SB6/8 Gen2 Wafer Bonder

Universal System for Wafer Bonding

With the SB6/8 Gen2 SUSS MicroTec provides a semi-automated platform for multiple bonding processes. Handling wafers up to 200mm as well as various shapes and types of substrates the SB6/8 Gen2 presents itself as flexible tool for various applications and process environments. The SB6/8 Gen2 is suitable for packaging as well structuring meeting the requirements for MEMS, LED, advanced packaging, 2,5D integration and 3D integration.

The SB6/8 Gen2 permits an easy switch from R&D to pilot production and finally volume manufacturing.

Highlights

  • Versatility
  • Process stability
  • High throughput capability
SB6/8 Gen2 Wafer Bonder

A configurable bond chamber offers wide ranges for temperature, bond forces and chamber pressure increasing the number of possible applications and allowing the user to adapting to changing process requirements.

In combination with the SUSS Bond Aligner suite the SB6/8 Gen2 offers a highly precise prebond alignment.

Details

  • Process Parameter
  • Wafer Handling

Details : Bonding Technologies

  • Temporary Wafer Bonding
  • Adhesive
  • Anodic
  • Eutectic
  • Fusion
  • Glass Frit