUSS MicroOptcs reinforce the lithographic portfolio. In 2006 SÜSS MicroTec establishes its spin-off SUSS MicroTec Reman in the flourishing used equipment market. In 2007 the product line device bonders is sold, two years later the probers. In contrast, the opening of offices in Singapore and Korea strengthen the company's presence in the Asian market.

The recent years are characterized by focussing on core compentencies. In 2010 SÜSS MicroTec purchases Hamatech APE, an equipment supplier for photomask processing technology. In the same year, the newly purchased site in Sternenfels becomes home for the production of substrate bonders which have been moved from Waterbury, US. Coaters, bonders and photomask processing equipment are now being manufactured at the same site which therefore functions a compentence center for wet processing technology. With the acquisition of Tamarack Scientific in 2012 the company complements her lithographic portfolio with modern laser processing technology for microstructuring.