MA300 Gen2 Mask-Aligner

Highly Automated Mask Aligner Platform for 300 mm and 200 mm Wafers

SUSS MicroTec's MA300 Gen2 is a highly automated mask alignment platform for 300 mm and 200 mm wafers. It is specifically designed for 3D Packaging, wafer level packaging and flip-chip applications but can be used as well for other technologies where geometries in the range of 3 and 100 microns have to be exposed. The MA300 Gen2 represents a new generation of mask aligners from SUSS MicroTec that are designed to address the requirements of modern high-end fabs in a high volume manufacturing environment.

Highlights

  • Full-field intensity 90mW/cm² (broad band)
  • Down to 2.5% Light Uniformity on 300mm
  • 100 percent edge exposure flexibility (easy EBR)
  • Resolution down to 3.5 µm in Proximity Mode
  • Alignment accuracy 0.5 µm (3 sigma), with DirectAlign option
  • Can be equipped with a dedicated alignment kit for creating 3D interconnects
  • Best in Class Throughput
MA300 Gen2 Mask-Aligner

In addition to the standard topside alignment with accuracies down to 0.5 µm (DirectAlign) the new 3D dedicated alignment platform enables bottom side and infrared alignment for 300 mm based three-dimensional (3D) packaging lithography applications such as etch masks for TSVs and dicing streets, backside redistribution layers (RDLs) or bumping applications. While bottom-side alignment enables SUSS MicroTec 300 mm Mask Aligners to process double-sided structured wafers, the infrared alignment option allows the handling of opaque, yet IR-transparent materials such as adhesives, in particular for thin wafer handling or encapsulation applications.

Unlike steppers, proximity mask aligners are very efficient when exposing very thick layers. Mask aligners offer large process windows because they don't have the depth of focus limitations known from projection systems.

Details : Alignment

  • Top-side alignment (TSA)
  • Bottom-side alignment (BSA)
  • Infrared alignment (IR)
  • DirectAlign®

Details : Exposure

  • Proximity Lithography
  • Soft Contact Exposure

Details : Exposure Optics

  • MO Exposure Optics®
  • HR and LGO optics
  • Diffraction-Reducing Optics

Details : Automation

  • Auto Alignment
  • Automatic Filter Change
  • Wedge Error Compensation (WEC)
  • Automatic Substrate and Mask Handling

Details : Process Control

  • Mask Library

Alignment

  • ThermAlign®
  • Large Clearfield Alignment
  • Enhanced Alignment

Exposure

  • Angular Exposure
  • Lab Simulation Software
  • Source Mask Optimization

Others

  • Flow Box
  • Wafer Handling Toolings

Automation

  • SECS-II/GEM Interface