BA8 Gen4 Pro Bond Aligner

Highest precision bond alignment

The fourth generation of the semi-automated bond aligner platform BA8 is designed for high-precision alignment and subsequent reliable bonding of wafers and substrates up to 200 mm. Thanks to its high level of automation, the BA8 Gen4 Pro is well suited not only for research and development environments, but also for pilot or small series production. It supports demanding processes in the field of MEMS, advanced packaging as well as growth markets such as 3D integration.

Highlights

High alignment accuracy

Mostly operator independent with auto alignment

High process repeatability

Easy system expansion

Selective or full-field plasma optional

SUSS MicroTec Wafer Bonder BA8 Gen4

The alignment of two wafers in the bond aligner is based on the same high-performance technology which has proven itself in the SUSS MicroTec mask aligners for aligning masks to wafers. The functionality of the BA8 Gen4 Pro is extended by fusion bond technology with silicon substrates being bonded in the aligner. The SUSS MicroTec manual wafer bonder SB6/8 Gen2 offers a selection of further bond processes. A special fixture system ensures the safe transfer of the wafer package from one platform to the next.

Specialized tooling for selective or full-field plasma activation additionally supports fusion bonding at low temperatures.

The process requirements determine whether the BA8 Gen4 Pro is configured as a manual or semi-automated system. Equipped as semi-automated tool with auto alignment, the user-friendly recipe editor and automatic axial positioning, the BA8 Gen4 Pro achieves high process repeatability and is therefore also suited for throughput-critical production processes. Manual operation permits the operator to utilize the device flexibly in a wide range of processes. A broad spectrum of process requirements can be met with a selection of alignment technologies. 

Top-Side Alignment (TSA)

Where lithographic processes require the alignment of structures on only one side of the device wafer (e.g. RDL, microbumping and similar techniques), top-side alignment is used to align the fiducials on the mask with those of the wafer. Depending on substrate properties, this can be achieved either using stored position data for the wafer or through live image alignment, as in the DirectAligntm system invented at SUSS MicroTec. 

Highlights

  • Mask aligner for the highest level of alignment precision
  • Clear and stable pattern recognition even under poor contrast conditions

Available for:

Automated Mask Aligner

Semi-Automated Mask Aligner

Manual Mask Aligner

Bottom-side Alignment (BSA)

Alignment of the structuring on the wafer back side with the structures on the front is required in processes involving applications such as MEMS, wafer-level packaging and 3D integration, where used for example to create vertical through silicon vias (TSVs) on interposers. Optical bottom side alignment is normally used for this type of alignment. An integrated camera system detects the mask structures and the structures on the wafer back side and aligns them with each other. The wafer position has to be determined and stored prior to loading, since the wafer afterwards conceals the mask target. This places specialized demands on the alignment system as a whole.

Features and Benefits

  • With its outstanding level of mechanical precision and stability, the SUSS mask aligner offers unmatched accuracy.

Available for:

Automated Mask Aligner

Semi-Automated Mask Aligner

Manual Mask Aligner

Infrared Alignment (IR)

Multilayer wafer stacks are used in a number of structuring processes. The alignment marks that are normally embedded between the layers can be identified and aligned via infrared (IR) illumination. This requires the use of materials that are transparent for IR light, such as undoped silicon, III-V semiconductors (e.g. GaAs) and adhesives for temporary bonding and debonding techniques.

The SUSS equipment can be optionally equipped with powerful IR light sources and high performance camera systems, ensuring optimal IR availability.

Highlights

  • Powerful IR light sources and high performance camera systems.

Available for:

Automated Mask Aligner

Semi-Automated Mask Aligner

Manual Mask Aligner

Fusion Bonding

Fusion bonding refers to spontaneous adhesion of two planar substrates with a dielectric material (typically silicon oxide) as the bonding layer. The process usually involves a proper surface activation that renders the substrates to be largely hydrophilic. Subsequently the substrates are aligned, brought into contact and finally tempered at elevated temperature.

Available for:

Automated Bonder

Semi-Automated Bonder

Semi-Automated Bond Aligner

Semi-Automated Mask and Bond Aligner

  • Software for pattern recognition
  • Assisted and auto alignment
  • Automatic wedge error compensation
  • Ergonomic and straight-forward operation thanks to an intuitive, Windows-based interface

Infrared Alignment (IR)

Multilayer wafer stacks are used in a number of structuring processes. The alignment marks that are normally embedded between the layers can be identified and aligned via infrared (IR) illumination. This requires the use of materials that are transparent for IR light, such as undoped silicon, III-V semiconductors (e.g. GaAs) and adhesives for temporary bonding and debonding techniques.

The SUSS equipment can be optionally equipped with powerful IR light sources and high performance camera systems, ensuring optimal IR availability.

Highlights

  • Powerful IR light sources and high performance camera systems.

Available for:

Automated Mask Aligner

Semi-Automated Mask Aligner

Manual Mask Aligner

Downloads
BA8 Gen4 Pro Datasheet 243kb
SUSS Product Portfolio 2434kb
Publications

SUSS Smile Technology – Large Area Imprint.
A Solution for Patterning of Micro and Nano Features

SUSS Smile Technology – Large Area Imprint.
A Solution for Patterning of Micro and Nano Features

Technical Publications
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