Süss MicroTec AG: 3M and SUSS Announce Agreement on Temporary Wafer Bonding Technology to Enable 3-D Semiconductors

Süss MicroTec AG: 3M and SUSS Announce Agreement on Temporary Wafer Bonding Technology to Enable 3-D Semiconductors

Süss MicroTec AG / Alliance

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Press Release

3M and SUSS Announce Agreement on Temporary Wafer Bonding Technology to
Enable 3-D Semiconductors

Munich, GERMANY, June 22, 2009 -  3M, a leading supplier of advanced
materials to the semiconductor industry, and SUSS MicroTec, a leading
supplier of semiconductor processing equipment, today announced an
agreement to expand access to 3M Wafer Support System (WSS) equipment for
temporary wafer bonding of ultrathin wafers required for 3-D packaging. As
part of this non-exclusive agreement, SUSS MicroTec becomes an authorized
equipment supplier for the 3M WSS and will manufacture and sell XBC300 and
CBC300 wafer bonders configured to use 3M's WSS materials including 3M
Liquid UV-Curable Adhesive and Light-To-Heat Conversion coating. Under the
agreement, both companies will work closely to address customer demands for
high-performance process solutions that support high-volume manufacturing
with a competitive cost of ownership.

3M WSS uses processes and materials for temporary wafer bonding to support
wafer thinning and processing of ultra thin wafers for 3-D packaging. 3M's
innovative use of a UV-curable adhesive for wafer bonding to glass carriers
provides robust wafer support throughout wafer grinding. This is
particularly important in the multiple high-temperature cycles required in
subsequent wafer processing steps. After processing, 3M's unique
Light-To-Heat Conversion layer allows low stress, room temperature
debonding of the thinned wafer directly to the tape carrier. The thinned
wafer is supported throughout the entire process reducing warpage, stress
and process complexity compared to other processes that require
high-temperature exposure and stress to the thinned wafer, or solvents to
release the temporary bonding material. 3M's WSS enables wafer processing
currently in high-volume production at multiple semiconductor sites
worldwide.

'SUSS MicroTec is a recognized leader in wafer bonding and applications for
3-D and MEMS markets. Working with an industry leader, like SUSS, allows 3M
to focus on advanced materials development. The joint efforts of both
companies provide 3M customers with improved support, lower overall costs
and faster access to more advanced solutions for their demanding 3-D
packaging requirements,' commented Mike Bowman, marketing development
manager for 3M Electronics Markets Materials Division.

'We are pleased to collaborate with a leading material expert like 3M to
offer customers a leading edge temporary bonding process with superior
performance compared to current materials and processes on the market,'
said Wilfried Bair, general manager, Wafer Bonder Division, SUSS MicroTec.
'This relationship and process offering fits nicely with SUSS MicroTec's
3-D strategy to provide a flexible and modular bonding platform that can be
configured to meet customers' needs.'

About SUSS MicroTec

SUSS MicroTec is a leading supplier of process and test solutions for
markets such as 3-D Integration, Advanced Packaging, MEMS, Nanotechnology
and Compound Semiconductor. High-quality solutions enable customers to
increase process performance while reducing cost of ownership. SUSS
MicroTec supports more than 8,000 installed mask aligners, coaters, bonders
and probe systems with a global infrastructure for applications and
service. SUSS MicroTec is headquartered in Garching near Munich, Germany.
For more information, please visit http://www.suss.com.

 
About 3M

A recognized leader in research and development, 3M produces thousands of
innovative products for dozens of diverse markets. 3M's core strength is
applying its more than 40 distinct technology platforms - often in
combination - to a wide array of customer needs. With $25 billion in sales,
3M employs 76,000 people worldwide and has operations in more than 60
countries. For more information, visit http://www.3M.com.

Disclaimer

This press release contains forward-looking statements relating to the
business, financial performance and earnings of SUSS MicroTec AG and its
subsidiaries and associates. Forward-looking statements are based on
current plans, estimates, projections and expectations and are therefore
subject to risks and uncertainties, most of which are difficult to estimate
and which in general are beyond the control of SUSS MicroTec AG.
Consequently, actual developments as well as actual earnings and
performance may differ materially from those which explicitly or implicitly
assumed in the forward-looking statements. SUSS MicroTec AG does not intend
or accept any obligation to publish updates of these forward-looking
statements.



Contact:
SÜSS MicroTec AG
Julia Hartmann
Investor Relations / PR
Schleissheimer Strasse 90
85748 Garching, Deutschland
Tel.: +49 (0)89 32007-161
Fax: +49 (0)89 32007 336 
Email: julia.hartmann@suss.com


22.06.2009  Financial News transmitted by DGAP
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Language:     English
Issuer:       Süss MicroTec AG
              Schleissheimer Strasse 90
              85748 Garching b. München
              Deutschland
Phone:        +49 (0)89 32007-161
Fax:          +49 (0)89 32007-336
E-mail:       ir@suss.com
Internet:     www.suss.com
ISIN:         DE0007226706
WKN:          722670
Listed:       Regulierter Markt in Frankfurt (Prime Standard); Freiverkehr
              in Berlin, Düsseldorf, Hamburg, München, Stuttgart
 
End of News                                     DGAP News-Service
 
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