Mask Aligner

Highest precision for applications with thick and thin resists

The SUSS MicroTec Mask Aligner has become synonymous with superior quality, high alignment accuracy, and sophisticated exposure optics. SUSS MicroTec offers a complete range of mask aligners for high-end fab automation, high volume production and R&D environments alike. SUSS MicroTec designs their mask aligner systems for lithography applications in the field of 3D packaging, advanced packaging, MEMS, LED, compound semiconductors, power devices, photovoltaic, nanotechnology and wafer-level optics. 

SUSS MicroTec’s mask and bond aligner platforms perform high precision alignment for mask-to-wafer as well as wafer-to-wafer operations. The equipment processes substrates and wafer up to 300 mm of any kind of material and thickness. With a wide variety of additional functionality the mask aligner not only meets various process requirements but also succeeds with its flexible configuration modes.

 

Automated Mask Aligner

MA300 Gen2 Mask Aligner

Highly Automated Platform for 300mm and 200mm Wafers

MA200 Gen3 Mask Aligner

Alignment and Exposure for a Multitude of Applications

MA100/150e Gen2 Mask Aligner

Automated Platform for Wafers up to 100mm or 150mm

 

Semi-Automated Mask Aligner

MA12 Mask Aligner

Semi-automated mask aligner for wafer sizes of up to 12"/300 mm

MA/BA Gen4 Pro Series Mask & Bond Aligner

For Industrial Research and Operator-Assisted Production

MA/BA Gen4 Series Mask and Bond Aligner

Semi-Automated Platform for Wafers up to 8"/200mm

MA/BA6 Mask and Bond Aligner

Manual Mask and Bond Aligner for Wafer Sizes up to 6"/150 mm

 

Manual Mask Aligner

MJB4 Mask Aligner

State-of-the art R&D Solution for Small Substrates and Pieces

 

 

 

A mask with a certain structure is aligned with the wafer in very close proximity (thus “proximity” lithography). During exposure, the shadow cast by the mask structure is transferred to the wafer. The resulting exposure quality depends on both the precision with which the mask and wafer are spaced apart and the optical system used for exposure.

Being fast and suited to flexible implementation, this method is regarded as the most cost-effective technique for producing microstructures down to 3 µm in size. With contact exposure, resolutions in the sub-micron range can be achieved. Typical areas of use include wafer-level chip-scale packaging, flip chip packaging, bumping, MEMS, LED and power devices. The systems are deployed in high-volume production as well as in industrial research.

The mask aligners supplied by SUSS MicroTec are based on proximity lithography.

Features & Benefits

  • Superior resolution as a result of diffraction-reducing optics
  • Process stability through the use of microlens optical systems

Available for:

Automated Mask Aligner

Semi-Automated Mask Aligner

Manual Mask Aligner

Where lithographic processes require the alignment of structures on only one side of the device wafer (e.g. RDL, microbumping and similar techniques), top-side alignment is used to align the fiducials on the mask with those of the wafer. Depending on substrate properties, this can be achieved either using stored position data for the wafer or through live image alignment, as in the DirectAligntm system invented at SUSS MicroTec. 

Highlights

  • Mask aligner for the highest level of alignment precision
  • Clear and stable pattern recognition even under poor constrast conditions

Available for:

Automated Mask Aligner

Semi-Automated Mask Aligner

Manual Mask Aligner

Bottom-side Alignment (BSA)

Alignment of the structuring on the wafer back side with the structures on the front is required in processes involving applications such as MEMS, wafer-level packaging and 3D integration, where used for example to create vertical through silicon vias (TSVs) on interposers. Optical bottom side alignment is normally used for this type of alignment. An integrated camera system detects the mask structures and the structures on the wafer back side and aligns them with each other. The wafer position has to be determined and stored prior to loading, since the wafer afterwards conceals the mask target. This places specialized demands on the alignment system as a whole.

Features and Benefits

  • With its outstanding level of mechanical precision and stability, the SUSS mask aligner offers unmatched accuracy.

Available for:

Automated Mask Aligner

Semi-Automated Mask Aligner

Manual Mask Aligner

Infrared Alignment

Multilayer wafer stacks are used in a number of structuring processes. By means of infrared (IR) illumination, the alignment marks that in the typical case are embedded between the layers can be identified and aligned.

Alignment can also be done using IR light based on such embedded marks. These require the use of materials that are transparent for IR light, such as undoped silicon, III-V semiconductors (e.g. GaAs) and adhesives for temporary bonding and debonding techniques.  Specific cases should be tested to verify process feasibility.

In order to ensure availability of IR alignment to the greatest possible extent, the SUSS mask aligner can be optionally equipped with powerful IR light sources and high performance camera systems.

Highlights

  • Powerful IR light sources and high performance camera systems.

Available for:

Automated Mask Aligner

Semi-Automated Mask Aligner

Manual Mask Aligner

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