With the SB6/8 Gen2 SUSS MicroTec provides a semi-automated platform for multiple bonding processes. Handling wafers up to 200mm as well as various shapes and types of substrates the SB6/8 Gen2 presents itself as flexible tool for various applications and process environments. The SB6/8 Gen2 is suitable for packaging as well structuring meeting the requirements for MEMS, LED, advanced packaging, 2,5D integration and 3D integration.
The SB6/8 Gen2 permits an easy switch from R&D to pilot production and finally volume manufacturing.
High throughput capability
A configurable bond chamber offers wide ranges for temperature, bond forces and chamber pressure increasing the number of possible applications and allowing the user to adapting to changing process requirements.
In combination with the SUSS Bond Aligner suite the SB6/8 Gen2 offers a highly precise prebond alignment.
A variety of materials are available for adhesive wafer bonding techniques utilizing polymers and adhesives, including epoxies, dry films, BCB, polyimides, and UV curable compounds.
Anodic wafer bonding involves encapsulating components on the wafer by means of ionic glass. In triple-stack bonding, three layers (i.e. glass-silicon-glass) are simultaneously bonded, enhancing both functionality and yield.
Eutectic wafer bonding takes advantage of the special properties of eutectic metals. Similar to soldering alloys, such metals melt already at low temperatures. This property allows planar surfaces to be achieved.
In order to control reflow of the eutectic material, eutectic bonding requires precise dosing of the bonding force and even temperature distribution.
Fusion bonding refers to spontaneous adhesion of two planar substrates with a dielectric material (typically silicon oxide) as the bonding layer. The process usually involves a proper surface activation that renders the substrates to be largely hydrophilic. Subsequently the substrates are aligned, brought into contact and finally tempered at elevated temperature.
Glass Frit Bonding
A glass frit bonding process involves screen-printing glass frits onto the bonding surfaces. This results in structures that are subsequently heated and fused when the two substrate surfaces are placed in contact. On cooling, a mechanically stable bond results.
To minimize the risks in thin wafer handling, the wafer is mounted on a carrier wafer prior to thinning. Bonding is only to facilitate further processing – the bond is designed to be dissolved once the wafer is processed.
Process steps required for temporary wafer bonding
SUSS MicroTec offers an open platform that is compatible with all common material systems used in temporary wafer bonding. In addition to the methods already used in production today, SUSS MicroTec is devoted to ongoing work towards qualifying new materials, in this way supporting the largest selection of adhesives currently available in the market.