Süss MicroTec AG: Strategic Restructuring of the SUSS MicroTec Group

Süss MicroTec AG: Strategic Restructuring of the SUSS MicroTec Group

Süss MicroTec AG / Restructure of Company

10.06.2010 20:09

Dissemination of an Ad hoc announcement according to § 15 WpHG, transmitted by
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SUSS MicroTec AG: Strategic Restructuring of the SUSS MicroTec Group 

  - Substrate Bonder Division To Be Relocated from USA to Germany

  - Expansion of Sternenfels Site in Germany

  - Future Focus on Two Manufacturing Locations 

  - One-off Restructuring Expense To Be Recognized in 2010

Garching near Munich, Germany, June 10, 2010 - SUSS MicroTec AG (business
address: Schleissheimer Strasse 90, 85748 Garching, Germany; ISIN:
DE0007226706), which is listed in the Prime Standard of Deutsche Börse AG,
today announced its decision to relocate its Substrate Bonder division to
Germany this year. The division is currently based in Waterbury, Vermont,
USA. In the course of the planned restructuring, the research and
development, production and product management functions of the Bonder
product lines will be moved to the production site in Sternenfels, Germany.
At the same time, the North American service and sales activities as well
as the applications center will be moved from Waterbury, VT, to Silicon
Valley in California.

At the beginning of the year, a state-of-the-art production building was
bought in Sternenfels, located in the state of Baden-Württemberg, Germany,
as part of the HamaTech acquisition. The Substrate Bonder, Coater/Developer
and Photomask Equipment product lines are being combined at the Sternenfels
site against the backdrop of the planned optimization and simplification of
the corporate structure and the goal of reducing the number of development
and manufacturing sites from the existing four in January 2010 to two
highly efficient sites in Germany for the future. Furthermore, by bundling
the Coater and Bonder product lines at one site, the Company will be able
to achieve technology and production synergies in the area of temporary
bonding and react faster and more flexibly to market demands. In addition
to the cost advantages for development and production, the production site
in Sternenfels also provides the physical premises necessary to take
advantage of the growth potential available in the area of 3D integration.

The move takes into account the space requirements anticipated for the
future as well as the increasing demands placed on modern production and
cleanroom standards. The alternative would have been a costly expansion of
the current facility at the US site in Waterbury, VT. The expected
restructuring costs will reach a total in the mid to high single-digit
million range and will impact primarily on 2010.

Anticipated annual results are being adjusted against the background of the
planned relocation of the Substrate Bonder division. The Company continues
to expect sales for the 2010 fiscal year of over EUR 120 million and a
positive free cash flow (before effects of M&A activities already carried
out). Earnings before interest and taxes (EBIT) will however now be
slightly negative for the year.

End of the ad hoc announcement

Julia Hartmann
Investor Relations / PR
Schleissheimer Strasse 90
85748 Garching, Germany
Phone: +49 (0)89 32007-161
Fax: +49 (0)89 32007 336 
Email: julia.hartmann@suss.com

10.06.2010 Ad hoc announcement, Financial News and Media Release distributed by DGAP.
Media archive at www.dgap-medientreff.de and www.dgap.de

Language:     English
Company:      Süss MicroTec AG
              Schleissheimer Strasse 90
              85748 Garching b. München
Phone:        +49 (0)89 32007-161
Fax:          +49 (0)89 32007-336
E-mail:       ir@suss.com
Internet:     www.suss.com
ISIN:         DE0007226706
WKN:          722670
Listed:       Regulierter Markt in Frankfurt (Prime Standard); Freiverkehr
              in Berlin, Düsseldorf, München, Hamburg, Stuttgart
End of News                                     DGAP News-Service