SB6/8 Gen2 Wafer Bonder

Universal System for Wafer Bonding

With the SB6/8 Gen2 SUSS MicroTec provides a semi-automated platform for multiple bonding processes. Handling wafers up to 200mm as well as various shapes and types of substrates the SB6/8 Gen2 presents itself as flexible tool for various applications and process environments. The SB6/8 Gen2 is suitable for packaging as well structuring meeting the requirements for MEMS, LED, advanced packaging, 2,5D integration and 3D integration.

The SB6/8 Gen2 permits an easy switch from R&D to pilot production and finally volume manufacturing.

Highlights

Versatility

Process stability

High throughput capability

SUSS MicroTec Wafer Bonder SB8 Gen2

A configurable bond chamber offers wide ranges for temperature, bond forces and chamber pressure increasing the number of possible applications and allowing the user to adapting to changing process requirements.

In combination with the SUSS Bond Aligner suite the SB6/8 Gen2 offers a highly precise prebond alignment.

Details
  • Motorized z-Axis for recipe controlled wafer stack thickness adaption (no mechanical adjustment required)
  • Gate valve and semi-automated load slide to load the transport fixture into the chamber. This concept prevents the operator from touching hot surfaces and also guarantees the best possible vacuum chamber cleanliness
  • Tool force piston design for best possible tool force uniformity
  • Bond force up to 20 kN
  • Temperature up to 550 °C
  • Precision temperature control (< 1 %) and unrivaled uniformity (± 2 %)
  • Precise process recipe control for all bond parameters
  • Fast heating and active cooling to reduce process cycle times
  • Process chamber pressure range from 5E-5 mbar to 1 bar (3 bar abs available as an option)
  • Precise chamber pressure control over the entire pressure range
Details: Bonding Technologies

Adhesive Bonding

A variety of materials are available for adhesive wafer bonding techniques utilizing polymers and adhesives, including epoxies, dry films, BCB, polyimides, and UV curable compounds.

Highlight:

  • Comparatively low temperature for protecting sensitive components

Available for:

Automated Bonder

Semi-Automated Bonder

Anodic Bonding

Anodic wafer bonding involves encapsulating components on the wafer by means of ionic glass. In triple-stack bonding, three layers (i.e. glass-silicon-glass) are simultaneously bonded, enhancing both functionality and yield.

Available for:

Automated Bonder

Semi-Automated Bonder

Eutectic Bonding

Eutectic wafer bonding takes advantage of the special properties of eutectic metals. Similar to soldering alloys, such metals melt already at low temperatures. This property allows planar surfaces to be achieved.

In order to control reflow of the eutectic material, eutectic bonding requires precise dosing of the bonding force and even temperature distribution.

Available for:

Automated Bonder

Semi-Automated Bonder

Fusion Bonding

Fusion bonding refers to spontaneous adhesion of two planar substrates with a dielectric material (typically silicon oxide) as the bonding layer. The process usually involves a proper surface activation that renders the substrates to be largely hydrophilic. Subsequently the substrates are aligned, brought into contact and finally tempered at elevated temperature.

Available for:

Automated Bonder

Semi-Automated Bonder

Semi-Automated Bond Aligner

Semi-Automated Mask and Bond Aligner

Glass Frit Bonding

A glass frit bonding process involves screen-printing glass frits onto the bonding surfaces. This results in structures that are subsequently heated and fused when the two substrate surfaces are placed in contact. On cooling, a mechanically stable bond results.

Available for:

Automated Bonder

Semi-Automated Bonder

To minimize the risks in thin wafer handling, the wafer is mounted on a carrier wafer prior to thinning. Bonding is only to facilitate further processing – the bond is designed to be dissolved once the wafer is processed.

Process steps required for temporary wafer bonding

  • Application of release layers (coating or plasma deposition)
  • Adhesive coating
  • Bonding
  • Thermal or UV curing

SUSS MicroTec offers an open platform that is compatible with all common material systems used in temporary wafer bonding. In addition to the methods already used in production today, SUSS MicroTec is devoted to ongoing work towards qualifying new materials, in this way supporting the largest selection of adhesives currently available in the market.

Highlights

  • Open bonding platform supporting flexible configuration and all common adhesives and techniques
  • Coating of bonding and release layers, including temporary bonding, in one system
  • Integrated metrology to determine wafer thickness and TTV

Available for:

Automated Temporary Bonder

Semi-Automated Bonder

Downloads
SB6/8 Gen2 Datasheet 1287kb
SUSS Product Portfolio 2434kb
Publications

Low-Temperature Hermetic Seal Bonding for Wafer-Level MEMS Packaging Using Submicron Gold Particles with Stencil Printing Patterning

Low-Temperature Hermetic Seal Bonding for Wafer-Level MEMS Packaging Using Submicron Gold Particles with Stencil Printing Patterning

Technical Publications
Service