SUSS MicroTec announces new Mask Aligner series MA/BA Gen4

SUSS MicroTec announces new Mask Aligner series MA/BA Gen4

DGAP-Media / 2016-06-30 / 10:00

SUSS MicroTec announces new Mask Aligner series MA/BA Gen4

Garching, June 30, 2016 - SUSS MicroTec, a leading supplier of equipment and process solutions for the semiconductor industry and related markets, announced the launch of the MA/BA Gen4 series today. The new generation of SUSS MicroTec's semi-automated Mask and Bond Aligners extends its capabilities by major improvements in alignment accuracy, ergonomic design and further reduced cost of ownership. With the launch of the fourth generation, SUSS MicroTec introduces a new platform system. The two platform types are configured differently and consist of the MA/BA Gen4 for standard processes and the MA/BA Gen4 Pro series for advanced high-end processes. By moving to this new platform concept, SUSS MicroTec further optimizes the Mask Aligner product portfolio to better align with customer requirements.

Main application of SUSS MicroTec's MA/BA Gen4 series is full-field lithography in Academia, MEMS, 3D Integration and the Compound Semiconductor market. It furthermore handles processes like bond alignment, fusion bonding and SMILE imprint. In addition to standard wafer processing the MA/BA Gen4 series reliably processes delicate substrates, such as fragile, warped or uneven surfaced wafers.

"Our new manual Mask Aligner series sets a high benchmark regarding cost efficiency, user friendliness and leading edge process results" said Dr. Per-Ove Hansson, CEO SUSS MicroTec. "With this new platform concept, we further align with different customer requirements - the MA/BA Gen4 for standard lithography processes or the leading edge MA/BA Gen4 Pro for small-series production and more demanding solutions, e.g. our Soft Conformal Imprint Lithography (SCIL) solution."

About SUSS MicroTec
SUSS MicroTec is a leading supplier of equipment and process solutions for microstructuring in the semiconductor industry and related markets. In close cooperation with research institutes and industry partners SUSS MicroTec contributes to the advancement of next-generation technologies such as 3D Integration and nanoimprint lithography as well as key processes for MEMS and LED manufacturing. With a global infrastructure for applications and service SUSS MicroTec supports more than 8.000 installed systems worldwide. SUSS MicroTec is headquartered in Garching near Munich, Germany. For more information, please visit

SUSS MicroTec AG
Franka Schielke
Schleissheimer Strasse 90
85748 Garching, Deutschland
Tel.: +49 (0)89 32007-161
Fax: +49 (0)89 32007-451

End of Media Release

Issuer: SÜSS MicroTec AG
Key word(s): Research/Technology

2016-06-30 Dissemination of a Press Release, transmitted by DGAP - a service of EQS Group AG.
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