SÜSS MicroTec AG: Announcement of a Strategic Management Decision regarding the Permanent Bonding Product Line / Adjustment of the Full Year Guidance 2013

SÜSS MicroTec AG: Announcement of a Strategic Management Decision regarding the Permanent Bonding Product Line / Adjustment of the Full Year Guidance 2013

SÜSS MicroTec AG  / Key word(s): Strategic Company Decision/Change in Forecast

06.11.2013 20:10

Dissemination of an Ad hoc announcement according to § 15 WpHG, transmitted
by DGAP - a company of EQS Group AG.
The issuer is solely responsible for the content of this announcement.

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Garching, November 6, 2013 - SUSS MicroTec, a leading supplier of equipment
and process solutions for the semiconductor and related markets, announces
a strategic management decision. Due to a reevaluation of our business
situation in permanent bonding and the ongoing losses in this product line,
the management has decided to expand the restructuring measures, which have
been taken in the second quarter this year, and to cease production of
cluster systems for permanent bonding applications. The development and
production of the successful manual permanent bonding systems are not
affected by this strategic action. In this context one-off expenses of
approximately EUR 8.3 million can be expected in the fourth quarter 2013. 
This one-off effect includes EUR 6.7 million for write-offs on inventories
(raw materials, unfinished goods as well as demonstration tools) and EUR
1.6 million of precautionary provisions formed for single customer
projects. With this move the management expects to pronouncedly reduce the
losses of the Substrate Bonding Division.

SUSS MicroTec today announces a revision of the full year guidance 2013.
The sales expectation of formerly EUR 150 million is revised to a bandwidth
of EUR 125 - EUR 135 million. The reason is a potential delay in the sales
recognition of several machines, which have already been shipped but are
still waiting for final acceptance of the customer. The tools include
temporary and permanent bond cluster systems for international customers.
Due to the lower overall sales level, the EBIT will most likely not reach
in the original range of minus EUR 10 to minus EUR 15 million. Taking the
one-off expenses into account an EBIT in the range of minus EUR 22 to minus
EUR 27 million can be expected. The EBIT for 2013 includes approximately
EUR 14.3 million charges for the restructuring of the product line
permanent bonding.

For the fourth quarter 2013, the Company expects a robust order intake in
the range of EUR 30 - EUR 40 million.




Contact:
SUSS MicroTec AG
Franka Schielke
Schleissheimer Strasse 90
85748 Garching, Deutschland
Tel.: +49 (0)89 32007-161
Fax: +49 (0)89 32007-451 
Email: franka.schielke@suss.com


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Language:     English
Company:      SÜSS MicroTec AG
              Schleissheimer Strasse 90
              85748 Garching
              Germany
Phone:        +49 (0)89 32007-161
Fax:          +49 (0)89 32007-451
E-mail:       ir@suss.com
Internet:     www.suss.com
ISIN:         DE000A1K0235
WKN:          A1K023
Listed:       Regulierter Markt in Frankfurt (Prime Standard); Freiverkehr
              in Berlin, Düsseldorf, Hamburg, München, Stuttgart
 
End of Announcement                             DGAP News-Service
 
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